HR001122S0017.pdf

HR001122S0017

Broad Agency Announcement Modular Efficient Laser Technology (MELT)

Microsystems Technology Office

January 28, 2022

Table of Contents

PART I: OVERVIEW INFORMATION

PART II: FULL TEXT OF ANNOUNCEMENT

I. Funding Opportunity Description A. Background B. Program Description C. Program Structure D. Technical Area E. Schedule/Milestones F. Deliverables G. Government Furnished Equipment/Property/Information H. Intellectual Property

II. Award Information A. General Award Information B. Fundamental Research

III. Eligibility Information A. Eligible Applicants

1. Federally Funded Research and Development Centers (FFRDCs) and Government Entities

2. Other Applicants B. Organizational Conflicts of Interest C. Cost Sharing/Matching D. Other Eligibility Criteria

1. Ability to Support Classified Development

2. Collaborative Efforts

IV. Application and Submission Information A. Address to Request Application Package B. Content and Form of Application Submission

1. Abstract Format

2. Full Proposal Format

3. Proprietary Information

4. Security Information

a. Program Security Information

b. Controlled Unclassified Information (CUI)

i. CUI Proposal Markings

ii. CUI Submission Requirements

c. Both Classified and Unclassified Submissions

5. Disclosure of Information and Compliance with Safeguarding Covered Defense

Information Controls

6. Human Subjects Research (HSR)/Animal Use

7. Approved Cost Accounting System Documentation

8. Section 508 of the Rehabilitation Act (29 U.S.C. § 749d)/FAR 39.2

9. Small Business Subcontracting Plan

10. Intellectual Property

a. For Procurement Contracts

b. For All Non-Procurement Contracts

11. Patents

12. System for Award Management (SAM) and Universal Identifier Requirements

13. Funding Restrictions

C. Submission Information

1. Submission Dates and Times

a. Abstract Due Date

b. Full Proposal Date

c. Frequently Asked Questions (FAQ)

2. Abstract Submission Information

3. Proposal Submission Information

a. For Proposers Requesting Technology Investment Agreements

b. For Proposers Requesting Contracts or Other Transaction Agreements

c. Classified Submission Information

4. Other Submission

V. Application Review Information A. Evaluation Criteria

1. Overall Scientific and Technical Merit

2. Potential Contribution and Relevance to the DARPA Mission

3. Cost Realism

B. Review and Selection Process

1. Review Process

2. Handling of Source Selection Information

3. Federal Awardee Performance and Integrity Information (FAPIIS)

VI. Award Administration Information A. Selection Notices

1. Abstracts

2. Proposals

B. Administrative and National Policy Requirements

1. Meeting and Travel Requirements

2. Solicitation Provisions and Award Clauses, Terms and Conditions

3. Controlled Unclassified Information (CUI) and Controlled Technical Information

(CTI) on Non-DoD Information Systems

4. Representations and Certifications

C. Reporting D. Electronic Systems

1. Wide Area Work Flow (WAWF)

2. i-Edison

3. Vault

4. DARPA Embedded Entrepreneur Initiative (EEI)

VII. Agency Contacts VIII. Other Information

A. Proposers Day B. Protesting

ATTACHMENT 1: Cost Volume Proposer Checklist ATTACHMENT 2: Proposal Summary Slide Template ATTACHMENT 3: MELT Controlled Unclassified Information (CUI) Guide ATTACHMENT 4: Controlled Unclassified Information (CUI) Addendum Request Form ATTACHMENT 5: Security Classification Guide and Classified Addendum Request Form

PART I: OVERVIEW INFORMATION

Federal Agency Name: Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO)

Funding Opportunity Title: Modular Efficient Laser Technology (MELT) Announcement Type: Initial Announcement Funding Opportunity Number: HR001122S0017 Catalog of Federal Domestic Assistance Numbers (CFDA): Not applicable.

Dates: (All times listed herein are Eastern Time) o Posting Date: January 28, 2022 o Proposers Day: February 18, 2022 o Request for SCG, CUI and Classified Addendums: Must be made by February 22, 2022 at 5:00pm (ET) o Abstract Due Date: March 7, 2022 o FAQ Submission Deadline: April 18, 2022 o Proposal Due Date: May 2, 2022 o Estimated period of performance start: October 2022

Concise description of the funding opportunity: The DARPA Microsystems Technology Office seeks innovative proposals in the area of high energy laser (HEL) source technology, with the goal to demonstrate the next generation of scalable HEL sources. Because of the nature of the work, proposers will require personnel with collateral SECRET clearances and access to both an accredited facility and secure communications in order to support classified development OR proposers must team with an organization that has personnel with collateral SECRET clearances and access to both an accredited facility and secure communications in order to support classified development.

Anticipated Program Funding Available: $60M over five years Anticipated individual awards: Multiple awards are anticipated Anticipated funding type: 6.3 Types of instruments that may be awarded: Procurement contract or Other

Transaction Agency contact:

o Dr. Thomas Ehrenreich, Program Manager BAA Coordinator: HR001122S0017@darpa.mil

DARPA/MTO

ATTN: HR001122S0017

675 North Randolph Street Arlington, VA 22203-2114 mailto:name@darpa.mil

PART II: FULL TEXT OF ANNOUNCEMENT

I. Funding Opportunity Description

The Defense Advanced Research Projects Agency (DARPA) often selects its research efforts through the Broad Agency Announcement (BAA) process. This BAA is being issued, and any resultant selection will be made, using the procedures under Federal Acquisition Regulation (FAR) 6.102(d)(2) and 35.016 and 2 C.F.R. § 200.203. Any negotiations and/or awards will use procedures under FAR 15.4, Contract Pricing. Proposals received as a result of this BAA shall be evaluated in accordance with evaluation criteria specified herein through a scientific review process.

DARPA BAAs are posted on the SAM website, under the Contract Opportunities (FBO) link, at https://sam.gov/. The following information is for those wishing to respond to the BAA.

The Microsystems Technology Office at DARPA seeks innovative proposals in the area of high energy laser (HEL) sources for directed energy applications. Of particular interest are proposals for the development of a compact, scalable, actively coherently beam combined semiconductor-based (direct diode) HEL source technology with excellent beam quality. Modular Efficient Laser Technology (MELT) aims to exploit technologies such as novel semiconductor fabrication techniques, coherent beam combining, photonic integration, and three-dimensional (3D) integration and packaging. Proposed research should investigate innovative approaches that enable revolutionary advances in devices. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

Today’s Laser Weapon Systems (LWS) are not scalable across the full mission space due to the use of multiple beam-combined high-power fiber amplifiers as the HEL sources and large complex optical subsystems needed to condition and project the laser beam. Alternatively, coherent beam combined tiled array HEL sources are scalable by eliminating the need for these large subsystems.

Coherently beam combined tiled arrays offer a path to better HEL sources because of (1) the ability to generate and project the LWS beam directly without bulk optics, (2) the intrinsic scalability of a tiled array with no inherent limits, (3) the ability to perform non-mechanical beam steering for beam jitter corrections, and (4) the ability to apply complex phase corrections to compensate for atmospheric disturbances.

A Controlled Unclassified Information (CUI) addendum, collateral SECRET classified addendum, and collateral SECRET Security Classification Guide (SCG) has been created to provide additional details on the MELT program. Please see BAA Attachment 4 “Controlled Unclassified Information (CUI) Addendum Request Form” and BAA Attachment 5 “Security Classification Guide and Classified Addendum Request Form” for instructions on receiving these additional documents. Because of the nature of the work, proposers will require personnel with collateral SECRET clearances and access to both an accredited facility and secure communications in order to support classified development OR proposers must team with an organization that has personnel with collateral SECRET clearances and access to both an accredited facility and secure communications in order to support classified development.

A. Background

The proliferation of small, low-cost Unmanned Aircraft Systems (UAS) on the battlefield requires a layered defense that includes low-cost Directed Energy. The deep magazines of Laser Weapon Systems (LWS) are ideally suited to counter swarms of hostile UAS. A variety of other compelling Service LWS applications have been identified, particularly since LWS have the potential to achieve very low operational cost assuming low production costs can be achieved. The market for counter UAS and other applications encompasses HEL sources with a broad range of power levels from a few kilowatts to megawatts. Today, however, each new LWS demands a high level of design and engineering.

B. Program Description

MELT seeks to develop a laser tile as the building block for compact, scalable, panelized HEL sources. It is envisioned that the laser tiles will be integrated into planar arrays for scalable HEL sources with comparable or better performance than current HEL sources.

By program end, MELT seeks to demonstrate a 3x3 panelized array of laser tiles with excellent beam quality (BQ) as a scalable HEL source.

The mass, volume, and size goals for the laser tiles and panelized array of laser tiles include the semiconductor amplifier emitters, optics, phase sensing and control, power delivery/conversion, thermal dissipation, computing, external connections, inter-tile electrical, coolant, and data connections. Excluded from the mass, volume, and size goals are the seed laser, chiller, backplane for array of tiles, and electrical and coolant leads leading to the array of tiles.

There are at least two different laser diode technologies that can generate high optical power with excellent beam quality: (1) vertical-cavity surface-emitting laser (VCSEL) diodes, and (2) edge emitting laser diodes. Both technologies are limited to watt-class output power per emitter and therefore a large number of emitters need to be combined to realize a high energy laser weapon system. The challenge in adapting these emitter technologies to directed energy applications is maintaining excellent beam quality while scaling power, which requires coherent beam combining (CBC) of the multiple individual emitters.

Single-mode VCSEL devices (500 mW) and two-dimensional (2D) arrays of single-mode VCSEL devices (100 watt-class CW power) have been grown in III-V wafers to form laser oscillators, consisting of an active region with a relatively low-gain section sandwiched between highly-reflective Bragg mirrors. Since 2D VCSEL arrays can be fabricated and tested at the wafer level, they can be manufactured cheaply, with an efficient use of semiconductor material. However, demonstrations of passive CBC of VCSEL laser oscillators configured in a common, coupled cavity geometry have shown the combining efficiency suffers severe degradation when element counts become larger than ~10. Furthermore, demonstrations using VCSEL 2D arrays have been limited to low power with poor prospects for scalability.

Arrays of single-mode edge emitters have been demonstrated at 100 watt-class continuous wave (CW) power from a monolithic 2D stack. By forming a waveguide in the wafer plane, edge emitters can achieve long interaction lengths for high gain as an optical amplifier. Operating edge-emitter devices as amplifiers with a common master oscillator has been shown to maintain high combining efficiency and high output power with element counts greater than 200. However, the semiconductor materials used to generate these amplifiers suffer from high optical loss and are poorly suited for direct photonic integration. Packaging edge-emitting devices into one-dimensional arrays is also labor intensive, with poor scaling to 2D.

To realize HEL power levels and excellent beam quality, the MELT program envisions combining the favorable attributes of both semiconductor laser technologies. Each MELT tile will contain a 2D array of laser emitters whose phase can be continuously sensed and controlled to achieve coherent beam combination. For scalable output power, several to several hundred of these tiles may be arranged as a panelized, gimbal-mounted laser weapon source that produces a directly usable output beam. The arbitrary phase control necessary to implement CBC on the panelized array can be leveraged for fine pointing and wavefront correction.

In order to realize such compact HEL sources without reduction in performance, proposed solutions must address the following Technical Challenges:

Technical Challenge #1 (TC1): Achieving a dense planar tiled array of amplifiers with uniform spacing and emission normal to the 2D surface. Achieving this challenge will require the development of new fabrication methods to assemble semiconductor amplifier emitters in 2D planar arrays. Estimates indicate that an opto-mechanical alignment tolerance with very high spatial precision will be needed to meet the goal of a planar 2D array and coherent beam combining goals. Emission from individual emitters must have excellent beam quality with Power Conversion Efficiency (PCE) comparable to fiber lasers, and the output from a large number of emitters in a dense 2D planar array must be beam-combined. Of particular interest in MELT will be architectures for which the PCE of the entire array approaches that achieved in state-of-the-art (SoA) watt-class single mode semiconductor amplifier type emitters.

Technical Challenge #2a (TC2a): Realizing a scalable phase sensing architecture for a panelized HEL source. The phase of individual semiconductor amplifiers must be measured and controlled to enable active coherent beam combining. The current state-of-the-art (SoA) architecture for coherent beam combining uses external bulk optics and detectors to estimate the phase of each optical amplifier. The configuration of the bulk optics, and the number of detectors required, depend on the control algorithm used (See TC2b, below); however, the specific volume of all current phase sensing methods scale non-linearly with the number of optical amplifiers.

Achieving a scalable phase sensing architecture will require the development of new methods to perform phase sensing on the tile without external bulk optics.1

1 Roberts et al., "Coherent Beam Combining Using an Internally Sensed Optical Phased Array of Frequency-Offset Phase Locked Lasers" Photonics 7, no. 4: 118. https://doi.org/10.3390/photonics7040118, (2020) https://doi.org/10.3390/photonics7040118

Technical Challenge #2b (TC2b): Realizing a scalable phase control architecture for a panelized HEL source. Achieving a scalable phase control architecture capable of an RMS phase error less than λ/20 at the objective closed loop bandwidth will require the development of new phase control methodologies. SoA architectures have been demonstrated with a root mean square (RMS) phase error <λ/20, sufficient to obtain a coherent HEL beam, but are limited in scalability and bandwidth.2 Optical heterodyne detection (OHD) requires an optical reference and a detector for each channel, limiting its scalability. Locking of Optical Coherence via Single detector Electronic frequency Tagging (LOCSET) uses a single detector, however, each channel is “tagged” with a unique frequency making it infeasible to expand to high channel counts. Nested stochastic parallel gradient descent (SPGD) uses a detector for each inner loop with an additional detector for final global combination, and may have insufficient bandwidth for high channel (N) counts since the bandwidth scales as N-1.

Technical Challenge #3 (TC3): Realizing a compact scalable cooling solution to remove the anticipated thermal load from a panelized HEL source. SoA cooling techniques for high-performance digital processors have demonstrated removal of significant thermal load by adding spacers to circulate coolants.3 But using spacers will reduce the achievable density of a planar 2D array and therefore negatively affect the fill factor and associated BQ. Aperture-scale cooling of the MELT array without tremendous size and weight growth will require developing new techniques for cooling beyond those currently used in high-performance digital systems that can be integrated with the MELT tiles.

C. Program Structure

The MELT program will be a 60-month program, divided into three phases, with a 24-month Phase 1 (base), 24-month Phase 2 (option), and 12-month Phase 3 (option). It is expected that fewer performers may be funded to participate in Phase 2 and Phase 3 of the program. Options may be exercised, at the Government’s sole discretion, based on technical progress measured against the metrics and milestones defined in the BAA and funding availability. Each phase has a specific technical goal.

All proposals in response to this BAA must address all three phases. Partial submissions will be considered nonconforming and will not be evaluated.

2 Shay et al., “Self-Synchronous and Self-Referenced Coherent Beam Combination for Large Optical Arrays” Selected Topics in Quantum Electronics, IEEE Journal of. 13. 480 – 486, https://doi.org/10.1109/JSTQE.2007.897173, (2007) 3 Bar-Cohen et al., "The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics" IEEE Trans.

Components, Packaging and Manufacturing Technology, https://doi.org/10.1109/TCPMT.2021.3111114, (2021) https://doi.org/10.1109/JSTQE.2007.897173

D. Technical Area

The goal of this program is to develop a mass-producible, low Size, Weight, and Power (SWaP), scalable laser source. This will require the development of a new type of HEL source, as current HEL technologies are very complex, have high part counts, and require skilled labor to manufacture and assemble. In addition, due to the use of brightness converters, the potential for further SWaP reductions of current HEL technologies beyond SoA levels is very limited. The MELT program is thus interested only in semiconductor diode-based laser technologies that do not include optically-pumped brightness converters.

To maintain the SWAP, high beam quality, and scalability goals, beam combination is expected to be performed coherently, rather than spectrally or incoherently. Active coherent beam combination allows for advanced features which passive coherent, spectral, and incoherent combining cannot perform, such as non-mechanical beam steering and atmospheric turbulence compensation.4, 5, 6 Therefore, passive coherent, spectral, and incoherent beam combination are not within the scope of this solicitation.

The MELT program envisions the building block of the scalable laser technology to be a single tile, which is composed of many laser emitters. These tiles shall be four-side-abuttable, which allows an array of tiles to be created in any planar configuration (e.g., MxN). Necessary support functions (e.g., power delivery/conversion, thermal dissipation, computing, phase sensing and control, and external connections) should be integrated in the tile and contained within the tile footprint to allow scalability. While any backplane used for mechanical integration of the 3x3 panelized array is not included in the mass and volume metrics, it is desirable for the backplane to be of minimal thickness. Electrical and coolant leads leading to the tiled array will also not be included in these metrics; however, inter-tile electrical, coolant and data connections are included.

The actual size of a tile will be the result of trades made by the performer. Larger size allows for fewer piece parts and a greater footprint for support functions but comes at the cost of manufacturing yield for both the semiconductor wafer and micro-optics. The number of emitters on each tile is not defined by the program; however, DARPA is particularly interested in solutions that meet the program goals for power density, beam quality, and non-mechanical beam steering.

A smaller emitter pitch allows for maintaining higher beam quality across a larger steering angle, but presents challenges for packaging and thermal management. Performers may find that low power emitters of higher beam quality and smaller pitch may provide a better solution than fewer emitters operating at or near the power limit.

The need for support functions to reside within the footprint of each tile may require performers to exploit manufacturing and packaging techniques which take advantage of the third dimension

4 Atmospheric turbulence compensation is outside the scope of the current solicitation; however, higher active coherent beam combining bandwidths lend to more efficient atmospheric compensation which would be important for potential follow-on research.

5 K. J. Creedon et al., "High efficiency coherent beam combining of semiconductor optical amplifiers," Opt. Lett.

37, 5006-5008, https://doi.org/10.1364/OL.37.005006 (2012) 6 S. M. Redmond et al., "Active coherent beam combining of diode lasers," Opt. Lett. 36, 999-1001, https://doi.org/10.1364/OL.36.000999 (2011)

(i.e., through the side opposite of the emitting surface).7 Novel methods of waste heat dissipation will also need to be developed, as emitter spacing and tile packaging will prevent diffusion in the plane of the tiles. Convective dissipation from the emitting surface will prove to be insufficient for the required run times and is not within the scope of this solicitation. Forced convection across the emitting surface is also not within the scope of this solicitation. The assumed operating environment should be room temperature (20oC to 25oC) in a laboratory.

Each tile will need optics to collimate the beams from each emitter. The design and manufacturing process for these optics are not defined by the program; however, program mass and volume metrics may necessitate microlens arrays or similar architectures. It is desired that the manufacturing of these optics adheres to the mass producibility and low- cost goals of the program.

It is also desired that the prescription used for a single tile be the same for all other tiles. Solutions which create unique prescriptions for each individual tile are not within the scope of this solicitation.

The MELT program will have a single Technical Area (TA) divided into three phases as follows:

Phase 1 (base - 24 months) focuses on developing the fundamental emitter technologies (TC1), phase sensing and phase control architectures (TC2), and heterogenous integration approaches that include compact, scalable power distribution and cooling solutions (TC3). The scope of the Phase 1 demonstration applies to a planar array of emitters, but it is not necessary to demonstrate functionality on a full laser tile-sized array; however, traceability to a fully-integrated laser tile must be shown. See the key metrics and supplemental metrics, including associated footnotes, listed in the CUI and classified addendums for further details. The performer is expected to demonstrate critical functionalities, such as coherent beam combination and non-mechanical beam steering, in a laboratory. Near field and far field images will be taken by the performer to test for equal divergence and co-directionality of the emitters in the sub-tile array. The spot sizes in the far field will determine if the divergences are equal; the separation between spots will determine if the launch angles are parallel. The Government Team, as described in Section E, will witness the performer conducted tests to validate performance against the program key metrics.

Phase 2 (option 1 - 24 months) will focus on developing the fully 3D integrated laser tile with semiconductor amplifier array (TC1), phase sensing and control (TC2), and power and thermal management (TC3). Successful completion of Phase 2 will be demonstrations of the key metrics across the fully-integrated laser tile, including a full array beam combination test to show traceability to integration in a panelized array with minimal degradation in beam quality. The Government Team will witness the performer conducted tests to validate performance against the program key metrics listed in the CUI and classified addendums.

Phase 3 (option 2 - 12 months) will focus on demonstrating the laser tiles operated in a panelized configuration to show traceability to a scalable HEL source. Specifically, successful completion of Phase 3 will be a 3x3 tiled array meeting the specific mass, specific volume, output power, beam quality and steerability metrics for the panelized HEL. The Government Team will witness the

7 S. J. Ben Yoo et al., “Heterogeneous 2D/3D photonic integrated microsystems,” Microsystems & Nanoengineering 2, 16030; https://doi.org/10.1038/micronano.2016.30 (2016) performer conducted tests to validate performance against the program key metrics, as listed in the CUI and classified addendums, at the end of Phase 3.

The program key metrics and supplemental metrics are listed in the CUI and classified addendums.

The metrics were identified as the primary characteristics that will enable MELT to be a scalable HEL source. Phase 1 metrics are chosen to promote a dense planar amplifier array solution that is capable of coherent beam combination and non-mechanical beam steering. Phase 2 metrics are designed to yield a fully integrated compact laser tile solution with performance equivalent to today’s SoA HEL sources. The goal of Phase 3 is to demonstrate a 3x3 panelized array of laser tiles to show traceability to a scalable HEL source.

E. Schedule/Milestones

The detailed MELT program schedule is presented in Figure 1, and a list of the MELT program events is shown in Table 1. MELT is a 60-month program with an anticipated start in October 2022. A program kickoff meeting will be held at the beginning of each phase to present the technical approach, discuss technical and programmatic items of concern, and to interact with the government team. Monthly technical interchange meetings, design reviews, and quarterly program reviews will also be held, in accordance with the schedule below, to discuss planned work, specifics of the technical approach, technical progress, and any technical or programmatic items of concern. These meetings will be used to communicate technical progress toward the metrics throughout each phase. Technical progress towards the program metrics and traceability to the next phase program metrics are the major deciding factor for continuation into subsequent phases and will be monitored through these meetings and occasional site visits by the DARPA program manager and other members of the Government Team.

The three phases of the program are structured to retire the major risks in achieving the program goals as detailed in the CUI and classified addendums. Proposals must clearly explain how the proposed approaches overcome or obviate the risks in each phase of the program.

A planned Government Team, consisting of John Hopkins University – Applied Physics Lab (JHU-APL), the Office of Naval Research (ONR), Air Force Research Laboratory (AFRL), and the U.S. Army will execute in parallel to the performer(s) throughout the five-year program. The Government Team will evaluate performer(s) progress through program review meetings, design reviews, on-site performer visits, and technical reports throughout each phase. Further, the Government Team will witness the performer conducted demonstrations at the end of each phase to validate performance against the program key metrics. The performer will provide the Government Team with the raw performance data from each demonstration for independent verification and validation. During Phase 1, the Government Team will identify off-ramps for MELT and conduct application studies. In Phase 2 and Phase 3, the Government Team will conduct risk reduction activities, mission analysis, and architecture studies. The panelized array deliverable will be made available to the transition partner(s) and Service Labs after the completion of the MELT program.

Figure 1. MELT Program Schedule

Table 1. MELT Program Event Schedule Date* Event Location**

Phase 1 Month 1 Phase 1 Kick-off Meeting DARPA Month 3 Program Review Meeting Performer site Month 6 Planar Array Design Review Performer site Month 9 Program Review Meeting Virtual Month 12 Program Review Meeting DARPA Month 15 Program Review Meeting Performer site Month 18 Laser Tile Design Review Performer site Month 21 Program Review Meeting Virtual Month 22 Planar Array Demonstration Performer site Month 23 End of Phase 1 Program Review Meeting DARPA

Phase 2 Month 25 Phase 2 Kick-off Meeting DARPA Month 27 Program Review Meeting Performer site Month 30 Panelized HEL Design Review Performer site Month 33 Program Review Meeting Virtual Month 36 Program Review Meeting DARPA Month 39 Program Review Meeting Performer site Month 42 Program Review Meeting Performer site

Month 45 Program Review Meeting Virtual

Month 46 Laser Tile Demonstration Performer site Month 47 End of Phase 2 Program Review Meeting DARPA

Phase 3 Month 49 Phase 3 Kick-off Meeting DARPA Month 51 Program Review Meeting Performer site Month 54 Program Review Meeting Virtual Month 57 Program Review Meeting DARPA Month 58 Panelized HEL Demonstration Performer site Month 59 End of Phase 3 Program Review Meeting DARPA

* Dates are after contract award **In person meetings may be changed to virtual meetings at the discretion of the DARPA PM.

F. Deliverables

The MELT program deliverables are listed in Table 2 and detailed below.

Table 2. MELT Program Deliverables Date* Deliverable

Phase 1 Month 1 Kick-off meeting package and presentation Month 2 Science and Technology Protection Implementation Plan Month 6 Planar array design review package and presentation

Months 3, 6, 9, 12, 15, 18, 21 Quarterly program review reports Months 3, 9, 12, 15, 21 Quarterly program review presentations

Month 18 Laser tile design review package and presentation Month 22 Planar array demonstration, test plan, and test results Month 23 End of phase program review report Month 23 End of phase program review presentation

Months 1, 2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 17, 19, 20, 22 Monthly technical reports

Months 1, 2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 17, 19, 20, 22 Monthly technical status update overview slides

Months 1-24 Monthly financial reports Month 24 Phase 1 Final Report and critical design package

Phase 2 Month 25 Kick-off meeting package and presentation Month 26 Science and Technology Protection Implementation Plan

Month 30 Panelized HEL design review package, presentation, and manufacturing plan

Months 27, 33, 36, 39, 42, 45 Quarterly program review reports Months 27, 33, 36, 39, 42, 45 Quarterly program review presentations

Month 46 Laser tile demonstration, test plan, and test results Month 47 End of phase program review report Month 47 End of phase program review presentation

Months 25, 26, 28, 29, 30, 31, 32, 34, 35, 37, 38, 40, 41, 43, 44, 46 Monthly technical reports

Months 25, 26, 28, 29, 30, 31, 32, 34, 35, 37, 38, 40, 41, 43, 44, 46 Monthly technical status update overview slides

Months 25-48 Monthly financial reports Month 48 Phase 2 Final Report

Month 48 Laser tile(s) and associated firmware, software, and critical design package delivery

Phase 3 Month 49 Kick-off meeting package and presentation Month 50 Science and Technology Protection Implementation Plan

Months 51, 54, 57 Quarterly program review reports Months 51, 54, 57 Quarterly program review presentations

Month 58 3x3 panelized HEL demonstration, test plan, and test results

Table 2. MELT Program Deliverables - continued Date* Deliverable

Month 59 End of phase program review report Month 59 End of phase program review presentation

Months 49, 50, 52, 53, 55, 56, 58 Monthly technical reports Months 49, 50, 52, 53, 55, 56, 58 Monthly technical status update overview slides

Months 49-60 Monthly financial reports Month 60 Phase 3 Final Report

Month 60 3x3 panelized HEL(s) and associated firmware, software, and critical design package delivery

* Dates are after contract award

1. Program Kickoff Meetings

Program kickoff meetings will be held at the beginning of each phase in the form of conferences (reference Table 1. Program Event Schedule). These meetings will typically be 1-2 days each at DARPA. Performers will provide their technical approach in the form of a presentation, technical and programmatic items of concern (risk registers), detailed spend plan, and master schedule.

2. Science and Technology Protection Implementation Plan

Performers will prepare and submit a Science and Technology Protection Implementation Plan detailing how the performer will protect program data at the appropriate level at the beginning of each program phase.

3. Program Review Meetings

Program review meetings will be held quarterly in the form of conferences. These meetings will typically be 1-2 days each at the performer’s site. Performers will provide their technical and programmatic briefs in the form of presentations and will present program progress and financial summaries in individual program review sessions with the MELT Program Manager and the Government team. Prior to each program review meeting, performers will provide to the Government a written report covering technical results, how well the component(s) met, exceeded, or fell short of specified program metrics (as detailed in the CUI and classified addendums), discuss any problems/failures encountered and describe mitigation efforts, and risk registers.

4. Design Reviews

Performers are expected to deliver design review packages for each of the three design reviews, as listed in Table 1 and Table 2, to include details of design, modeling, and simulation. Performers shall prepare and submit design review packages two weeks prior to the scheduled design review.

Design Reviews will be held in the form of conferences. These meetings will typically be two days each at the performer’s site. Performers will provide their technical design briefs in the form of presentations for the MELT Program Manager and the Government team.

Laser tile manufacturability is critical to enabling follow-on development and demonstration of panelized array HEL sources. Performers are expected to develop a detailed manufacturing plan which describes the path to production and delivery, within one year, of an adequate numbers of laser tiles to build and maintain a conceptual 50 kW panelized array HEL source. The manufacturing plan shall be delivered with the design review package for the Panelized Array Design Review in Phase 2.

5. Demonstrations

The performers shall work with the Government team to demonstrate – at the performer site – the planar array of emitters in Phase 1, the fully integrated laser tile in Phase 2, and the 3x3 panelized array of laser tiles in Phase 3, with the associated test plans and test results to show compliance with the program metrics in accordance with the schedule above. The performers should anticipate the need to provide assistance and supplementary information specific to the individual laser tile and panelized HEL to enable independent evaluation and validation by the Government team.

6. End of Phase Program Reviews

End-of-phase program review meetings with individual performers will be held approximately six weeks before the end of each program phase. Prior to individual end-of-phase meetings, performers will provide the Government a high-level written report covering:

a. Technical results for the current phase

b. Charts of the current phase technical results as measured by the program metrics and compared to the current phase milestones (detailed in the CUI and classified addendums), with explanations of why the results did or did not meet the milestones, and possible remediation strategies.

7. Monthly Technical Reports and Status Updates

Performers will provide technical status updates (with overview slides) during monthly technical interchange meetings (via teleconference) with the Government team, and comprehensive technical reports and master schedule shall be submitted on a monthly basis. Additional technical presentations are due prior to each subsequently scheduled program event, such as program manager site visits.

8. Monthly Financial Reports

For each calendar month of the program, the performer will submit a financial report. The financial report shall describe resources expended, resources available, any deviation from planned expenditures, and any potential financial issues requiring the attention of the Government team.

This report shall be provided no later than ten (10) days after the end of the month covered by the report.

9. Final Reports

At the end of each phase, the performer will submit a detailed final report for the phase. The report shall cover the performer’s effort in a comprehensive text document. The document shall cover the details of the following:

a. Technical results for the current phase

b. Charts of the current phase technical results as measured by the program metrics and compared to the current phase milestones (specified in this BAA), with explanations of why the results did or did not meet the milestones, and possible remediation strategies.

c. List of publications, copyrights, and patent applications

10. Prototype Delivery

At the conclusion of Phase 2, delivery of three (3) laser tiles and the associated firmware, software, and critical design package shall be delivered to the Government. The delivery of the three (3) laser tiles shall include the associated supporting equipment needed to enable turnkey operation of the laser tile.

At the conclusion of Phase 3, delivery of two (2) 3x3 panelized array of laser tiles and the associated critical design package shall be delivered to the Government. The delivery of the two

(2) 3x3 panelized array of laser tiles shall include the associated supporting equipment needed to enable turnkey operation of the 3x3 array.

11. Other Deliverables

Other proposed deliverables specific to the objectives of the individual efforts may include registered reports, experimental protocols, publications, data management plan, intermediate and final versions of software libraries, firmware and software source code, mask layouts and other physical design data, and APIs, including documentation and user manuals, and/or a comprehensive assemblage of design documents, models, modeling data and results, and model validation data. Performers also are expected to provide out-of-cycle technical reports and briefing materials at the request of the DARPA Program Manager.

G. Government Furnished Equipment/Property/Information

The MELT program does not anticipate providing Government Furnished Equipment, Property, or Information to the performers, but will consider the proposed use if clearly identified and justified in the proposal.

H. Intellectual Property

It is expected that the technology developed under MELT will have the following minimum data rights:

It is desired that all noncommercial software (including source code), software documentation, and technical data generated by the program be provided as deliverables to the Government with no less than Government Purpose Rights (GPR) unless Unlimited Rights are otherwise appropriate, and all hardware designs and documentation with a minimum of GPR.

Any proposed use of prior intellectual property (patents, proprietary information, etc.) must be clearly identified in the proposal. If there are any intellectual property claims to future results, prototypes, or deliverables, proposer must explain how these claims may limit Government use of the technology developed under the MELT program or development of derivative technologies.

See Section IV.B.10, “Intellectual Property”, and Section IV.B.2, “Section III. Other Transaction Request”, if applicable. If there are no intellectual property claims, this should be stated.

II. Award Information

A. General Award Information

Multiple awards are anticipated. The amount of resources made available under this BAA will depend on the quality of the proposals received and the availability of funds.

The Government reserves the right to select for negotiation all, some, one, or none of the proposals received in response to this solicitation, and to make awards without discussions with proposers.

The Government also reserves the right to conduct discussions if it is later determined to be necessary. If warranted, portions of resulting awards may be segregated into pre-priced options.

Additionally, DARPA reserves the right to accept proposals in their entirety or to select only portions of proposals for award. In the event that DARPA desires to award only portions of a proposal, negotiations may be opened with that proposer. The Government reserves the right to fund proposals in phases with options for continued work at the end of one or more of the phases, as applicable.

Awards under this BAA will be made to proposers on the basis of the evaluation criteria listed below (see section labeled “Application Review Information,” Sec. V.), and program balance to provide overall value to the Government. The Government reserves the right to request any additional, necessary documentation once it makes the award instrument determination. Such additional information may include but is not limited to Representations and Certifications (see Section VI.B.4., “Representations and Certifications”). The Government reserves the right to remove proposers from award consideration should the parties fail to reach agreement on award terms, conditions and cost/price within a reasonable time or the proposer fails to timely provide requested additional information. Proposals identified for negotiation may result in a procurement contract or other transaction, depending upon the nature of the work proposed, the required degree of interaction between parties, whether or not the research is classified as Fundamental Research, and other factors.

Proposers looking for innovative, commercial-like contractual arrangements are encouraged to consider requesting Other Transactions. To understand the flexibility and options associated with Other Transactions, consult http://www.darpa.mil/work-with-us/contract-management#OtherTransactions.

In accordance with 10 U.S.C. § 2371b(f), the Government may award a follow-on production contract or Other Transaction (OT) for any OT awarded under this solicitation if: (1) that participant in the OT, or a recognized successor in interest to the OT, successfully completed the entire prototype project provided for in the OT, as modified; and (2) the OT provides for the award of a follow-on production contract or OT to the participant, or a recognized successor in interest to the OT.

In all cases, the Government contracting officer shall have sole discretion to select award instrument type, regardless of instrument type proposed, and to negotiate all instrument terms and conditions with selectees. DARPA will apply publication or other restrictions, as necessary, if it determines that the research resulting from the proposed effort will present a high likelihood of disclosing performance characteristics of military systems or manufacturing technologies that are unique and critical to defense. Any award resulting from such a determination will include a requirement for DARPA permission before publishing any information or results on the program.

For more information on publication restrictions, see the section below on Fundamental Research.

B. Fundamental Research

It is DoD policy that the publication of products of fundamental research will remain unrestricted to the maximum extent possible. National Security Decision Directive (NSDD) 189 defines fundamental research as follows:

‘Fundamental research’ means basic and applied research in science and engineering, the results of which ordinarily are published and shared broadly within the scientific community, as distinguished from proprietary research and from industrial development, design, production, and product utilization, the results of which ordinarily are restricted for proprietary or national security reasons.

As of the date of publication of this solicitation, the Government expects that program goals as described herein either cannot be met by proposers intending to perform fundamental research or the proposed research is anticipated to present a high likelihood of disclosing performance characteristics of military systems or manufacturing technologies that are unique and critical to defense. Therefore, the Government anticipates restrictions on the resultant research that will require the awardee to seek DARPA permission before publishing any information or results relative to the program.

Proposers should indicate in their proposal whether they believe the scope of the research included in their proposal is fundamental or not. While proposers should clearly explain the intended results of their research, the Government shall have sole discretion to determine whether the proposed research shall be considered fundamental and to select the award instrument type. Appropriate language will be included in resultant awards for non-fundamental research to prescribe publication requirements and other restrictions, as appropriate. This language can be found at http://www.darpa.mil/work-with-us/additional-baa.

http://www.darpa.mil/work-with-us/contract-management#OtherTransactions http://www.darpa.mil/work-with-us/contract-management#OtherTransactions http://www.darpa.mil/work-with-us/additional-baa

For certain research projects, it may be possible that although the research to be performed by a potential awardee is non-fundamental research, its proposed subawardee’s effort may be fundamental research. It is also possible that the research performed by a potential awardee is fundamental research while its proposed subawardee’s effort may be non-fundamental research.

In all cases, it is the potential awardee’s responsibility to explain in its proposal which proposed efforts are fundamental research and why the proposed efforts should be considered fundamental research.

III. Eligibility Information

A. Eligible Applicants

All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA.

1. Federally Funded Research and Development Centers (FFRDCs) and Government Entities

a) FFRDCs

FFRDCs are subject to applicable direct competition limitations and cannot propose to this solicitation in any capacity unless they meet the following conditions. (1) FFRDCs must clearly demonstrate that the proposed work is not otherwise available from the private sector. (2) FFRDCs must provide a letter, on official letterhead from their sponsoring organization, that (a) cites the specific authority establishing their eligibility to propose to Government solicitations and compete with industry, and (b) certifies the FFRDC’s compliance with the associated FFRDC sponsor agreement’s terms and conditions. These conditions are a requirement for FFRDCs proposing to be awardees or subawardees.

b) Government Entities

Government Entities (e.g., Government/National laboratories, military educational institutions, etc.) are subject to applicable direct competition limitations. Government Entities must clearly demonstrate that the work is not otherwise available from the private sector and provide written documentation citing the specific statutory authority and contractual authority, if relevant, establishing their ability to propose to Government solicitations and compete with industry. This information is required for Government Entities proposing to be awardees or subawardees.

c) Authority and Eligibility

At the present time, DARPA does not consider 15 U.S.C. § 3710a to be sufficient legal authority to show eligibility. While 10 U.S.C.§ 2539b may be the appropriate statutory starting point for some entities, specific supporting regulatory guidance, together with evidence of agency approval, will still be required to fully establish eligibility. DARPA will consider FFRDC and Government Entity eligibility submissions on a case-by-case basis; however, the burden to prove eligibility for all team members rests solely with the proposer.

2. Other Applicants

Non-U.S. organizations and/or individuals may participate to the extent that such participants comply with any necessary nondisclosure agreements, security regulations, export control laws, and other governing statutes applicable under the circumstances.

B. Organizational Conflicts of Interest

FAR 9.5 Requirements In accordance with FAR 9.5, proposers are required to identify and disclose all facts relevant to potential OCIs involving the proposer’s organization and any proposed team member (subawardee, consultant). Under this Section, the proposer is responsible for providing this disclosure with each proposal submitted to the solicitation. The disclosure must include the proposer’s, and as applicable, proposed team member’s OCI mitigation plan. The OCI mitigation plan must include a description of the actions the proposer has taken, or intends to take, to prevent the existence of conflicting roles that might bias the proposer’s judgment and to prevent the proposer from having unfair competitive advantage. The OCI mitigation plan will specifically discuss the disclosed OCI in the context of each of the OCI limitations outlined in FAR 9.505-1 through FAR 9.505-4.

Agency Supplemental OCI Policy In addition, DARPA has a supplemental OCI policy that prohibits contractors/performers from concurrently providing Scientific Engineering Technical Assistance (SETA), Advisory and Assistance Services (A&AS) or similar support services and being a…