DRAFT-Specifications.pdf

Wafer Stepper DRAFT-Specifications

Background Information:

The Boulder Microfabrication Facility of National Institute of Standards and Technology (NIST) requires an I-line reduction wafer stepper for performing various lithographic processing in the new Precision Measurement Laboratory to be located at NIST’s Boulder campus. This tool will be used in a primarily research environment where we currently fabricate superconducting, magnetic, semiconductor and MEMS devices for many measurement and metrology projects. A primary motivation for this procurement is to meet newer needs to fabricate on multiple wafer sizes in our facility. As such this tool must meet a wide variety of research needs while remaining largely compatible with our existing ASML 5500/100D wafer stepper.

Purpose and objectives of this procurement:

In order to fabricate microelectronic structures for various existing and planned NIST programs, NIST requires the use of a system to perform lithographic patterning of multi-layer electronic structures.

This tool will be sited in the Boulder Microfabrication Facility at the NIST Boulder campus.

The current facility provides microelectronic device fabrication capabilities to roughly 70 researchers at NIST. The breadth of projects and requirements makes large demands on the flexibility of our fabrication tools. NIST fabricates devices utilizing superconductor, magnetic, semiconductor and MEMS technology for a variety of applications that include fundamental physical research, voltage and time metrology, quantum information, astronomy, and homeland defense. In some cases, NIST makes very simple few-level circuits, in other cases NIST fabricates devices with high levels of integration and complexity with challenging yield requirements.

NIST currently operate an an ASML 5500/100D I-line stepper as our primary lithography tool. This 5X reduction tool provides 0.4 um resolution for 3-inch, 100 mm and 150 mm substrates. NIST currently process a wide variety of substrate types. Because of the need for compatibility and the specific requirement to be able to expose patterns at arbitrary angle to the wafer flat, here are only three possible stepper models that would meet NIST’s requirements: ASML PAS5500/80, ASML PAS5500/100 and ASML PAS5500/275. Furthermore, because these models are only available as refurbished systems, NIST requires a refurbished system.

Contractor requirements:

1. Technical Requirements:

1.1. Optics:

The optical system shall achieve a resolution of 0.55 μm or less with a depth of focus of 1.0 μm or more. Preference will be given to systems achieving better (smaller) resolution or larger depth of focus. All resolution performance specifications shall also specify a depth of focus for which the resolution will be achieved. In order to be compatible with our in-house reticle generation capabilities, the system shall utilize either a 5X reduction lens. The system shall exhibit image distortion of less than 100 nm over the entire usable field size.

The optics in this system shall be compatible with operation at an altitude of 1650 m.

1.2. Illumination:

The exposure illumination system shall utilize an I-line Hg lamp source (365 nm). The usable field size shall be no smaller than 20 mm by 20 mm. Preference will be given to systems with larger field sizes. The illumination intensity shall be 400 mW/cm2 or greater.

The illumination intensity shall be maintained with a uniformity of less than 2.0% across the entire usable field size. The system shall provide for control of the illumination dose. The shot-to-shot variation of the exposure dose shall be less than 1.0%.

1.3. Wafer Handling:

The system shall be compatible with processing 100 mm and 150 mm wafers of both opaque (Si, GaAs) and transparent (Quartz, Sapphire) materials. The time required to change the system wafer size and recalibrate shall be 4 hours or less (performed by trained NIST personnel). The system shall be capable of handling wafers between 200 μm and 1000 μm thick. The system shall also be capable of applying an arbitrary rotation angle between to the wafer between finding the wafer flat or notch and performing the fine alignment steps. This is required to enable us to expose patterns with 3-fold symmetry across the wafer while minimizing the number of reticles required.

1.4. Reticle Handling:

The system shall utilize e 6- inch reticles of standard thickness. The system must be compatible with the use of soda-lime glass reticles. The system shall have a reticle library containing at least six reticles. The reticle system must include blading or blanking to allow for selective exposure when utilizing reticles with several smaller field images. We require that reticles for the proposed tool be compatible with existing reticles used in our facility.

1.5. Focus and leveling:

The system shall perform automatic focusing of each exposure (field-by-field focusing).

The system shall perform leveling of each field prior to exposure (field-by-field leveling).

The system shall be able to focus on substrates with thicknesses between 200 μm and 800 μm. The focus system shall provide focus repeatability of less than 0.05 μm and leveling of repeatability of less than 3 μrad.

1.6. Alignment:

The system shall provide an automatic alignment system utilizing fiducial marks on the front side of the wafer. The alignment overlay error for standard wafers must be less than 100 nm (3σ). The system must allow for fine alignment to arbitrarily place fiducial marks on the wafer surface.

1.7. Field Stitching:

The system shall be compatible with field-stitching operation and exhibit field stitching accuracy of better than 100 nm.

1.8. Computer:

The system shall be provided with a computer to perform interface, control, and logging functions. The systems shall provide a modern computer interface which includes the ability to create and edit job files.

2. Non-technical Requirements:

2.1. General

The system shall be a production model, not a prototype or one-of-a-kind system. There shall be at least 10 working units of the proposed make and model operating currently in the field. If the tool is refurbished, it must meet both our technical requirements as well as the original technical specifications for the tool as-manufactured.

2.2. Acceptance Testing:

It is required that the system include vendor-site acceptance testing prior to shipment to our facility. The system shall undergo on-site acceptance testing after delivery to NIST. Both vendor-site and on-site acceptance tests shall include demonstration of optical resolution, alignment overlay, field distortion, illumination power, and illumination uniformity. NIST personnel shall have the option of witnessing the factory acceptance tests. Offeror shall provide sufficient advance notice of the factory acceptance test to allow the scheduling of NIST personnel and travel.

2.3. Installation and Delivery:

The system shall be provided with suitable transportation and installation support. The system shall be provided with suitable documentation to prepare the site for installation.

NIST will prepare the site and required utilities according to the site preparation documentation. The offeror shall schedule and facilitate installation/set-up. Installation, at a minimum, shall include uncrating, and unpacking of all equipment, hardware set-up and one-site acceptance testing.

Delivery shall be FOB DESTINATION (see below) and be completed in accordance with the Contractor’s commercial carrier.

FOB Destination means: The Contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the contract, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The Contractor shall deliver to Department of Commerce, National Institute of Standards and Technology, 325 Broadway, Boulder, CO 80305-3328.

2.4. Warranty:

The system shall be provided with a one-year warranty on all parts and labor from the date of on-site acceptance. Specific exclusions to this warranty are lamps and gradient filters (if required).

2.5. Maintenance and Support:

The system shall be provided with a one-year parts and service maintenance support. This warranty support includes telephone support for normal working hours, and an on-site response in two working days or less when required.

DELIVERABLE SCHEDULE:

NIST requires this wafer stepper by February 1, 2019.