24-4G6 PWS C1 High Temp Addition.doc

DOC document 47 KB Posted

Attached to
C1 Horizontal Furnace Federal contract opportunity
Solicitation number
HQ072724QNR07
Issued by
Defense Microelectronics Activity

About this file

This document is a Performance Work Statement (PWS) for the C1 High Temp Addition to the existing Thermco Systems (Tetreon Technologies) HTR-5100 furnace at the ARMS Foundry. The purpose of this effort is to upgrade the furnace equipment with new and supported hardware and software to grow oxide films at high temperatures up to 1300°C for silicon carbide (SiC) wafer manufacturing.

The key requirements include: providing the addition and installation, ensuring only genuine hardware and software are used, correcting any hardware or software problems, making the tool operational and functional per vendor specifications, providing user manuals and warranties, and delivering the tool to the DMEA premises. The tool must be capable of atmospheric processing, batch processing up to 100 product wafers, and meeting uptime, MTTR, and MTBF requirements. The related federal contract opportunity is Solicitation Number HQ072724QNR07 for the C1 Horizontal Furnace, issued by the Defense Microelectronics Activity.

View the file

Other files for this federal contract opportunity

Other files attached to C1 Horizontal Furnace, newest first.
File Type Posted
Combined Synopsis and Solicitation HQ072724QNR07.doc DOC document
JA 24-4G6.pdf PDF

On GovTribe

Work with this file on GovTribe

  • Download the original file
  • Contacts named in this file
  • Similar government files
  • Ask GovTribe AI about this file

Text version

PERFORMANCE WORK STATEMENT (PWS)

DMEA 24-4G6

17 June 2024 Project Engineer: James St Charles, DMEA/MEBA, (916) 817-0403 Contract Officer Representative: Tracy Lu, DMEA/MEBA, (916) 542-3381

1.0 SCOPE:

1.1 TITLE: C1 High Temp Addition

1.2 APPLICABILITY: ARMS Foundry Silicon Carbide (SiC)

1.4 PURPOSE: The C1 High Temp addition to the existing Thermco Systems (Tetreon Technologies) HTR-5100 is a critical requirement for SiC wafer manufacturing to grow oxide films at high temperature. This effort also includes upgrading our unsupported furnace equipment with new and supported hardware and software.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.1 GOVERNMENT DOCUMENTS:

Document No.
Date
Title

ALIM 100714

ARMS Cleanroom Protocol

2.2 GOVERNMENT FURNISHED EQUIPMENT:

None

2.3 GOVERNMENT FURNISHED FACILITIES/ACCESS:

Facility/Access
Date
DMEA 4234 54th Street, McClellan, CA 95652-2100
Upon installation

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 The contractor shall provide the addition and include all items required for installation (e.g. hardware, software, and other documentation) as listed in the purchase package.

3.1.2 The contractor shall verify that only genuine hardware and software shall be provided with no non-OEM or counterfeit items substituted. A written guarantee and corresponding paperwork shall be provided to DMEA at contract award.

3.1.3 The contractor shall provide full system installation including connection to system facilities and software/hardware validation.

3.1.4 The contractor shall correct or fix any hardware or software problems encountered during initial installation and testing.

3.1.5 The contractor shall ensure the tool is operational and functional in accordance to the vendor’s tool specifications

3.1.6 The contractor shall provide the software user manuals (softcopy and/or hardcopy)

3.1.7 The contractor shall provide DMEA with the tool warranty and support clause

3.1.8 The contractor shall provide DMEA with User Licenses and License Agreement

3.1.9 The contractor shall provide installation service, maintenance support, upgrades, replacement guarantees, a valid software license and full warranty.

3.1.10 The contractor shall be aware that no refurbished parts will be acceptable

3.1.11 The contractor shall provide shipment to the DMEA premises for all parts

3.2 TRAVEL: The vendor will travel to DMEA to perform installation, testing of the tool, and training onsite. The vendor performing installation, testing, and training onsite shall provide proof of US citizenship. The vendor is required to check in with DMEA Security to obtain appropriate badge upon arrival.

3.3 PROGRAM MANAGEMENT: None

3.4 TASK REQUIREMENTS:

3.4.1 TOOL REQUIREMENT: The tool shall be capable of performing high temperature atmospheric oxidation for SiC manufacturing at high temperatures of up to 1300 °C. The HTR-5100 furnace bank (C1-C4) should also be able to communicate and process with the latest Thermco PCMux software.

3.4.1.1 The tool shall be capable of operating at maximum temperature of 1300 °C.

3.4.1.2 The tool shall be capable of continuous operation at temperatures ≤ 1300 °C.

3.4.1.4 The tool shall be capable of processing batches of ≥ 100 product wafers per run.

3.4.1.5 The tool shall be capable of atmospheric processing.

3.4.1.6 The tool modifications shall fit in existing HTR-5100 Tube 1 position “C1” Furnace Bank 3.4.1.7 The tool assembly shall be a Thermco brand full D2 loader with head and door, digital servo motor for smooth loading without any stalls or stutter.

3.4.1.8 The tool shall utilize an isolation transformer with Zero cross SCR firing for +/- 0.5°C accuracy, and 0.25°C repeatability to set point vs profile TC at steady state.

3.4.1.9 The tool shall utilize an 8.25 mm APM heavy gauge 1300 °C max element type B for longevity.

3.4.2.0 The tool shall incorporate a TLC front loading Thermco 24 VDC bubbler for Chlorine clean and heavy metal mitigation.

3.4.2.1 The tool shall have an external high flow Thermco H2 torch with full dual safety interlocks as well as a 780C H2 interlock board.

3.4.2.2 The tool shall have a Thermco TMX tube computer for C1 and all required Thermco boards for C1.

3.4.2.3 The tool shall have an uptime > 93%.

3.4.2.4 The tool shall have a MTTR (mean time to repair) of < 8 hours.

3.4.2.5 The tool shall have a MTBF (mean time between failures) of > 500 hours.

3.4.2.6 The tool should qualify with <50 adders for particle measurements post high-temp oxidation processing.

3.4.2.7 The tool should qualify with +/-10% within wafer oxide uniformity film thickness post high-temp oxidation processing.

3.5 PROGRAM SUMMARY: None

4.0 POINTS OF CONTACT:

DMEA/ MEBA / PE: James St. Charles Address: 4234 54th Street

McClellan, CA 95652-2100

Voice: (916) 817-0403 E-Mail: james.t.stcharles2.civ@mail.mil

DMEA/ MEBA / COR: Tracy Lu Address: 4234 54th Street

McClellan, CA 95652-2100

Voice: (916) 542-3381 E-Mail: wan.c.lu.civ@mail.mil

SOW PWS Template 2021 June.doc

File details come from the government source that posted it. Updated .