BAA_-_Amendment_2_-_Questions_and_Answers.pdf
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- Solicitation number
- N0002417IWS5A01
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Amendment #2 is posted to address questions submitted by Industry and answered by the Government for BAA N00024-17IWS5A-01.
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Amendment 2 Posting to FBO for Broad Agency Announcement (BAA)
N00024-17-IWS5A-01
Question 1:
The “Desired Capabilities” list found on Page five (5) of the BAA viewgraphs mentions the FLM and OSN components but does not mention the Shunt component.
Does the Shunt component also need to be manufactured? Will the Shunt ICD and Shunt schematics be supplied along with the rest of the documentation?
Will clear improvements to the Shunt function add merit and be scored appropriately the same as advances to the to the FLM and OSN components?
Answer to Question 1:
Improvements to any OAT component functionality is welcomed. The Government will provide any GFI requested if available.
Question 2:
When will the ICDs, circuit schematics, PCB assembly drawings, part lists and mechanical drawings be supplied for the components? Will they be supplied in time to influence the generation of the White Paper? If not, when will these be supplied?
Answer to Question 2:
The GFI mentioned (ICDs, circuit schematics, PCB assembly drawings, parts lists and can mechanical drawings) will not be provided in time to influence the generation of the White Paper. Following review of the White Paper, if a vendor is requested to submit a proposal, any GFI relevant to generation of the proposal would be provided in time to influence development of the proposal.
Question 3:
Is there any perceived disadvantage in providing telemetry components alone without providing thin line modules or hydrophones? Note: component level delivery alone would clearly not prohibit technical support at the module and array levels.
Answer to Question 3:
It is acceptable to provide telemetry components alone without providing thin line modules or hydrophones.
Question 4:
Will the supplied documentation include a module level wiring harness schematic? Would changes be allowed to that drawing if desired enhancements are provided?
Answer to Question 4:
The GFI provided will not include a module level wiring harness schematic.
Question 5:
Will the documentation include reliability requirements and possibly aspects of the telemetry design intended to increase reliability?
Answer to Question 5:
The documentation does not include reliability requirements. However, towed array reliability is a high priority and for White Paper development the author should assume that the telemetry design requirements, at a minimum, meet existing telemetry reliability requirements and that improved reliability is highly desirable.
Question 6:
Is there a plan for a bi-directional tow cable modem and possibly a power splitter? Is that going to be a part of this BAA?
Answer to Question 6:
PEO IWS 5A has a plan for development of a bi-directional cable modem.
However, a vendor is free to propose any electronics in their White Paper.
Question 7:
When exactly will White Papers be awarded to allow Phase I submittals? Will it be at the end of the 18 month White Paper submittal period or as White Papers are periodically evaluated and found to be sufficient to go forward during the 18 month submittal period?
Answer to Question 7:
White Papers will be periodically evaluated and requests for proposals issued subject to available funding.
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