Attachment I - Transparent Sputtering System Minimum Requirements Rev 31MAR2023.pdf
PDF 525 KB Posted
- Attached to
- Transparent Electron Sputtering System Federal contract opportunity
- Solicitation number
- N6660423Q0331
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| II.G. Combined Synopsis Solicitation N6660423Q0331.pdf | ||
| Attachment I - Transparent Sputtering System Minimum Requirements.pdf |
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Text version
Transparent Sputtering System Minimum Requirements o Required Targets for Transparent Sputtering Indium Tin Oxide (ITO) and/or Alumina Zinc Oxide (AZO) o Required Sputtering Platform DC Sputtering High vacuum High purity (99.99 %) Argon (Ar) gas during operation o Required Sputtering Minimum Area Deposition chamber no less than (10”x10”) Sputtering area no less than 3” diameter Access to sputtering area no less than 5” diameter o Requirement during Sputtering Process Capable to optimize sputtering uniformity on sample surface Deposition rate adjustment Power adjustment Gas control (mass flow) adjustment Cathode-to-substrate distance adjustment Rotation of substrate stage Displacement of sample stage Automated process during sputtering Repeatability of the sputtering process Graphical User interface o Minimum Warranty of the Sputtering System 12 month warranty
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