JA_19-9H8__Redacted.pdf

DMEA# 19-42

Defense Microelectronics Activity 4234 54th Street, McClellan, CA 95652

SOW 19-9H8

Sole Source Justification

1. Agency and Contracting Activity:

Office of Secretary of Defense, Defense Microelectronics Activity (DMEA).

2. Nature/Description of Action:

Acquisition of electronic design automation (EDA) software tools for the design and verification of advance packaging with flip chip capability. The value of this procurement is estimated to be

, which includes software licenses, training, consulting, and software maintenance.

3. Description of Supplies/Services:

SiP layout XL is a CAD software tool that provides a layout environment for advanced flip chip package design. Sigrity provided solution is a collection of CAD software tools that enables flip chip package power and signal integrity analysis. Key components of the Sigrity solution are Allegro Sigrity SI Base, XtractIM, PowerSI, PowerSI 3D, PowerDC, System SI SLA, SystemSI PBA and SPEED2000. All of the software tools are manufactured by Cadence Design Systems.

Online web based and instructor led training of Cadence software is required for users of the software. In addition, software maintenance will be needed beyond the software warranty period for software updates and support.

4. Authority Cited:

FAR 13.501(a)(1)(ii) Simplified Procedures for Certain Commercial Items; 41 U.S.C. 1901.

5. Reason for Authority Cited:

DMEA is implementing a integrated circuit (IC) process that utilizes flip-chip capability.

This advanced capability makes the design of semiconductor packages much more complex. The SiP layout XL and Sigrity solution software tools will support the required flip-chip technology package/substrate design capability at DMEA.

The IC design cycle requires compatibility between each step. DMEA uses Cadence Design environment for IC design flow. In addition, DMEA partners utilizing the flip-environment. The SiP layout XL and Sigrity solution are tools that operate within the Cadence Design System EDA environment.

Use of a tool that cannot operate within the Cadence Design s EDA environment implementation of the IC process.

Cadence Design Systems does not sell its packaging design software tools directly to consumers.

Instead, only EMA Design Automation, Inc. is authorized to sell packaging design software designed by Cadence Design Systems.

6. Efforts to Obtain Competition: The solicitation, accompanied by this approved justification, will be posted on www.fbo.gov. The Contracting Officer will consider quotations submitted by responsible sources in accordance with FAR 5.207(c)(16)(ii).

7. Fair and Reasonable Cost Determination: I hereby determine that the anticipated cost to the Government for this contract action will be fair and reasonable. The contracting officer will perform price analysis on the quote in accordance with FAR 13.106-3(a)(2).

8. Market Research:

A sources sought was posted to FBO.gov. No businesses responded to the notice.

DMEA Engineers consulted with who created and utilize the flip chip IC process. stated that they use Cadence Design software tools for the design and verification of advance packaging with flip chip capability.

9. Other Facts: None

10. Listing of Sources:

EMA Design Automation, Inc.

225 Tech Park Dr Rochester, NY, 14623-2444

11. Actions to Increase Competition: None

12. Contracting Officer Certification: I certify that this justification is accurate and complete to

13. OTHER APPROVALS

Operations Contracting Branch Chief

Acquisition Policy & Analysis Branch Chief

Office of Counsel

Chief of Contracting/Competition Advocate