SOW_15-5D3_.pdf

SOW 15-5D3

STATEMENT OF WORK (SOW)

DMEA 15-5D3

2 April 2015 Project Engineer/Contract Officer Representative: Brandon Smith, DMEA/MECA, (916) 231-1617

1.0 SCOPE:

1.1 TITLE: High Resolution X-ray Microscope

1.2 APPLICABILITY: DMEA, Reverse Engineering, Packaging Assembly & Substrates Lab

1.3 BACKGROUND: DMEA requires the capability to non-destructively inspect (NDI)/image Integrated Circuits (ICs) on silicon substrate for the purposes of failure analysis, reverse engineering and counterfeit detection. It has been shown that this can be achieved using a high resolution X-ray Microscope with an X-ray source that produces X-ray photons at the correct energy to image ICs. DMEA will begin with a commercial Xradia 800 Synchrotron model microscope platform and optimize the X-ray source for the specific NDI needs at DMEA.

1.4 PURPOSE: The objective of this task is to acquire a high resolution, custom Xradia 800 Synchrotron High- Energy Nano-Tomography X-ray Microscope System from Carl Zeiss (with no X-ray source), and subsequently install a high-brightness 9keV X-ray source from a different contractor that is better suited for the NDI of samples of interest (e.g., ICs).

NOTE: The information described within paragraphs 1.0 through 1.4 above is given for information only and has no contractual effect.

2.0 REFERENCED DOCUMENTS: NONE

2.1 GOVERNMENT FURNISHED ACCESS:

Access Date Defense Microelectronics Activity (IAW section 3.3.7 below) Upon Contract Award

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 RESERVED

3.2 TECHNICAL INTERCHANGE MEETINGS (TIMs): The contractor shall conduct TIMs as necessary in the performance of this task. The TIM with the contractor shall be scheduled when there is need for technical interchange between the government and the contractor. The content of the meeting can include the discussion of any information that has impact upon the task activities, including documentation contents or format. (A001)

3.3 TASK REQUIREMENTS: Provide a 3D X-ray Microscope System (without the X-ray source) capable of NDI/imaging of IC features 52nm in size or less.

3.3.1 Hardware Specifications: The contractor shall provide and install the custom Xradia 800 Synchrotron High- Energy Nano-Tomography X-ray Microscope System (Xradia 800) at DMEA. The Xradia 800 shall meet the specifications and characteristics listed in Appendix A. The detailed X-ray source specifications will be provided to the contractor upon award of the X-ray source procurement contract.

3.3.1.1 Hardware Performance: The contractor shall demonstrate the performance, to the required specifications, of a representative X-ray microscope. The contractor shall then qualify the performance of any modified or customized subsystems to that of the corresponding subsystems from the representative X-ray microscope.

3.3.1.2 X-Ray Source Enclosure: The contractor shall modify The X-ray enclosure on the Xradia 800 to safely accommodate the X-ray source specified under paragraph 3.3.1. Summarized specifications of this X-ray source are provided in Appendix B.

3.3.1.3 X-ray Source Installation: The contractor shall provide a safety interlock interface for the X-ray microscope system. (Note: The original equipment manufacturer (OEM) of the X-ray source and/or DMEA will be responsible for the installation of the provided X-ray source, to include the X-ray source safety interlock.)

3.3.2 Software Specifications: The contractor shall provide software licenses and install software for the control and operation of the equipment listed in paragraph 3.3.1. The provided licenses shall include, at a minimum, one (1) online (i.e., intended to be operated from the system control equipment directly) license and one (1) offline (i.e., intended to be operated from a location separate from and not connected to the equipment) license for the latest control and operation software for the system described in paragraph 3.3.1. The software provided will, at a minimum, perform the tasks listed in Appendix C. The contractor shall provide maintenance, upgrades, and support for the delivered software during the period described in paragraph 3.3.3.

3.3.3 Warranty: The contractor shall provide on-site hardware and software warranties of the items provided under paragraphs 3.3.1 and 3.3.2 for a period of at least 1 year from final acceptance of the equipment. The contractor shall provide maintenance and remedial and/or emergency support for the equipment provided in paragraph 3.3.1, including the repair of any and all defects that affect the proper operation of the covered equipment. The contractor shall provide a list of all items required, for which DMEA will be responsible (e.g., consumables and expendables), during the warranty period and all optional warranty and/or maintenance periods. This list shall include expected lifetimes and estimated costs for all listed items. (A002)

3.3.4 Delivery and Setup: The contractor shall deliver, install, and verify correct operation of the items described in paragraphs 3.3.1 and 3.3.2 in accordance with the security provisions stated in paragraph 3.3.7. The contractor shall provide support with regard to the items delivered under paragraphs 3.3.1 and 3.3.2 for the integration of the x-ray source during the period described in paragraph 3.3.3.

3.3.4.1 Installation Requirements: At least 90 days prior to delivery, the contractor shall notify DMEA of all pertinent facility, environmental, and safety considerations and requirements to accommodate setup and for storage of the X-ray microscope system during the period between delivery and setup. (A003)

3.3.4.2 Acceptance Testing: The contractor shall perform testing necessary to qualify the installation, and to validate the performance to the required specifications for the items described in paragraphs 3.3.1 and 3.3.2. The contractor shall provide the proposed acceptance test plan for approval by DMEA. (A004)

3.3.5 Documentation: The contractor shall provide off-the-shelf user manuals and training manuals in the form of one (1) hard copy or one (1) digital copy of each set of manuals for each item described in paragraphs 3.3.1 and

3.3.2. (A005)

3.3.6 Training: The contractor shall provide on-site familiarization training for the items delivered under paragraphs 3.3.1 and 3.3.2. This training shall accommodate at least six (6) DMEA personnel as trainees for at least three (3) working days. This training shall occur at DMEA and in accordance with DMEA visitor access policies and the security provisions stated in paragraph 3.3.7.

3.3.7 Security: The contractor shall provide advance notification prior to conducting any on-site inspection, installation or maintenance. A forty-eight (48) hour minimum notice during normal business hours shall be given.

All installation and maintenance work shall be performed by US citizens unless an exception is granted, in writing, by DMEA; after hours and/or weekend work may be required for excepted personnel. Prior to being allowed entry, contractor personnel shall provide proof of citizenship in accordance with the DMEA visitor approval process in effect at the time the visit is requested. During periods of exceptionally heightened security, additional advance notice and background investigations of contractor personnel may be required prior to gaining entry into DMEA.

4.0 POINTS OF CONTACT:

DMEA/MECA Project Engineer:

Brandon Smith Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916)231-1617 E-Mail: brandon.smith@dmea.osd.mil

Appendix A

Specification Required Value X-ray Tomography Resolution ≤ 52nm

Imaging Mode X-ray absorption contrast Sample Accommodation (X dimension [width]) ≥ 6mm Sample Accommodation (Y dimension [length]) ≥ 6mm

Sample Accommodation (Z dimension [depth/thickness]; normal to beam]) ≥ 50um

Sample Stage Motorized, 4-axis (x,y,z, yaw); ≤100nm repeatability Optics Stage(s) Motorized, 3-axis (x,y,z); ≤100nm repeatability

Environmental, Health & Safety Compliant with all regulations for use in California, USA

Image Acquisition Automatic Computed Tomography (CT) Microscope Control (General) Automated/Software Controlled

Microscope Control (User) Interface for external, user-defined routines; real-time interface

Sample Mounting/Alignment Repeatable, kinematic coupling of sample interface;

integrated optical alignment system

Appendix B

Specification Required Value Estimated Maximum Value Peak X-ray Energy 9-11 keV 11 keV

Photons Generated at Peak Intensity (brightness)

≥ 1x10^10 photons/sec(mrad2)mm2(0.1%BW))

1x10^12 photons/sec(mrad2)mm2(0.1%BW))

Power 0-400W 400W Max Current 10mA 10mA

Emission Stability +/- 1% N/A Position Stability +/- 1um N/A

Appendix C

Required Software Tasks:

1. Control all motorized stages, detectors, and other components necessary for the acquisition of x-ray images remotely

2. Allow for manual control of the sample and optics stages by the operator

3. Acquire and display x-ray images of ICs

4. Automatically perform CT of ICs

5. Reconstruct and render acquired images in 3D

6. Provide a real-time interface for external, user-defined routines

7. Execute on the Windows 7 Operating System (OS)