Copy of Sample Timeline.xlsx

XLSX spreadsheet 36 KB Posted

Attached to
Build Partner Capabilities to Protect Semiconductor and CHIPS Technology
Opportunity number
DFOP0016987
Issued by

About this file

The provided document is a sample timeline for a project proposal related to the federal grant opportunity "Build Partner Capabilities to Protect Semiconductor and CHIPS Technology." The grant is funded by the Department of State's Bureau of International Security and Nonproliferation under the Global Threat Reduction program (CFDA 19.033). The grant opportunity aims to address the threat posed by malign actors attempting to access semiconductor technology, research, data, and talent for military and dual-use applications. The timeline covers a 2-year period and outlines project objectives and related activities. Key details include performance indicators, data collection, risk monitoring, and progress reporting requirements. This document appears to be a template provided as part of the grant solicitation materials.

Timeline

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Text version

Burma DRL Proposal Timeline

Organization Name
Timeline
Title: Insert Title of Project
20232024
123456789101112131415161718192021222324
ActivitiesJanFebMarAprMayJunJulAugSeptOctNovDecJanFebMarAprMayJunJulAugSeptOctNovDec
Objective 1:
Activity 1.1:
Activity 1.2:
Activity 1.3:
Activity 1.4:
Activity 1.5:
Objective 2:
Activity 1.1:
Activity 1.2:
Activity 1.3:
Activity 1.4:
Activity 1.5:
Monitoring and Evaluation
Performance Indicator Data Collection
Risk Monitoring
Reflection, Analysis and Decision-Making Sessions
Progress Reports

File details come from the government source that posted it. Updated .