Technical_Specs.pdf

BGA Rework System Requirements

BGA Rework System must be able to install and remove electronic circuit chips of types, QFN, Flip Chip, BGA, microBGA/CSP and other surface mount devices.

BGA Rework System must include infrared (IR) heating (upper and lower), optics, computer with software that runs the system.

BGA Rework System must use infrared (IR) as its heating source.

BGA Rework System must be able to run on 120 VAC, 50/60 Hz (2000 Watts maximum)

Dimensions must be equal or less than: 36” H x 36" W x 36" D

Weight of system: 110 lbs or less

Top-side Heater with Aperture System: Medium/Long Wave IR Emitter, 500 Watts.

Bottom-side Preheater with Adjustable Working Height: Medium/Long wave quartz IR emitter, 1000

Watts.

BGA Rework System must have an observation camera to view the entire reflow process, including the exact moment of solder melt, and is mounted on a movable extension arm

BGA Rework System must have a Non-Contact IR Thermal Sensor with Alignment Laser: Closed-loop, non-contact IR Temperature Sensor monitors and controls the ramp-up and temperature of the component, by controlling the top heater's output throughout heating process

BGA Rework System must have Thermocouple Inputs

BGA Rework System camera and optics must have an alignment system: Vision Overlay System (VOS) with high resolution color camera, frame grabber, dichroic beam-splitting prism, independently controlled

LED illumination for component and PCB, up to 72x zoom capability. Motorized Optics Housing:

Automatically controlled, retractable optics housing protects Vision Overlay System from dirt and contamination

BGA Rework System must use a single axis operation: all operations, including component pick-up, alignment, placement, reflow & cooling, are completed in a single axis.

BGA Rework System must have an active cooling fan.

BGA Rework System must have precision placement capability.

BGA Rework System must have a temperature setting range: Top Heater - 100˚ to 400˚ C; Bottom Heater -

100˚ to 221˚ C (212˚ - 430˚ F)

BGA Rework System must have a precision PCB holder: advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges.

BGA Rework System must be able to operate on a maximum PCB size of 12" x 12"

BGA Rework System must be able to operate on a maximum component size of 2.5" x 2.5” and a minimum component size of 1mm Square.

BGA Rework System Software must be intuitive and user-friendly.

BGA Rework System Computer operating system must be Windows 7 Pro or later. The computer must be a Core i5 CPU or later, have a 500 GB HDD or larger, have a minimum of 4 GB DDR3-1600 Memory, a

Video Capture Card, a mouse and a keyboard

BGA Rework System Video Monitor must be no smaller than a 19" Wide Screen LCD.

BGA Rework System computer must have video inputs: 2 Composite (B/C) and 1 “S” Video

BGA Rework System must have nitrogen capability: nitrogen soldering and cooling ready

BGA Rework System must have a component nest.

BGA Rework System must include an automated flux dipping tray.

BGA Rework System must include a Vacuum Wand for handling SMDs

BGA Rework System must have magnetic under board PCB support

BGA Rework System must have supporting accessories.