Attachment 4 - Technical Specifications.pdf
PDF 106 KB Posted
- Attached to
- IT equipment and accessories
- Solicitation number
- 12760426Q0194
- Issued by
-
Department of Agriculture Forest Service
About this file
This document is a product specification sheet detailing twelve component items for a server system configuration. The primary system is a Supermicro CSE-826BAC12-R1K23LPB 2U rackmount chassis supporting multiple motherboard sizes (ATX, E-ATX, EE-ATX) with 12 hot-swap 3.5" drive bays, optional rear 2.5" drives, and redundant 1200W/1000W Titan power supplies. The system utilizes an Intel Xeon Gold 6136 processor (12 cores, 3.0 GHz base, LGA-3647 socket) paired with a Supermicro X11DDW-NT motherboard featuring dual LGA-3647 sockets, Intel C622 chipset, 14 SATA3 ports with RAID support, dual 10GBase-T networking, and support for up to 3 TB of DDR4-2933 ECC memory.
Additional specified components include 32 GB of A-Tech DDR4-2933 ECC RDIMM memory, a PNY CS900 250 GB 2.5" SATA SSD, a Seagate Exos X24 20 TB enterprise HDD, a Supermicro 2.5" hot-swap drive cage, a SilverStone XE02-3647NB CPU cooler rated for 205W TDP, ARCTIC MX-4 thermal compound, a Broadcom/LSI MegaRAID SAS 9361-16i RAID controller with 16 internal SAS/SATA lanes and PCIe 3.0 x8 interface supporting RAID levels 0/1/5/6/10/50/60, a DiliVing SlimSAS Y-cable for backplane connectivity, and an ASURION 4-Year B2B Office Equipment Protection Plan covering repairs, accidental damage, power surge protection, and post-warranty malfunctions.
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Other files
| File | Type | Posted |
|---|---|---|
| Attachment 3 _ ICT Accessibility Requirements.pdf | ||
| Attachment 1 - BOM_12760426Q0194_.xlsx | XLSX spreadsheet | |
| Attachment 2 - USDASecurityContractLanguage.pdf | ||
| RFQ_12760426Q0194.pdf |
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Text version
1) Supermicro CSE-826BAC12-R1K23LPB 2U chassis
• Form factor & board support: 2U rackmount; supports ATX (12″×10″), E-ATX (12″×13″), and EE-ATX (13″×13.6″) motherboard sizes (with rear 2.5″ HDD option installed).
• Drive bays / backplane: 12× 3.5″ hot-swap bays; optional rear 2× 2.5″; 12-slot LFF backplane supports SAS3/SATA3/NVMe devices.
• Power supplies: Redundant Titan 1U 1200W/1000W PSU with PMBus.
• Expansion & cooling: 7 low-profile slots; 3× 80 mm high-performance PWM fans.
2) Intel Xeon Gold 6136 (LGA-3647) CPU
• Cores/threads: 12 cores (Dodeca-core).
• Clock: 3.0 GHz base; listing notes up to 3.7 GHz turbo.
• Socket: LGA-3647 (Socket 3647).
3) ASURION 4-Year B2B Office Equipment Protection Plan
• Coverage: Repair costs ($0 parts/labor/shipping), drops, spills, cracked screens for portable products; power surge protection from day one; malfunctions after OEM warranty.
4) Supermicro X11DDW-NT Motherboard
• CPU support: Dual Socket P (LGA-3647) for Intel Xeon Scalable; CPU TDP support up to 205 W; UPI up to 10.4 GT/s.
• Chipset / SATA: Intel C622; 14× SATA3 (6 Gbps), RAID 0/1/5/10.
• Network: Dual 10GBase-T (from C622).
• Memory: 12 DIMM slots; up to 3 TB 3DS ECC RDIMM/LRDIMM, DDR4-2933;
supports up to 2 TB Intel Optane DC Persistent Memory (Cascade Lake, memory mode).
• Storage expansion: M.2 PCIe 3.0 x4 (Key M; 2260/2280/22110); U.2 PCIe 3.0 x4 (internal NVMe ports).
• Video: 1× VGA.
5) Supermicro MCP-220-82616-0N 2.5″ Hot-Swap Drive Cage
• Capacity: 2× 2.5″ hot-swap SAS/SATA drives.
• Monitoring: Overheat alarm; drive activity/failure LEDs.
• Dimensions & weight: 83.0×159.0×35.0 mm (3.26×6.26×1.36″); ~0.68 kg gross.
6) A-Tech 32 GB Kit (4×8 GB) DDR4-2933 ECC RDIMM 1Rx8, 288-pin
• Spec: DDR4-2933 (PC4-23400) ECC Registered DIMM; 1Rx8 single-rank; 288-pin;
1.2 V.
• Compatibility: For servers/workstations only (not desktops/laptops); do not mix ECC RDIMM with other ECC types (UDIMM/LRDIMM).
• Warranty: Limited Lifetime.
7) PNY CS900 250 GB 2.5″ SATA III SSD (SSD7CS900-250-RB)
• Interface / form factor: SATA III (6 Gb/s), 2.5″.
• Performance: Up to 535 MB/s read, 500 MB/s write.
• Features: Hardware encryption; low power; backward compatible with SATA II.
8) SilverStone XE02-3647NB 2U LGA-3647 (Narrow) CPU Cooler
• Compatibility: Intel LGA-3647 (Narrow) sockets; 2U servers/workstations.
• Thermal capacity: 205 W TDP rating (2U).
• Design: 4× Ø6 mm heatpipes; aluminum fins; 60 mm PWM dual ball-bearing fan.
• Fan specs: Up to 8400 RPM; ~52 dB; 12 V (4-pin).
9) ARCTIC MX-4 Thermal Compound (4 g, with spatula)
• Type & safety: Carbon-based; metal-free and non-electrically conductive.
• Operating range: −50 °C to +150 °C continuous use.
• Material properties: Viscosity ~31,600 Poise; Volume resistivity ~3.8×10¹³ Ω·cm.
• Includes: Application spatula.
10) Seagate Exos X24 20 TB Enterprise HDD (ST20000NM002H)
• Interface & form factor: SATA 6 Gb/s, 3.5″, 7200 RPM.
• Reliability: 2.5 M-hr MTBF; 5-year limited warranty; 550 TB/yr workload rating.
• Performance: Up to ~285 MB/s transfer rates; advanced write caching.
• Design: Helium-filled; optimized for hyperscale/data-center use (low power/weight).
11) DiliVing SlimSAS x8 (SFF-8654-74P) to 2× SlimSAS x4 (SFF-8654-38P) 80 cm Y-Cable
• Connectors: SFF-8654 74-pin SlimSAS x8 to two SFF-8654 38-pin SlimSAS x4.
• Use case: Tri-mode HBA/MegaRAID cabling (SAS/SATA/NVMe per SFF-9402 guidance); vendor notes backplane pinout considerations for NVMe.
• Length: 80 cm; Broadcom MPN 05-60004-00.
12) Broadcom/LSI MegaRAID SAS 9361-16i RAID Controller (PCIe 3.0 x8)
• Ports / throughput: 16 internal SAS/SATA lanes; 12 Gb/s SAS capable.
• PCIe interface: PCIe 3.0 x8 (low-profile card).
• RAID levels: 0/1/5/6/10/50/60.
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