BPA 24R4401 SOW.pdf
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- Solicitation number
- N0017824R4401
About this file
This document is a Statement of Work (SOW) for a Blanket Purchase Agreement (BPA) to fabricate, assemble, kit, and deliver finished Printed and Bare Circuit Boards (PCBs) and associated hardware to the Naval Surface Warfare Center, Dahlgren Division (NSWCDD).
The SOW outlines the scope of work, including ordering and kitting Bill of Material (BOM) components, fabricating PCBs to government specifications, performing final assembly, and providing Certificates of Conformance. It specifies the applicable industry standards and quality assurance requirements. The government will provide the necessary technical data packages and property. Orders will be competed on a lowest cost, technically acceptable basis. Vendors must be fully owned and operated within the United States, be able to process International Traffic in Arms Regulations (ITAR) data, and comply with NIST SP 800-171 requirements for protecting covered defense information.
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| File | Type | Posted |
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| BPA Synopsis 24R4401.pdf |
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STATEMENT OF WORK (SOW)
C.1 INTRODUCTION
The Weapons Control and Integration Department (H Department), Naval Surface
Warfare Center, Dahlgren Division (NSWCDD) actively supports Naval, Joint, and national needs by providing design and fabrication, rapid prototyping, special acquisition, and technology integration related to circuit board design. The focus of this work will be the fabrication, assembly, and Bill of Material (BOM) procurement on an accelerated delivery schedule. Each request throughout the effort may include any single task or any combination of the tasks specified below.
C.2 SCOPE
The Contractor shall fabricate, assemble, kit, and deliver finished Printed and Bare
Circuit Boards (PCBs) and associated hardware to the Government. All deliveries shall be made in accordance with the specifications within a Government-owned Technical
Data Package (TDP).
C.3 APPLICABLE DOCUMENTS & SPECIFICATIONS
Applicable Specifications are below. Not all of these will be used in all orders. Applicable
Specifications for each order will be called out in the Government provided TDPs provided for bidding on orders.
Applicable to bare printed circuit boards (PCBs):
IPC-2221B Generic Standard on Printed Circuit Board Designs
IPC-6011 Generic Performance Specification for Printed Boards
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-A-600K Acceptability of Printed Boards
IPC-9252B Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-TM-650 Test Methods Manual, No. 2.5.5.7 Characteristic Impedance of Lines on
Printed Boards by TDR
IPC-TM-650 section 2.6.27 , Method 2.6.27, Thermal Stress, Convection Reflow
Assembly Simulation Qualification and Performance Specification for Flexible/Rigid-
Flexible Printed Boards
IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard
Applicable to PCB electronic assemblies:
IPC-J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
IPC-2223E Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-7095C - Design and Assembly Process Implementation for BGAs
IPC-A-610H Acceptability of Electronic Assemblies
IPC-7711C/7721C Rework, Modification, and Repair of Electronic Assemblies
General:
ISO:9000 certification
AS9100 certification
IPC-2221/2222
EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and WiresIPC J-STD-003B Solderability Tests for Printed Boards
IPC J-STD-004B Requirements for Soldering Fluxes
IPC J-STD-005A Requirements for Soldering Pastes
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-
Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-012: Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013: Implementation of Ball Grid Array and Other High Density Technology
IPC J-STD-020F Moisture/Reflow Sensitivity Classification for Non-Hermetic Surface
Mount Devices (SMDS)
IPC J-STD-030A Selection and Application of Board Level Underfill Materials
IPC J-STD-033DHandling, Packing, Shipping and Use of Moisture, Reflow, and Process
Sensitive Devices
C.4 SPECIFIC TASK REQUIREMENTS
The Contractor shall provide the following support as identified in individual BPA calls:
C.4.1 The Contractor shall order and kit required BOM components for completion of a
PCB. If a full or partial turn-key build is requested, the Contractor shall also be responsible for storing components throughout the build process. Additional information will be provided in each order.
C.4.2 The Contractor shall fabricate PCBs to the standards and specifications identified in the Government’s design files.
C.4.3 The Contractor shall perform final assembly of PCB components onto fabricated
PCBs per the standards and specifications identified in the Government’s design files.
C.4.4 The Contractor shall provide a Certificate of Conformance in accordance with
Clause 52.246-15 for all material deliverables.
C.4.5 The Contractor shall manufacture Class II and III boards and/or assemblies in-house. This requirement will be specified at the delivery order level if applicable to the order.
C.5 Government Furnished Information (GFI) & Government Furnished Property
(GFP)
The Government will provide the Contractor access to all needed and relevant document specifications and standards necessary for the performance of each order. In addition, the
Government will transfer files to the Contractor using industry standard Office product formats. For specialized communications, the Government may use Altium Designer and industry-standard Gerber or ODB files. The Government will transfer Government owned property (GFP) to the contractor as necessary for the completion of required tasking. If applicable, GFP will be identified in the order.
C.6 Quality Assurance
The Government reserves the right to periodically solicit additional offers to add new vendors to the calling list. Additionally, vendors will continuously be rated based on performance quality. Vendor acceptance/reject data will be collected from receiving inspection. Calculation percentage for acceptance is equal to total calendar year vendor acceptances divided by total calendar year vendor receipts. Criteria for removal will be if less than a 60% acceptance rate is maintained for a period of more than three (3) purchases or more than one (1) quarter (whichever is greater) before being recommended for removal. The vendor must demonstrate improvement if the acceptance rate is between
60-80%. A qualified performer will maintain an 80% or higher acceptance rate. If the vendor does not demonstrate improvement, the KO will determine if they should be removed from the BPA.
C.7 Security
All work under this BPA will be unclassified. All vendors shall comply with the provisions of the National Institute of Standards and Technology (NIST) Special
Publication (SP) 800-171. Vendors shall have the ability to process and handle
International Trafficking in Arms Regulation (ITAR) designs as necessary. Vendors shall be owned and fully operated within the continental United States (US). This includes maintaining the ability to complete all required tasking within US Facilities.
FEDERAL SUPPLY CODES (FSC):
5962 (Printed Circuit Boards)
5998 (Bare Printed Circuit Board, Electrical and Electronic Assemblies, Cards, and
Associated Hardware)
Clauses
Clause 52.246-15 Certificate of Conformance
(a) When authorized in writing by the cognizant Contract Administration
Office (CAO), the Contractor shall ship with a Certificate of Conformance any supplies for which the contract would otherwise require inspection at source. In no case shall the Government’s right to inspect supplies under the inspection provisions of this contract be prejudiced. Shipments of such supplies will not be made under this contract until use of the Certificate of Conformance has been authorized in writing by the
CAO, or inspection and acceptance have occurred.
(b) The Contractor’s signed certificate shall be attached to or included on the top copy of the inspection or receiving report distributed to the payment office or attached to the
CAO copy when contract administration (Block10 of the DDForm250) is performed by the Defense Contract Administration Services. In addition, a copy of the signed certificate shall also be attached to or entered on copies of the inspection or receiving report accompanying the shipment.
(c) The Government has the right to reject defective supplies or services within a reasonable time after delivery by written notification to the Contractor. The
Contractor shall in such event promptly replace, correct, or repair the rejected supplies or services at the Contractor’s expense.
(d) The certificate shall read as follows:
I certify that on ______ [insert date], the ____ [insert Contractor’s name] furnished the supplies or services called for by Contract No._____ via ____ [Carrier] on ________
[identify the bill of lading or shipping document] in accordance with all applicable requirements. I further certify that the supplies or services are of the quality specified and conform in all respects with the contract requirements, including specifications, drawings, preservation, packaging, packing, marking requirements, and physical item identification (part number), and are in the quantity shown on this or on the attached acceptance document.
Date of Execution: ________________________________ Signature:
_______________________________________ Title:
52.246-17 Warranty of Supplies of a Noncomplex Nature
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