JCP- Distibution D-Drawing 352468-000.pdf

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SIZE

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DIM ARE IN INCHES

±.5°

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R11062-RC JUN 98

& PER ANSI Y14.5

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AF RELEASE

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ANSIVER

ASSEMBLY PROCEDURES, ALR-56M

BACKPLANE, PN: 333336-002

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INITAL RELEASE

JOSEPH TAMER

BRANDON DEAL

JOSEPH TAMER

DAVID GUS SPURLIN

DGS

DAVID GUS SPURLIN

10/29/18

DAVID GUS SPURLIN

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PURPOSE: This procedure is to cover the actions and flow of assembling a backplane for the ALR-56M part number 333336-002.

SCOPE: The 569 EMXS/MXDPA production lines shall adhere to the provisions of these instructions.

GENERAL INFORMATION: This instruction set is specific to 569 EMXS/MXDPA.

Table of Contents

1.0 Overview

2.0 Assembly

3.0 Pre-waveflow soldering inspection

4.0 Waveflow soldering

5.0 Post-waveflow cleaning

6.0 Wiring side assembly

7.0 Solder inspection and touch-up

8.0 Epoxy beads and additional assembly

9.0 ESS

10.0 Testing

11.0 Coating and final assembly

1.0 Overview

This operation is to provide instructions on the assembly procedure of the printed wiring board 352468-000 to circuit card assembly 333336-002 final status.

Cautions/Warnings

Observe all safety practices and required precautions as outlined in local shop bio-surveys and SDS reports as required.

This assembly is not an ESD item, however ESD bags are to be used to protect the CCA.

Use pin protectors while not in work to ensure that compliant pins are not damaged or deformed.

Do not stack assemblies directly on top of one another as this could result in damage to parts.

Note

The steps in this procedure are recommendations on the order that this is to occur. There are chances that these steps can be performed out of sequence as long as it is all done.

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2.0 Assembly

Perform visual inspection for any debris and any damage prior to assembly.

Insert spring pins for A1-A5.

Press fit compliant pins for A1-A5 using pin holder, 265910-5, on an arbor press and fixture 200315051. Press odd position pins then rotate backing fixture 180° and press even position pins to allow space to press pins perpendicular to board and in alignment with each other.

Trim solder side of compliant pins to 31 mils ±4 mils by any means to have straight cut.

3.0 Pre-Waveflow Soldering Inspection

Look over all compliant pins for damage and ensure all rows of pins are perpendicular to the board and in alignment with each other.

4.0 Waveflow Soldering

Apply masking, Wondermask 2205-8SQ, Humiseal HUM TS300-BT or equivalent, batch number block, date code block and A1-A5 card guide pin holes.

Apply teflon tape to ground points on bottom side of board.

Allow time for masking compound to cure before any more operations are performed.

Prior to waveflow moisture needs to be removed by baking for 2 hours at 232°F.

Ensure Delta 5 or equivalent waveflow machine is too temperature and in position according to parameters following.

Continued on next sheet.

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4.0 Waveflow Soldering continued.

Fill tanks with Alpha 3355-VF water soluble flux.

Delta 5 waveflow settings:

Conveyor speed 62 cm/min Width 201.5 mm Flux amount 6 mg/cm^2 Flux tank pressure 170 mbar Nozzle speed 15 cm/sec Zone 1 temp 325 °C Zone 2 temp 130 °C Zone 3 temp 145 °C SmartWave 1100 rpm MainWave 320 rpm MainWave pushup 20 rpm Solderpot height 9 mm Solder temp 260 °C Select X temp 350 °C Run circuit boards through machine with enough space between to be able to safely retrieve boards when they come out of machine.

Allow circuit boards time to rest and return to room temperature before any further steps.

5.0 Post Waveflow Cleaning

Start cleaning circuit boards within 1 hour of soldering to avoid any additional contamination issues.

Use dishwasher or tank cleaning system with DI water or high quality conditioned water to clean boards of flux residue.

Peel/remove any Wondermask residue that is remaining on circuit board.

Blow dry the board with nitrogen to remove any water and debris.

Bake circuit board at 90 °C for 2-2.25 hours to remove any moisture inside the board.

Contact local engineering support for any contamination issues that arise.

6.0 Wiring Side Assembly

Press fit Mill-max sockets for J1-J4 using arbor press and fixture 200315051.

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6.0 Wiring Side Assembly

Install connectors J5, J6, and J7 on wiring side of board.

Press all threaded spacers into circuit board next to J1, J2, J3, J4, J6 and J7.

Hand solder all wiring side components.

7.0 Solder Inspection and Touch-up

Follow standard shop practice T.O.s and training for soldering standards.

Inspect Mill-max sockets for floating, damage, cold solder joints, bridges and correct as necessary.

Inspect compliant pins for alignment, damage, cold joints, bridges and correct as necessary.

Inspect connectors for cold joints, bridges and correct as necessary.

Perform any other touch-up as observed.

Clean any residue that appears from touch-up operations.

Route to machine shop for rivet installation of keying blocks and then install keying block hardware.

8.0 Epoxy Beads and Additional Assembly

Install epoxy beads evenly across all compliant pins so that all pins are covered and laying against the circuit board.

bake epoxy beads at 260°F for 1 hour to cure beads in place against circuit board.

Use Stycast 2651 to seal any spaces on compliant pins that are not covered by epoxy beads.

Allow time for board to cool to room temperature before proceeding to next step.

Install A1-A5 guide pins using arbor press.

Install spacer blocks on wiring side of board.

Install wiring harness per drawing 333235-000.

9.0 Environmental Stress Screening

To ensure soldering operations were correct 1 circuit board from every waveflow soldering batch should be run through an Environmental Stress Screening (ESS) chamber prior to testing.

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9.0 Environmental Stress Screening continued

ESS settings:

5 thermal cycles with no greater than 10 °C/min ramp rate 25 °C start temperature -55 °C low temperature with 20 minute dwell time 85 °C high temperature with 20 minute dwell time 25 °C rest temperature with 15 minute dwell Final vibration at 8 grms with 10 minute dwell Allow temperature to return to room temperature before removing circuit board.

Perform visual inspection of all components and solder joints for any defects.

10.0 Testing

Testing of circuit board assembly will be conducted on FACT station per local shop process order.

Test interface will occur using mount 201641588 and test cables part number 201641618.

Operator will use CPIN 81B-ALR56M/FACT/BP-U001-00A that is issued from software control library.

Follow system operator manual 7012-B to operate test station and run test on assembly.

Any failures that occur need a second inspection to verify.

If there are further failures that the shop technician is not able to check then contact local engineering support for assistance.

If there are no failures in the circuit board then proceed to coating and final assembly operations.

11.0 Coating and Final Assembly

Seal Mill-max sockets with Humiseal 1B31 by curing at 178°F for 30 minutes.

Mask Mill-max, connectors, and wiring harness.

Mask compliant pins and keying pins.

Mask ground points in 6 places, 8 spacer blocks, 11 spacers and 2 places of positioning holes.

Use Humiseal 1B73 spray to coat board in 3 steps with 30 minutes of drying time between coats.

Bake cure Humiseal spray at 169°F for 2 hours.

Unmask circuit board from all coating steps.

Tie wiring harness using wax lacing cord to mounting hardware in 3 places indicated on drawing.

Continued on next sheet.

Install IUID label on top side of circuit board with applicable serial number.

Perform final inspection per local process order.

Ensure pin protectors are placed on circuit card assembly before bag and tag for turn-in.

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11.0 Coating and Final Assembly continued

Install IUID label on top side of circuit board with applicable serial number.

Perform final inspection per local process order.

Ensure pin protectors are placed on circuit card assembly before bag and tag for turn-in.

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