Custom Ethernet Switch - Drawing.pdf

APPLICATION MF REVISIONS

NEXT ASSY USED ON REV DESCRIPTION DATE APPROVAL

7104340 MK 5 MOD 0/1 C CN-N 20143 INC NOR C/008 JM 120121 J. MULLEN

110706 W. DINEEN

D INC NOR D/009 111129 J. BIBEL

E INC NOR 010 and NOR E/011 131029 W. DINEEN

DISTRIBUTION STATEMENT A: APPROVED FOR PUBLIC RELEASE; DISTRIBUTION IS UNLIMITED.

VENDOR ITEM DRAWING

THIS IS A SERIALIZATION CONTROLLED ITEM

ESD NOTE: WARNING: THIS ASSEMBLY IS

CONSIDERED ELECTROSTATIC

SENSITIVE AND REQUIRES ESD

HANDLING/PACKAGING PER MIL-STD-

1686, CLASS I OR ANSI/ESD S20.20-1999.

E E E REV

20 19 18 SH

E E E C C C C C C C C C C C E E E REV REV STATUS

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 SH OF SHEETS

CONTRACT NO. N00024-98-C-5363 DEPARTMENT OF THE NAVY

INTERPRET DRAWING IAW

MIL-STD-100

Lockheed Martin Corporation

2323 Eastern Boulevard Baltimore, Md. 21220-4207

NAVAL SEA SYSTEMS COMMAND

WASHINGTON, D.C. 20362

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN INCHES

ETHERNET SWITCH MODULE

AFTER PLATING APPROVED DATE

PREPARED O. WAGNER 131025

CHECKED

ENGINEER O. WAGNER 131025

.X --- K.GOEL M.ALBERDING F.FINLEY

6/21/05 6/2/05 050520

.XX .030 APPROVED FOR NAVSEA SIZE CAGE CODE DWG NO. REV

.XXX .010

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DEPARTMENT OF THE NAVY SIZE CAGE CODE DWG NO. REV

NAVAL SEA SYSTEMS COMMAND

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TABLE OF CONTENTS

SECTION TITLE PAGE

1. SCOPE

1.1 Scope

2. APPLICABLE DOCUMENTS

2.1 General

2.2 Government Documents

2.3 Non-Government Publications

3. REQUIREMENTS

3.1 Item Definition

3.1.1 General Requirements

3.1.2 Interface Definition

3.1.2.1 Mechanical

3.1.2.2 Electrical

3.1.2.2.1 Connectors/Pinouts

3.1.2.2.2 Power Input

3.1.2.2.3 Uplink Control

3.1.2.2.4 Link Indicators

3.1.2.2.5 Switch Control

3.1.2.2.5.1 Communication

3.1.2.2.5.1.1 Menu

3.1.2.2.5.1.2 Port Setup

3.1.2.2.5.1.3 Port Mirroring

3.1.2.2.5.1.4 Port Status

3.1.2.2.5.1.5 Restore Default

3.1.2.2.5.1.6 Reset Device

3.1.2.2.6 Lead Free Compatibility

3.1.2.2.7 Software or Firmware Updates

3.1.2.2.8 Selectable Jumpers or Programming Pins

3.2 Characteristics

3.2.1 Performance

3.2.1.1 Steady State

3.2.1.2 Boot Up Time

3.2.1.3 Local Area Network Ports

3.2.1.3.1 Mirror Port

3.2.2 Physical Characteristics

3.2.2.1 Physical Envelope

3.2.2.2 Weight

3.2.3 Reliability

3.2.4 Maintainability

3.2.4.1 Preventative Maintenance

3.2.4.2 Fault Detection/Isolation

3.2.5 Environmental Conditions

3.2.5.1 Temperature

3.2.5.2 Humidity

3.2.5.3 Electromagnetic

3.2.5.4 Shock

3.2.5.5 Random Vibration

3.2.5.6 Sinusoidal Vibration:

3.2.5.6.1 Exploratory Vibration

3.2.5.6.2 Variable Frequency

3.2.5.6.3 Endurance

3.2.5.7 Production Environmental Test

3.2.5.7.1 Thermal Shock

3.2.5.7.2 Single Axial Random Vibration

3.2.5.7.3 ESS Thermal Testing

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3.2.6 Configuration Management

3.2.6.1 General

3.2.6.2 Configuration Definition

3.3 Design and Construction

3.3.1 Nameplates and Product Marking

3.3.2 Prohibited Materials

3.3.3 Workmanship

4. QUALITY ASSURANCE PROVISIONS

4.1 General

4.1.1 Responsibility for Inspection

4.2 Inspection

4.3 Conformance Inspection

4.3.1 Sampling Inspection

4.3.2 Inspection Conditions

4.3.3 Ball Grid Array Inspection

4.3.3.1 Criteria

4.3.4 Ethernet Attenuation

4.3.5 Inspection Equipment

5. ACRONYM LIST

6. NOTES

6.1 Suggested Source(s) of Supply

LIST OF FIGURES

FIGURE TITLE PAGE

FIGURE 3.1.2-1 Connector Pin Assignment FIGURE 3.1.2.1-1 ESM Envelope Detail FIGURE 3.2.5.4-1 ESM Axes FIGURE 3.2.5.4-2 Z-Axis Shock Response Spectra FIGURE 3.2.5.4-3 X & Y-Axis Shock Response Spectra FIGURE 3.2.5.5-1 Random Vibration Spectrum FIGURE 3.2.5.7-1 PET Testing Sequence FIGURE 3.2.5.7.2-1 PET Random Vibration Spectrum FIGURE 3.2.5.7.3-1: ESS Thermal Testing Profile

LIST OF TABLES

TABLE TITLE PAGE

TABLE 3.2.5.4-1 Shock Response Spectra Test Levels for the ESM TABLE 3.2.5.6.2-1 Vibration Displacement (MIL-STD-167-1) TABLE 3.2.6.2-1. Configuration Definition TABLE 4.2-1 Test Matrix

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1. SCOPE

1.1 Scope. This specification establishes the design and test requirements for the Ethernet Switch Module (ESM).

2. APPLICABLE DOCUMENTS

2.1 General. The following documents of the exact issue shown form a part of this specification to the extent specified herein.

In the event of conflict between the documents referenced herein and the contents of the specification, the contents of this specification shall be considered a superseding requirements.

2.2 Government Documents.

SPECIFICATIONS

MIL-P-15024 Nameplates, Ordalt Plates and Information Plates MIL-Q-9858 Quality Program Requirements

STANDARDS

MIL-STD-130 Identification Marking of U.S. Military Properties MIL-STD-167-1 Mechanical Vibrations of Shipboard Equipment (Type I –Environmental and Type II –

Internally Excited) FED-STD-313 Material Safety Data, Transportation Data and Disposal Data for Hazardous Materials

Furnished to Government Activities FCC PART 15 PART 15 – Radio Frequency Devices MIL-S-901 Requirements for Shock Tests, H.I. Shipboard Machinery Equipment, and Systems.

HANDBOOKS

MIL-HDBK-217 Reliability Predictions of Electronic Equipment

DRAWINGS

NAVSEA S-9319-AQ Lithium Battery Technical Manual WS20203 UID Labeling of Assemblies and Parts Requirements Specification for the MK41 VLS WS20120 VLS Lead Free Control Plan

ASSISTANT SECRETARY OF DEFENSE

SD 14 Listings of Toxic Chemicals, Hazardous Substances and Ozone Depleting Chemicals.

2.3 Non-Government Publications.

INTERNATIONAL STANDARDS ORGANIZATION (ISO)

ISO-9001 Quality Systems – Model for Quality Assurance in Design, Development, Production, Installation and Servicing.

AMERICAN SOCIETY OF MECHANICAL ENGINEERS (ASME)

IEEE 802.3 Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and

Physical Layer Specifications 29 CFR 1910 Occupational Safety and Health Standards

40 CFR Protection of Environment IPC-A-610 Acceptability of Electronic Assemblies J-STD-001 Requirement for Soldered Electrical and Electronic Assemblies

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IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies

3. REQUIREMENTS

3.1 Item Definition. This document provides the unit level requirements for the Ethernet Switch Module (ESM).

3.1.1 General Requirements. Each ESM shall be physically and functionally interchangeable.

Each ESM shall meet the requirements of 3.1.2 and perform the following functions:

Unmanaged Layer II Switch

100 Base FX Launch Control Unit (LCU) communications

10/100 Base TX intra-LSEQ communications

Base FX Uplink Control

Link Indication

3.1.2 Interface Definition. Figure 3.1.2-1 shows a representative view of ESM analog and digital interfaces.

3.1.2.1 Mechanical. Each ESM shall be mechanically designed in accordance with Figure 3.1.2.1-1. Additional Mechanical

Interface requirements shall be as follows:

At least 6 mounting holes shall be provided for the ESM CCA to be mounted as a rigid mounting plate

ESM CCA shall stand off from the base by 0.250 inch.

The mounting holes are to be isolated from any ground planes within the ESM.

Ensure that secondary restraints are afforded to the connectors and any component heat sink on the ESM.

Air flow ventilation slots shall be provided on both sides of the device.

Two CRES #10-32 UNJF Locking Type mounting screws and two .212 shear pins shall be used to mount the ESM.

Locknuts shall be used to retain all hardware where possible when not applicable loctite shall be used.

Large or non restrained components shall be restrained using epoxy as required to meet Section 3.2.5.

Apply UID Label in accordance with WS20203, Type 2 as shown in Figure 3.1.2.1-1(Dash 2 Only).

The ESM shall have a minimum electrical keep out area of 0.75 inches on all sides of the printed circuit card excluding the front panel. Within this area no component can exceed a height of 0.325 inches from the top surface of the CCA so as to prevent mechanical interference when mounting the ESM in the next higher assembly (Dash 2 Only).

3.1.2.2 Electrical

3.1.2.2.1 Connectors/Pinouts. Each ESM shall have the following connectors. Where utilized all metal connector contacts shall have as a minimum 10 micro inches of gold plate over the entire surface of the contact and tail area. Gold flash will be acceptable when used as a solder connection but shall not be used for any female to male connector interfaces.

J1, J2 M83522/18 Style 10/100base FX Connectors – metal ST type only, plastic connectors are not acceptable.

J3 Shielded RJ45 10/100baseTX Connector J4 – J7 Communication Connectors, 26 –pin DSUB Female (shall mate with M24308/4-12 plug with M24308/25-6P male screw lock) J8 Power/Control Connector, 9-pin DSUB Female (shall mate with M24308/4-1 plug with M24308/25-6P male screw lock) J9 RS-232 Control Connector, 9-pin DSUB Female (shall mate with M24308/4-1 plug with M24308/25-6P male screw lock). A removable metal cover shall be supplied with connector J9.

Reference Figure 3.1.2-1 for exact connector numbers and pin-outs.

3.1.2.2.2 Power Input. Each ESM shall operate over a range of 28.5 VDC ± 5% (Dash 1 only) or 18 to 32 VDC (Dash 2 only) with the following considerations:

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The ESM shall be able to meet all specifications operating from a single pair of input power connections over the voltage range specified above.

17.5 Watts maximum consumption per ESM.

Input return and ESM return can be common but must be isolated from chassis ground by a minimum of 10 Meg Ohms of impedance.

All power feeds must provide short circuit protection.

Diode “OR” the two feeds. The diode ORing shall de-rate the diodes by 75% for current and voltage, and 30% for power.

Radiated Emissions shall be in accordance with FCC Part 15.

The ESM shall have electrical connectivity between the electrical connection of chassis ground and the mechanical chassis of less than 1 ohm.

3.1.2.2.3 Uplink Control. The ESM shall provide a communication shut down control interface for the fiber interface only. This interface shall disable communication any time an external low signal is applied. The external low signal provided will be an open collector low impedance path to the +28.5 VDC return only with no connection to +28VDC. The control interface shall contain the necessary circuitry to enable communication when the external low signal is removed and shall not require sinking greater than 0.030 amperes of current and require no source current to operate. The ESM shall disable or enable communication within 50 ms of application or removal of the external low signal. The Uplink Control shall fault to the disabled state requiring a positive action to activate the fiber interface.

3.1.2.2.4 Link Indicators. The ESM shall provide a visible indication of Ethernet connectivity on the front panel for all 16 ports of the ESM. The indicator shall illuminate representing a link has been established between the ESM and the recipient and blink upon link activity. The link indicators need not be physically located adjacent to the port it represents.

3.1.2.2.5 Switch Control. The ESM shall provide a command and control interface to the onboard microprocessor by way of an RS-

232 serial interface. Conductivity shall be through J9 and support standard 2 wire serial communications at a 9600 baud rate providing a bi-directional console interface.

3.1.2.2.5.1 Communication. The console shall operate at 9600 baud, 1 stop bit, no parity, and no flow control. Terminal emulation shall be compatible with VT100 terminal.

3.1.2.2.5.1.1 Menu. The console shall support a menu driven system with at minimum, Port Setup, Port Mirroring Setup, Display Port

Status, Restore Default Setup and Reset Device. Each submenu shall be selectable.

3.1.2.2.5.1.2 Port Setup. The 10/100 ports shall have the option of being configured to run at 10Mbps or 100Mps in full or half-duplex mode, to be enabled, disabled or set to run for auto-negotiate. The default setting is for all ports to auto-negotiate.

3.1.2.2.5.1.3 Port Mirroring. The Console shall have the option of Enabling and Disabling the Mirror Port. The default setting is for the mirror port to be Port 2 and Enabled. The Mirror Port shall be temporarily selectable as Port 2 or Port 4 or Port 8 or none (Dash 2 Only). When not selected as a mirror port the port shall revert to full Ethernet Capability (Dash 2 Only). The Mirror Port shall be set to mirror at the initiation of a message (Dash 2 Only).

3.1.2.2.5.1.4 Port Status. The Console screen shall display the Port Status of all sixteen ports.

3.1.2.2.5.1.5 Restore Default. The Console screen shall allow a single selection to restore factory defaults. Factory defaults are defined as all ports active, port mirroring enabled, all ports in auto-negotiate mode. The ESM defaults shall be restored upon power cycling.

3.1.2.2.5.1.6 Reset Device. The Console screen shall allow a system reset of the Ethernet Switch Module.

3.1.2.2.6 Lead Free Compatibility.

a. Dash 2 assemblies shall utilize leaded components to the fullest extent possible however if RoHS components are utilized they shall be selected meeting the following finishes, any other component finish shall require customer approval prior to use within the assembly.

1. Sn (bright or matte, with or without Ni underplate)

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2. SnCu

3. SnAg over copper

4. SnAgCu (as coating on component lead)

5. NiPdAu

6. NiPd

7. Ag over Ni

8. Ag over Cu

b. Dash 2 assemblies which utilize Ball Grid Arrays which are ROHS compliant may have the lead free solder balls removed and replaced with solder balls having a minimum lead content of 36%. Quality requirements for this process are covered in Section 4.

c. Dash 2 assemblies which utilize Ball Grid Arrays which are ROHS compliant may be soldered to the printed circuit card using a solder with a minimum lead content of 36%. Quality requirements for this process are covered in Section 4.

d. Dash 1 and 2 assemblies shall have all components soldered to the printed circuit card using solder with a minimum lead content of 36%.

3.1.2.2.7 Software or Firmware Updates. All software or firmware updates shall not require disassembly of the ESM and shall not be available via the front panel (Dash 2 Only).

3.1.2.2.8 Selectable Jumpers or Programming Pins. All programming jumpers or pins shall either be soldered or wire wrapped using acceptable materials.

3.2 Characteristics

3.2.1 Performance. The ESM shall be configured as a SWITCH that does not require any external intervention for operation.

The ESM shall not exhibit any self inflicted shutdown modes.

3.2.1.1 Steady State. The performance of the ESM at a steady state condition shall not be greater than 25usec port to port latency for any valid size (64 to 1518 bytes) of fast Ethernet packets.

3.2.1.2 Boot Up Time. The ESM shall be fully operational and capable of data transmission on all interfaces within 8 seconds after

28.5 VDC power application.

3.2.1.3 Local Area Network Ports. The ESM Local Area Networks (LAN) ports shall be capable of transmitting and receiving 100

BaseFX Fast Ethernet, as specified in ANSI/IEEE 802.3u, and 10/100 BaseTX Fast Ethernet, as specified in ANSI/IEEE 802.3u.

The ESM shall have 16 total ports as mapped below:

Port Id Designation Connector Map Ethernet Type

1 Fiber Connection J1, J2 100 BaseFx Fast Ethernet 2 Operational Port J3 10/100 BaseTx Fast Ethernet 3 – 6 Operational Port J4 10/100 BaseTx Fast Ethernet 7 – 10 Operational Port J5 10/100 BaseTx Fast Ethernet 11 – 13 Operational Port J6 10/100 BaseTx Fast Ethernet 14 – 16 Operational Port J7 10/100 BaseTx Fast Ethernet

3.2.1.3.1 Mirror Port. The ESM shall support port mapping. Port ID2 shall be set to mirror all communication from Ports 1 and 3-16 as the default condition. All other ports shall have port mapping disabled as the default condition (Dash 2 Only). The ESM shall be able to resolve and output via the mirror port any 2 successive messages entering the ESM with a relative time to each other of 2.5 micro-seconds. A typical Ethernet Message is defined as any construct of data up to 512 bytes in length entering a port and leaving one or more ports of the ESM. It is acceptable to queue messages for transmission over the mirror port as long as the relative timing between messages is retained. Timing shall be referenced to the first bit of the Ethernet Message. No valid message entering the ESM shall be dropped as long as the combined bandwidth of ports inputting data does not exceed the bandwidth of the mirror port and fabric buffering capabilities at any instance in time.

The mirror port shall not be capable of accepting input Ethernet messages.

3.2.2 Physical Characteristics

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3.2.2.1 Physical Envelope. Reference Figure 3.1.2.1-1 for physical size.

3.2.2.2 Weight. Each ESM shall be no greater than 4 lbs. maximum.

PINOUT FOR PWR CONN PINOUT FOR CONTROL CONN

LOOKING AT FRONT PANEL LOOKING AT FRONT PANEL

J8 J9

PINOUT FOR PWR CONN

LOOKING AT FRONT PANEL

J8

PINOUT FOR CONTROL CONN

LOOKING AT FRONT PANEL

J9

1. + 28.5 VDC (SUPPLY 1) 1. NC

2. N/C 2. Receive Data (RX)

3. FIBER CONN ON/OFF 3. Transmit Data (TX)

4. FIBER CONN ON/OFF 4. NC

5. CHASSIS GROUND 5. Signal Ground (GND)

6. +28.5 VDC (SUPPLY 2) 6. NC

7. N/C 7. NC

8. +28.5 VDC RET (SUPPLY 1) 8. NC

9. +28.5 VDC RET (SUPPLY 2) 9. NC

FIGURE 3.1.2-1

Connector Pin Assignment

RJ45 CONNECTOR

ST CONNECTORS

D SUB CONNECTORS

MARKING LOCATION

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J1 = TX1

J2 = RX1

J3

J3

PIN SIGNAL

1 TX2+

2 TX2-

3 RX2+

6 RX2-

J4 –J7

CONNECTOR LOCATION

J4 J5 J6 J7

PIN SIGNAL SIGNAL SIGNAL SIGNAL

1 TX3- TX7- TX11- TX14-

2 RX3- RX7- RX11- RX14-

3 RX4- RX8- RX12- RX15-

4 TX4- TX8- TX12- TX15-

5 TX5- TX9- TX13- TX16-

6 RX5- RX9- RX13- RX16-

7 RX6- RX10- NC NC

8 TX6- TX10- NC NC

9 NC NC NC NC

10 TX3+ TX7+ TX11+ TX14+

11 RX3+ RX7+ RX11+ RX14+

12 RX4+ RX8+ RX12+ RX15+

13 TX4+ TX8+ TX12+ TX15+

14 TX5+ TX9+ TX13+ TX16+

15 RX5+ RX9+ RX13+ RX16+

16 RX6+ RX10+ NC NC

17 TX6+ TX10+ NC NC

18 NC NC NC NC

19 SHIELD SHIELD SHIELD SHIELD

20 NC NC NC NC

21 SHIELD SHIELD SHIELD SHIELD

22 NC NC NC NC

23 SHIELD SHIELD SHIELD SHIELD

24 NC NC NC NC

25 SHIELD SHIELD SHIELD SHIELD

26 NC NC NC NC

NOTE: SHIELD is equivalent to CHASSIS GROUND.

FIGURE 3.1.2-1-cont’d

Connector Pin Assignment

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FIGURE 3.1.2.1-1

ESM Envelope Detail

UID Label (Dash 2 Only)

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3.2.3 Reliability. The ESM Mean Time Between Failure (MTBF) shall be greater than 77,000 hours as calculated using MIL- HDBK-217 in Naval Sheltered Environment and 46°C ambient temperature. Calculations can be done using the quality factors as provided below for commercial parts.

Part Type

Quality Factor/Method** ICs “B-1” for Non-Mil Discrete Semi-Conductors “JANTX” for Non-Mil Resistors “R” for Non-Mil Resistor Networks “M” for Non-Mil Capacitors “R” for Non-Mil Inductive Devices “M” for Non-Mil Relays “Lower” for Non-Mil Switches “Lower” for Non-Mil Circuit Breakers “Lower” for Non-Mil Connectors “Lower” for Non-Mil

** Vendor Supplied Models/Predictions For Failure Rates Will Be Used When Applicable

3.2.4 Maintainability.

3.2.4.1 Preventative Maintenance. The design of the ESM shall be such that preventative maintenance is not required.

3.2.4.2 Fault Detection/Isolation. The ESM does not have a Built in Test (BIT) requirement.

3.2.5 Environmental Conditions. The ESM shall be fully functional, as specified in Sections 3.1 and 3.2, when exposed to any of the operating environments herein. The ESM shall also be fully functional following exposure to any of the non-operating environments herein.

3.2.5.1 Temperature.

Non-Operating: -40° F to 185° F (-40° C +85° C) Operating: 32° F to 158° F (0° C to +70° C) No Air Flow required

3.2.5.2 Humidity. The ESM shall remain operable when exposed to 95% Relative Humidity, Non-Condensing. Humidity Testing shall be in accordance with IEC 68-2-3Ca at 40 +/- 2°C with 93 +2/-3% Relative Humidity for 10 days. The ESM will be Z axis orientated as specified in Figure 3.2.5.4 -1.

The completed printed circuit card assembly(s) shall be conformal coated using IPC-CC-830, Type AR. All parts including part leads and conductive patterns shall be coated on both sides of the assembly with the exception of the following parts and areas:

1. Mounting holes and pads.

2. Connectors: electrical and mechanical interfaces to prevent interference with their mating connectors.

3.2.5.3 Electromagnetic. Operating and Non-operating:

Ambient E-Field = 10V/M (15 KHz to 18 GHz)

Ambient Conducted Transient (Common Mode on Ethernet lines, if present. Not applicable for any other interfaces)

Damped Sinusoid Ipin=1.05 x Imax x e –(PI x Hz x t)/Q x sin (2 x PI x Hz x t), Imax = 0.1 Amp-peak, Hz = 0.63 to 10 MHz, damping factor Q=15 ± 5

Ambient H-Field = 20 Oersteds maximum with rate of change plus or minus 20 Oersteds per second

Radiated E-Field = In accordance with FCC Part 15 for Class A digital devices

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3.2.5.4 Shock. Operating and Non-operating:

Shock spectra shall be per Table 3.2.5.4-1 and Figures 3.2.5.4-1, 3.2.5.4-2, and 3.2.5.4-3 or test in accordance with MIL-S-901 Grade A, Class I, Type C. Three blows per axis.

FIGURE 3.2.5.4-1

ESM Axes

TABLE 3.2.5.4-1

Shock Response Spectra Test Levels for the ESM

Z-Axis (reference Figure 3.2.5.4-2) X & Y-Axis (reference Figure 3.2.5.4-3)

Freq G's

Control Limit Freq G’s

Control Limit

(Hz) High Low High Low

Z-Axis Shock Response Spectra (Q=10)

10 100 1000

Frequency (Hz)

A c c e le ra ti o n g

Card Cage

FIGURE 3.2.5.4-2

Z-Axis Shock Response Spectra

Y-Axis

Z-Axis

X-Axis

ESM

F R O N T

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X-Axis Shock Response Spectra (Q=10)

10 100 1000 Frequency (Hz)

A cc el er at io n g

10 60 1000

FIGURE 3.2.5.4-3

X & Y-Axis Shock Response Spectra

3.2.5.5 Random Vibration. Operating and Non-Operating:

All axes = 11g-rms per Figure 3.2.5.5-1, Duration per axis = 1.5 Minutes

3.2.5.6 Sinusoidal Vibration: (Operating and Non-Operating) Each ESM shall be capable of meeting the following requirements of

MIL-STD-167-1:

3.2.5.6.1 Exploratory Vibration.

Frequency Range 4 to 25 Hz

Table vibration amplitude 0.010 ± .002 inch

Sweep rate: one half octave per minute

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LSEQ Launch Vibration Spectrum (Grms = 11g RMS)

0.001

0.01

0.1

1 10 100 1000 10000

FREQUENCY (HZ)

P S

D g

2/

H z

FIGURE 3.2.5.5-1

Random Vibration Spectrum

3.2.5.6.2 Variable Frequency. Equipment shall be capable of withstanding vibrations from 4 Hz (or lowest attainable frequency) to 25 Hz in a discrete frequency interval of 1 Hz at the amplitude shown in Table 3.2.5.6.2-1. At each integral frequency, the vibration shall be maintained for five minutes.

TABLE 3.2.5.6.2-1

Vibration Displacement (MIL-STD-167-1)

Frequency Range (Hz) Table Amplitude (inch) 4 – 15 16 – 25

0.030 ± 0.006

0.020 ± 0.004

3.2.5.6.3 Endurance. The ESM shall be capable of withstanding vibrations in accordance with Table 3.2.5.6.2-1 input for a total period of at least 2.0 hours at the resonant frequencies chosen by the test engineer. If no resonate is observed, this test shall be performed at 25 Hz.

COORDINATES

F(Hz) PSD (g^2/Hz)

22.5 .001 70 .030 150 .030 250 .240

1000 .060 2000 .008 3000 .0025

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3.2.5.7 Production Environmental Test (PET) The ESM shall be subjected to ESS Thermal Testing and Random Vibration PET environments described. Figure 3.2.5.7-1 delineates the required testing sequence and temperatures for each test conducted on the ESM. A PET failure is defined as any electrical or mechanical discrepancy found during a PET sequence that causes or could lead to the inability of an ESM to perform within specification limits over the intended life of the assembly.

A functional test sequence for either new production or repair shall be defined as sending and receiving a minimum of 100,000 individual Ethernet packets over each of the 16 ports of the Unit Under Test (UUT). If the UUT has a loss of three or more packets on any one of the 16 ports, then the UUT shall be retested. If the UUT drops three or more packets during the subsequent test, it will be marked as a “FAIL” and the UUT will be sent for analysis, repair and rework before being retested. During ESS Thermal Testing the UUT shall remain at the specified temperature within +/-2°C for a minimum of 1 hour prior to the initiation of any functional test sequence.

FIGURE 3.2.5.7-1

PET Testing Sequence

3.2.5.7.1 Thermal Shock.

Removed.

3.2.5.7.2 Single Axial Random Vibration ESMs undergoing single axial random vibration shall do so in a powered-on condition at a level of at least 6 grms for a minimum of 10 minutes between the frequency limits of 20-10/+30 Hz to 2000 200 Hz (Figure 3.2.5.7.2-1). During the vibration environment, selected functional tests/checks shall be performed while monitoring critical inputs and outputs. The ESM shall be rigidly mounted to its mounting fixture during vibration to obtain full effect of force transmissibility into the ESM over the total frequency range.

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FIGURE 3.2.5.7.2-1

PET Random Vibration Spectrum

3.2.5.7.3 ESS Thermal Testing. The UUT shall be functionally tested, as described in 3.2.5.7. They shall be tested across four temperatures in the following order: 25°C, 0°C, 70°C, 25°C, using the thermal profile defined in Figure 3.2.5.7.3-1.

FIGURE 3.2.5.7.3-1: ESS Thermal Testing Profile

3.2.6 Configuration Management.

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3.2.6.1 General. The supplier shall implement and maintain written policies and procedures for Configuration Control and

Configuration Management of the device. Configuration control and management of the device including all supporting documentation shall be maintained for a minimum of four (4) years after the last delivery date of the device. The contractor shall have the right to audit all policies and procedures at the supplier’s facility. The supplier will notify the contractor if there is a change to the design, be it parts or function. The contractor shall have the right to accept the change or if the supplier discontinues the device, the contractor may be given the rights of the design.

3.2.6.2 Configuration Definition. The 7105238-2 shall be configured as shown in Table 3.2.6.2-1.

TABLE 3.2.6.2-1. Configuration Definition

Assembly

Level Component Manufacturer GE Part Number Vendor Part Number Revision

1 Printed Wiring Assembly GE 87003020-002 N/A A1

2 ITAR RM988 PCB 87003020-001 GE 87003020-100 N/A A0

1 PROGRAMMED PART, RM988 APP BOOTLOADER GE 87003020-400 Silicon Labs C8051F127-GQ 1.1.0

1 FIRMWARE,RM988 BOOT IMAGE GE 87003020-440 N/A 1

1 FIRMWARE,RM988 APPLICATION IMAGE GE 87003020-442 N/A 1.1

1 PROGRAMMED PART, RM988 CPLD GE 87003020-401 Altera EPM3032ATI44-10N 1.1.0

1 FIRMWARE,RM988 CPLD GE 87003020-441 N/A 1.1

2 IC, CUSTOM BCM53212 W SNPB SOLDER BALLS Raw Part 42G4190-0004C01= Broadcom 87003020-450 BCM53212MIPBG A0

2 SCTKY 40V 3A SMC FAIRCHILD 42G3020-0001C01 MBRS340 N/A

ON SEMICONDUCTOR MBRS340T3G N/A

DIODES INC B340-13-F N/A

2 DIODE SCHOTTKY 40V 1A SOD-123 ON SEMICONDUCTOR 42G3020-0017C01 MBR140SFT1G N/A

NXP SEMICONDUCTORS PMEG4010EH,115 N/A

2 OSC 25MHZ 50PPM 2.5V SMD ECLIPTEK CORP 42G3110-0101C01 EC2745ETTS-25.000M N/A

2 NFET PWR 40V 6.2MOHM INTERNATIONAL RECTIFIER 42G3220-0048C01 IRF6616TR1PBF N/A

INTERNATIONAL RECTIFIER IRF6616TRPBF N/A

2 NFET 60V 2.0A .160OHM 1.25W SOT-23 VISHAY 42G3220-0081C01 Si2308BDS-T1-GE3 N/A 2 3306 2-BIT BUS SWITCHES MSOP-8 PERICOM SEMICONDUCTOR CORP 42G4150-0009C01 PI3C3306UE N/A 2 BGA,IC,MANAGED SWITCH,16 FE PORTS,2-GBE BROADCOM CORP 42G4190-0004C01 BCM53212MIPBG N/A 2 7S04 HI-SPD SGL INV SC-70 NXP SEMICONDUCTORS 42G4200-0027C01 74HC1G04GW,125 N/A

TEXAS INSTRUMENTS SN74AHC1G04DCKTE4 N/A

TEXAS INSTRUMENTS SN74AHC1G04DCKR N/A

TEXAS INSTRUMENTS SN74AHC1G04DCKRE4 N/A

TEXAS INSTRUMENTS SN74AHC1G04DCKT N/A

FAIRCHILD SEMICONDUCTOR NC7S04P5X N/A

2 74LCX244 OCTAL 3-STATE BUFFER FAIRCHILD SEMICONDUCTOR 42G4200-0140C01 74LCX244MTC N/A 2 IC MIX SIG ISP FLSH MCU 64TQFP SILICON LABORATORIES 42G4500-0046C01 C8051F127-GQ N/A

2 OPTO SINGLE 80V 2.5 KV ISOL NEC 42G5200-0022C01 PS2801-1-F3A N/A

2 SWITCH PB SPST SEALED SMT C&K COMPONENTS 42G6030-0004C01 KSC141JLFS N/A

2 XFMR GBIT ETH 2PORT SMD50 HALO ELECTRONICS INC 42G3410-0023C01 TG111-E212NW N/A

2 3221 RS232 XCEIVER 250KBPS 85C MAXIM 42G4120-0006C01 MAX3221EEAE N/A

MAXIM MAX3221EEAE-T N/A

2 3418 REG SYNC ST DWN 8A 4MHZ LINEAR TECHNOLOGY 42G5020-0001C01 LTC3418EUHF N/A

LINEAR TECHNOLOGY LTC3418EUHF#TR N/A

2 6710 QUAD VOLTAGE SUPERVISORY MAXIM 42G5100-0010C01 MAX6710IUT-T N/A

2 IC,SWTCH VOLTAGE CONV,50MA,SO8 MAXIM 42G5900-0013C01 MAX861ESA-T N/A

2 XCVR,ST DUPLEX,3.3V,TTL,DC/DC,1310NM,1X9 LASERMATE 42G8311-0016C01 CM13L-03A-3S-PI-TM N/A 2 CONN,DUAL PORT,STACKED,RA,DSUB26,FEM POSITRONIC INDUSTRIES INC 42G8351-0048C01 DDA26FN2/26FN20-15-230 N/A 2 CONN,DUAL PORT,STACKED,RA,DSUB9,FEM POSITRONIC INDUSTRIES INC 42G8351-0049C01 DPA9FN2/9FN20-15 N/A

2 EPM3032 PLD 10NS 85C 3.3V EPM3032ATI44-10 42G4400-0016C01 ALTERA N/A

2 IC,REG/CNTRLR,2 PHASE,SYNC. STEP-DOWN,QFN LINEAR TECHNOLOGY 42G5030-0024C01 LTC3728LIUH-1#PBF N/A

IC,REG/CNTRLR,2 PHASE,SYNC. STEP-DOWN,QFN LINEAR TECHNOLOGY 42G5030-0024C01 LTC3728LIUH-1#TRPBF N/A 2 FUSE FAST BLOW 3A 125V PICO Littlefuse 42G6100-0001C01 0459 003UR N/A 2 CON RJ45 1PORT MOD JCK SHILDED Stewart Connector 42G8301-0045C01 SS-6488S-A-PG4-BA N/A 2 LED GREEN 2.2V 20MA 45MCD 0402 Lumex 42G3500-0047C01 SML-LX0402SUGC-TR N/A 2 LED QUAD GRN STACK 2V RT/A SunLed 42G3511-0009C01 XVX4SUG91DLF N/A

3.3 Design and Construction. The Design and Construction of the ESM shall be as follows:

All procured or manufactured parts shall meet the performance requirements stated herein.

COTS materials, processes and parts selected shall meet the performance and safety requirements of this drawing.

3.3.1 Nameplates and Product Marking. Nameplates, part marking and all other identifying marking shall be applied as specified in

MIL-P-15024/10.

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ESM shall be identified and marked as required by the general and detailed marking requirements of MIL-STD-130. Marking Location shall be as shown in Figure 3.1.2-1. Marking shall include the following information:

53711 ASSY 7105238-(applicable dash number) (Dash 2 Only)

Serial No.

Firmware revision

Manufacturer’s Part Identification Number and Cage Code.

3.3.2 Prohibited Materials. The ESM shall not contain toxic or hazardous substances in accordance with 29 CFR 1910, Subpart H and Subpart Z, FED-STD-313, 40 CFR Chapter I (Subchapter J) and SD-14.

The use of ozone-depleting chemicals in accordance with SD-14 and 40 CFR Chapter I, Subchapter C shall require the approval of the procuring activity.

The following additional materials, as a minimum, shall not be used unless approved by the procuring activity:

1. Carcinogens

2. Lithium and lithium compounds, except batteries identified in NAVSEA S-9319-AQ-SAF-010, Lithium Battery Technical Manual, as requiring no special disposal requirements.

3. Magnesium and magnesium alloys

4. Polyvinyl chloride (PVC), except when used for part leads

5. Radioactive commodities

6. Zinc or zinc alloys

3.3.3 Workmanship. Workmanship will be in accordance with IPC-A-610, Class 3, and assembly(s) are to be manufactured using J-STD-001, Class 3 (Dash 2 Only). Dash 1 and 2 assemblies shall have all components soldered to the printed circuit card using solder with a minimum lead content of 36%. The ESM shall conform to WS20120 (Dash 2 Only).

4. QUALITY ASSURANCE PROVISIONS

4.1 General. All requirements in Section 3.0 shall be verified either by inspection, analysis, demonstration or combination of these methods.

The vendor shall be responsible for the following quality assurance provisions.

Verification of the performance requirements.

A measurement or comparison of specified physical characteristics.

Verification, with specification criteria, for workmanship.

The quality assurance provisions shall be verified in accordance with the methods described in Table 4.2-1.

4.1.1 Responsibility for Inspection. Unless otherwise specified in the contract or purchase order, the supplier is responsible for the performance of all verification of requirements. Except as otherwise specified in the contract or order, the supplier may use his own or any other facilities suitable for the performance of the verification of requirements.

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4.2 Inspection. Inspection shall be performed as depicted in Table 4.2.-1.

TABLE 4.2-1

Test Matrix

Requirement Title Supplier

First Article Testing

Supplier Production Testing

100% Compliance

Contractor Testing

3.1.2.1 Mechanical X X X

3.1.2.2.1 Connectors/Pinouts X X

3.1.2.2.2 Power Input X X

3.1.2.2.3 Uplink Control X X

3.1.2.2.4 Link Indicators X X

3.1.2.2.5 Switch Control X X

3.2.1.1 Latency X

3.2.1.2 Boot Up Time X

3.2.1.3 LAN Ports X

3.2.2.1 Size X

3.2.2.2 Weight X

3.2.5.1

Temperature Operating @ 0°C

Functional Testing via Section 3.2.1

X

Temperature Operating @ 70°C

Functional Testing via Section 3.2.1

X

3.2.5.2 Humidity X

3.2.5.3 Electromagnetic X

3.2.5.4 Shock X

3.2.5.5 Random Vibration X

3.2.5.6 Sinusoidal Vibration X

3.2.5.7 PET X X

3.3.3 Workmanship X X

4.3 Conformance Inspection. The contractor shall provide a quality assurance system conforming to MIL-Q-9858 or ISO 9001.

The contractor shall develop and implement upon approval, an acceptance plan for performing all examination and tests required ensuring workmanship conforms to requirements in Section 3. Table 4.2-1 specifies the Section 3 paragraphs to be verified.

4.3.1 Sampling Inspection. All ESMs shall be verified for workmanship. One hundred percent inspection is required.

4.3.2 Inspection Conditions. The ESM shall be mechanically assembled as shown in Figure 3.1.2.1-1 and electronically connected as defined in Figure 3.1.2.1-1.

4.3.3 Ball Grid Array Inspection. A design which utilizes a RoHS compliant ball grid array(s) shall meet the following quality requirements.

4.3.3.1 Criteria. The supplier shall develop written methods outlining the manufacturing processes, or acceptance criteria for either the replacement of lead free solder balls with leaded solder balls or the soldering of unleaded balls using leaded solder. The supplier shall obtain written approval of the provided documentation from the contractor prior to implementation. The selection of either process shall not affect the warranty of the ESM.

4.3.4 Ethernet Attenuation. The ESM shall be tested with a minimum of 200 feet of Cat 5 cable and 500 feet of acceptable fiber cable during all acceptance testing (Dash 2 Only).

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4.3.5 Inspection Equipment. Workmanship verification shall be performed by test equipment capable of verifying all ESM outputs are within tolerances specified herein.

5. ACRONYM LIST

CCA Circuit Card Assembly CDRL Contract Data Requirements List COTS Commercial off the Shelf CRC Cyclic Redundant Check ESM Ethernet Switch Module LAN Local Area Network LCU Launch Control Unit LRU Line Replaceable Unit LSEQ Launch Sequencer MAC Medium Access Control PET Production Environmental Test

6. NOTES

6.1 Suggested Source(s) of Supply.

CONTROL

NUMBER

7105238

VENDOR DATA

CAGE

CODE

PART NUMBER SW REVISION NAME / ADDRESS

-1 0BPH5

RM938/D REV B

ECOB4

N/A

GE FANUC EMBEDDED SYSTEMS

12090 SOUTH MEMORIAL PKWY

HUNTSVILLE, AL 35803

-2 0BPH5 RM988

Specified in

Table 3.2.6.2-1

GE FANUC EMBEDDED SYSTEMS

12090 SOUTH MEMORIAL PKWY

HUNTSVILLE, AL 35803

IDENTIFICATION OF THE “SUGGESTED SOURCE(S) OF SUPPLY” HEREON IS NOT TO BE CONSTRUED AS A GUARANTEE OF PRESENT OR CONTINUED AVAILABILITY AS A SOURCE OF SUPPLY FOR THE ITEM(S).