Amendment 001 Q and A.docx
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- Attached to
- Sources Sought Notice for Manual Wedge/Ball Wire Bonder Federal contract opportunity
- Solicitation number
- NIST-SS25-81
About this file
This document is an Amendment 001 Q and A for a Sources Sought Notice (NIST-SS25-81) issued by the National Institute of Standards and Technology (NIST) Physical Measurement Laboratory's Quantum Measurement Division. The notice seeks market research for a versatile benchtop wire bonder used in developing and repairing single-photon devices for optical metrology and quantum networking applications. Key details include requirements for a wire bonder capable of handling gold (Au) and aluminum (Al) wires and ribbons, with wire diameters ranging from 18-75 μm and ribbons up to 25 μm x 250 μm, prioritizing gold materials.
The wire bonder must accommodate various package types including TO56, TO8, and custom devices for chip-to-chip and chip-to-board bonding, with installation planned at NIST's Gaithersburg, MD location. The system needs an adjustable-height heated work holder (2.5-inch diameter), compatible stereo microscope, work illumination system, and tools for setup and maintenance. The equipment will be used in both hermetic and cryogenic environments for single-photon avalanche diodes and superconducting nanowire detectors, with a focus on prototyping and repair capabilities. Vendors are requested to provide comprehensive information about their wire bonding solutions, including specific tools, wire/ribbon materials, and potential pricing.
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Text version
Amendment 001 to Sources Sought Notice# NIST-SS25-81
Question and Answers (Q&As)
August 19, 2025
Q1) The notice specifies the wire bonder must handle Au and Al wires (Au: 18 µm to ≥75 µm diameter) and Au ribbon up to ≥25 µm x 250 µm. Could NIST clarify the specific wire diameter and ribbon size most commonly used or prioritized for this application? This will allow us to recommend the appropriate bonding tools.
Answer: wire ~ 25 um, ribbon ~250 um Q2) Should the response include pricing for the wire and ribbon materials themselves, or only the bonder’s capability to handle them?
Answer: Only the information requested in the SSN is required, but pricing can be included as well.
Q3) For each wire diameter and ribbon size quoted, please confirm the material (validated as Au or Al) to ensure the correct bonding tool is included, as each wire/ribbon size and material requires a specific tool (similar to a needle for a sewing machine).
Answer: Au is prioritized over Al for both ribbon and wire.
Q4) The notice requires an adjustable-height heated work holder with a diameter ≥2.5 inches. Could NIST provide the dimensions (or an average/general range) of the largest package to be used with the wire bonder? This will help us select the most suitable work stage/work holder for NIST’s needs.
Answer: This is a prototyping/repair tool and versatility will be prioritized. Some packages are TO56 (5.6mm), some are TO8 (15mm), some are custom devices that need chip-to-board bonding and can have dimensions on the scale of inches.
Q5) The notice does not specify the place of performance. Could NIST confirm the delivery and installation address for the equipment (e.g., NIST Gaithersburg, MD, or NIST Boulder, CO)? This is necessary to accurately estimate costs for installation and training, as pricing may vary by location.
Answer: Gaithersburg, MD Q6) Could NIST provide additional details about the specific applications or parts involved? For example:
0. Package types (e.g., housings, QFNs, DIPs, TOs, PCBs, or others)?
Answer: TOs, PCBs, chip-to-chip and chip-to-board
0. Chip materials and bond pad materials used in the single-photon detectors?
Answer: Yes Q7) Any further information on the operational environment (e.g., hermetic or cryogenic conditions) would assist in tailoring the system configuration.
Answer: Both hermetic and cryo environments will be used.
Q8) Wire: Although a range of wire diameters and ribbon maximum capability are listed, that the machine should be capable to bond, there isn’t a specific diameter of wire and size of ribbon that needs to be quoted. Can we get that? What is the specific diameter of wire that will be used or at least the most common one you plan to use? The same goes for the ribbon. This will also allow us to include the proper tools to go with that wire and/or ribbon.
Answer: This will be a prototyping and rework system so there is no fixed answer. Common wires are probably 25um Au, ribbons probably 250um Au.
Q9) Do you want us to quote the wire and ribbon? For this we need the above questions answered.
Answer: Yes.
Q10) Please include the material of wire and/or ribbon with each size so that the correct tool can be quoted per size and material. I assume you are familiar with Wire Bonders and Wire Bonding but in case you are not, think of it as a sewing machine. You use thread (the wire) and a needle (the tool) on the sewing machine. Each wire diameter or ribbon thickness and width (thread) and material requires a different tool (needle). We need to know which diameter or size of ribbon to quote the correct tool.
Answer: See above.
Q11) What are the dimensions of the largest package you may use? The specification only says the work stage needs to be at least 2.5in so if we know the parts sizes (can be average or general idea), we can select one specific work stage/work holder.
Answer: This is a prototyping/repair tool and versatility will be prioritized. Some packages are TO56 (5.6mm), some are TO8 (15mm), some are custom devices that need chip-to-board bonding and can have dimensions on the scale of inches.
Q12) We need the address of where the equipment will be installed in order to provide the price. Price varies by location.
Answer: NIST 100 Bureau Drive, Gaithersburg, MD 20899
Q13) Any other specific information about the application/s and part/s that will be used, will be helpful. Things like package types (housings, QFNs, DIPs, TOs, PCBs, other?), chip materials, bond pad materials, etc.
Answer: TOs, PCBs, chip-to-chip and chip-to-board
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