NB687080-19-02545_Spec.pdf

National Institute of Standards and Technology

NB687080-19-02545

STATEMENT OF WORK, detailed specification

Modifications to Cryogenic Probe Station

Proposed Tasks

The following system modifications & performance validation tests will be completed:

1. Assess current wafer temperature using a superconducting thin film on a test chip glued to a 6” wafer as a performance benchmark before making the following modifications. This is a threshold test only to tell if a device is at a temperature <9.2K.

2. Addition of second slide and drive to one axis of the stage translator (to compensate for mechanical load of additional radiation shielding in chamber).

3. Software development and integration to accommodate a second translation driver.

4. System tests and debugs with new stage drive mechanism.

5. Further modifications and improvement to radiation shielding in the chamber.

6. Re-assess wafer temperature (following modifications) using a superconducting thin film deposited on a 6” wafer. This is a coarse test with low-temperature accuracy.

7. Re-assess wafer temperature using a disordered alloy thin film deposited on a 6” wafer.

This is a precision test with high-temperature accuracy.

8. Complete system acceptance test with NIST staff on-site at MicroXact.

9. Prepare system for shipping & delivery to NIST.

10. MicroXact staff visit NIST for installation in Boulder, CO.