II.G.iii. Counterfeit Testing Information.pdf

The Vicor PI3749-00-LGIZ is a high-density, non-isolated Zero-Voltage Switching (ZVS) Buck-

Boost regulator integrated inside a 10mm x 14mm 108-pin LGA System-in-Package (SiP).

Because it is a highly integrated SiP rather than a standard monolithic integrated circuit (IC), it presents unique counterfeit risks—such as internal component harvesting, substrate re-printing, or package refurbishing.

To secure your mission-critical supply chain, you must mandate a tiered risk-mitigation testing protocol combining SAE AS6081 (for independent procurement) and SAE AS6171 (standardized test methods). This protocol must emphasize acoustic microscopy (PEM/PEM-like) and X-ray fluorescence (XRF) to inspect internal dies and solder-sphere compositions without destroying the delicate SiP structure.

1. Component Profile & Specific Vulnerabilities

Attribute Specification / Details

Manufacturer Vicor Corporation

Part Number PI3749-00-LGIZ

Component Type Non-isolated Point-of-Load (POL) Buck-Boost Regulator

Package Style 108-pin Land Grid Array (LGA) System-in-Package (SiP)

Form Factor 10.0mm x 14.0mm x 2.56mm

Key Parameters 16V_{IN} to 34V_{IN} operating range, output power up to 200W

Critical SiP Vulnerabilities to Counterfeiting:

• Multi-Chip Internal Complexity: As a SiP, this device contains an internal controller, power switches, and supporting passive components inside a single molded package.

Standard external visual testing cannot verify if internal components have been swapped for lower-grade silicon.

• LGA Packaging/Solder Pad Refurbishing: Counterfeiters often harvest LGA modules from discarded e-waste, grind down the bottom contacts, re-plate/re-solder them, and blacktop/remark the top casing to sell them as "new."

• Industrial vs. Military Temperature Grade Swapping: The "I" in LGIZ designates an industrial-grade operating temperature range (-40°C to 115°C). A common exploit is remarking lower-performing parts or failing lots to pass them off as high-demand, compliant components.

Level 1: Non-Destructive Screening (100% of Batch)

• External Visual Inspection (EVI) [AS6171/1]:

• Inspect the package surface at 3x to 100x magnification for signs of

"blacktopping" (sanding and recoating), micro-scratching, irregular text font, or misaligned Vicor logos.

• Verify dimensions against the official Vicor datasheet (10.0mm x 14.0mm x

2.56mm) using digital calipers.

• X-Ray Fluorescence (XRF) Spectroscopy [AS6171/3]:

• Analyze the 108 LGA bottom contacts. Verify lead-free or leaded alloy compliance as designated by the "G" (RoHS-compliant/lead-free LGA termination) in the part number. Irregular lead/tin/gold ratios across pads indicate refurbishing.

• Radiological (X-Ray) Inspection [AS6171/5]:

• Perform 2D X-ray imaging on all parts. Compare the internal component layout

(controller, switches, and passives) against a known-good golden unit. Check for missing internal bond wires, misaligned dies, or empty voids.

Level 2: Internal Structure & Solder Verification (Sample Basis)

• Scanning Acoustic Microscopy (C-SAM) [AS6171/6]:

• Highly critical for SiPs. CSAM uses ultrasound to detect internal delamination between the plastic mold compound, the internal substrate, and the internal components. High delamination rates indicate thermal stress from harvesting/desoldering.

• Electrical Parametric & Functional Testing [AS6171/7]:

• Test input threshold limits (16V–34V), output regulation, and startup waveforms on an evaluation board. Run step-load responses to ensure the ZVS buck-boost controller functions up to its 200W rating

Level 3: Destructive Forensic Validation (Minimum 1-3 Units)

• Decapsulation (Acid De-processing) [AS6171/4]:

• Use localized acid etching to open the plastic mold compound. Inspect the exposed internal silicon controller and FET dies for original manufacturer markings, die revision codes, and signs of corrosion or repair.

• Scanning Electron Microscopy (SEM) / EDS [AS6171/11]:

• If anomalies are found, use SEM/EDS to perform high-magnification chemical analysis of internal solder joints and die surfaces to check for microscopic cracks or non-standard metallurgical signatures.

MUST INCLUDE: Date Codes (D/C), Lot Code (L/C), and Country of Origin of the stock that is being quoted. Material must include counterfeit testing before shipment.