SOW.pdf

1. The Screening House shall be capable of screening all devices ii::lentified in Table 1. The quantity of devices to be screened are provided in Table 1. Device screening shall be performed in,accordance with the Screening Procedures delineated in Table 2.

• The Screening House shall assist the government on incoming, visual, XRay, and De encapsulation inspection processes, Counterfeit Assessment, Steps A through D of Table 2. The Screening House shall assist the government in assessing whether devices assessed are suspect and counterfeit in accordance with Department of Defense Instruction NUMBER 4140.67, dated April27, 2013, SUBJECT: DoD Counterfeit Prevention Policy. Devices found to be suspect and counterfeit will be dispositioned as follows:

o Devices determined to be suspect;

At the sole discretion of the government, suspect devices shall either be returned to the vendor for refund or the government may issue a waiver to accept individual devices and the associated risk.

o Devices found to be suspect and potentially Counterfeit will be dispositioned as follows:

Those devices identified as counterfeit will be documented by their respective part number, serial number, lot date code, and returned to the Vendor. The Screening House will return devices to the to the Broker for verification, final disposition, and reporting in accordance with the requirements of Electronic Resellers Association International (ERAI), Independent Distributors of Electronics Association (IDEA), and Department of Defense Instruction;

4140.67, DoD Counterfeit Prevention Policy. It will become the Vendors's responsibility to keep PMA265 informed of the verification processes, final disposition and reporting status.

Parts identified as suspect or counterfeit and returned to the Vendor replacement devices will be provide to the Navy (PMA 265) in sufficient quantities to fulfil the original order and perform destructive de capsulation in accordance with Table (1).

• The Counterfeit Assessment of all devices shall be completed within 30 days after receiving the devices at the Screening House.

2. Those parts approved to proceed with part quality screening the Screening House shall continue with Table 2- Screening Procedure, steps E-G

• The Device Screening House shall leverage the OCM device data sheetto define the specific critical parameters and tolerances to be used for each device. These critical parameters and tolerances will be in accordance with the acceptance criteria identified in Table 2 for electrical testing.

The Screening House shall provide an objective assessment by lot date code of the devices performance/stability. All device test data shall be captured and stored during pre and post bum-in electrical testing. A comparative assessment of each device and compliance with acceptance criteria parameters and tolerances vvill be performed by the Screening House.

The Navy Reliability Group will perform a Delta Drift assessment based on the collected data to selectively pick by serial number and recommend to PMA 265 ABA System Engineering those devices considered acceptable for use in ABA ground and or flight hardware.

Table(l) List of Devices To Be Screened

Description Manufacturer Part Number Qty Number Samples for de- Total of Lot capsulation Quantity

Date (Min/Max)

Codes (Preferred/ Allowed)

SDRAM memory Samsung K4S510832B-TC75 150 1/3 11ot date code 3, 156 2 lot date codes 4, 3 lot date codes 6

PLL Clock Driver Pericom P16C2516A 20 1/1 3 23 Inverter Gate Pericom PI74ST1G04CX 700 1/1 3 703 Quad 10/100 TX Broadcom AC104QF1 20 1/1 3 23 Phyceiver {AMD/AM79C875-K1)

Temp Sensor National LM75CIMM-3 90 1/2 11ot date code 3, 94 Semiconductor 2 lot date codes 4

Duai4BIT Pericom PI3B3244Q 20 1/1 3 23 QuickSwitch ispPAC POWR1208 Lattice ISPPAC-POWR1208- 20 1/1 3 23 supply seq 01TN441 MIPS System Marvell Semi GT64260B-B-o-C133- 20 1/1 3 23 Controller 00 256Kx36b DDrate IBM IBM04368CBLBC-28 20 1/1 3 23

HSTLSRAM

ispGDX spt 160 1/0 Lattice ISPGDX160VA-3B208 20 1/1 3 23

BGA

16Mx8/8Mx16 Numonyx JS28F128J3F75 60 1/1 3 63 Flash ROM

Shottkey Diode Panasonic MA3S132KOL 100 1/2 11ot date code 3, 104 2 lot date codes 4

Line Driver (RS- ON Semi MC26LS30D 75 1/1 3 78 422)

Phy Xcvr Quad Tl Broadcom BCM5464SA11RB 20 1/1 3 23 DC to DC step lntersil EL7562CUZ 20 1/1 3 23 down regulator

CPLD Xilinx XC95144-10PQ1601 20 1/1 3 23 CMOS Flash Mem Spansion S29AL032D70TA1000 so 1/1 3 53

Table (2): Device Screening Procedure

Test Test Percent Acceptance Criteria Comments Procedure Step Screen Verifty 100% Each device shall be serialized to the This will enable the OCM and Serialization of

A unambiguous identification of each device government team to isolate and

Devices within a lot. identify devices for use or non use based on test performance results.

Incoming visual 100% Verify external package dimensions are Though lead scratches and within the OCM data sheet specifications. blacktopping are indicators of Note{s): tampering they are not definitive to

1. Leads can show some evidence of designate part as suspect or scratches but should be noted. counterfeit. Somes OCMs report

2. Any evidence of Blacktopping shall be that reprocess/blacktopping/marking noted. of devices from commercial to industrial use (after successful unscreening) is a standard practice.

XRay 100% Verify all die of a single lot date code shall be uniform and consistent.

Verify lead frame and routing shall be consistent.

c Vertify layer one metal should be consistent, depending on the resolution of the XRay

Decapsulation Minimum of2 Verify OCM die identification is correct.

samples per Verify Metal1 is the same.

lot date code. Verify Die layout is consistent.

For a lot with Verify Lead frame is the same material and a single lot layout. Lead interconnect routing is uniform.

date code 3 Notes:

samples shall 1. Any unique differences between samples be pulled and shall be sufficient to label the lot as suspect.

D decapsulated 2.A second sample shall be pulled to provide additional data for the Navy for basis of lot disposition.

3.A second discrepancy found and the lot shall be labeled as counterfeit.

Electrical Testing Performed The OCM datasheet shall be used for

• Ambie parametric selection of performance parameters that nt testing at provide for evaluation to validate the Temp E high, ambient performance and quality of devices. A

• Low and low minimum of 80% of all critical parameters

Temp temperature shall be evaluated as part of the screening.

• High limits. 100% Parameter limits are to be maintained within

Temp 90% of the OCM specification limits.

Burn-in: Hot F 96hrs@ 125 Following the Hot Soak, the device will Soak no power immediately be returned to the high applied operating temperature Electrical Testing G Performed Conduct High Temperature testing to verify and high, operational performance has not degraded.

ambient and Similar testing will also be conducted at low ambient and low temperature.

temperature limits. 100% "