Attachment 1 Statement of Work.docx
DOCX document 64 KB Posted
- Attached to
- Solicitation for Fast Near Infrared (IR) Camera
- Solicitation number
- 1333ND26QNB030422
About this file
This is a Statement of Work for the procurement of a Fast Near-Infrared Camera system by the National Institute of Standards and Technology (NIST) to support semiconductor metrology research under the CHIPS Metrology Program. The project, titled "Optical Impurities Analysis of Semiconductor Gases for Enhanced Quality Systems," conducted by NIST's Chemical Sciences Division of the Material Measurement Laboratory, requires a complete imaging system to enable laser diagnostics and spectral reference data collection for specialty semiconductor-grade gases and trace species detection.
The procurement includes four line items: (1) a Fast Near-Infrared Camera with InGaAs sensor (640x512 pixels, 20-micron pixel pitch, 1 millisecond minimum exposure time, 1000 Hz full frame rate, 100,000 Hz sub-window frame rate, and 16 gigabytes internal memory); (2) a Short-Wave Infrared Lens with 22-28 mm focal length and f-number of 1.4±0.4; (3) a Camera Link image acquisition card with PCIe interface and 5-meter cable; and (4) a Camera Software Development Kit compatible with MATLAB 2024 or newer. All items must be new, original manufacturer equipment without gray market components. Delivery is F.O.B. Destination to NIST's Gaithersburg, Maryland facility within twenty weeks after receipt of order. Payment is contingent upon 100% completion, installation, acceptance, and successful testing demonstrating conformance to technical specifications, with no advance payment authorized and no partial shipments accepted. The Government reserves the right to conduct performance tests including imaging through a custom dispersive spectrometer and quality assurance testing within 30 days of receipt. The contractor must provide a one-year warranty commencing upon Government acceptance and comply with NIST's cybersecurity and privacy requirements consistent with FISMA, OMB Circular A-130, and NIST SP 800-171, including data encryption, access controls, multifactor authentication, vulnerability scanning, and incident response procedures.
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| File | Type | Posted |
|---|---|---|
| Attachment 2 Applicable Provisions and Clauses.docx | DOCX document | |
| Solicitation 1333ND26QNB030422.docx | DOCX document |
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STATEMENT OF WORK
Title: Fast Near-Infrared Camera Lab: MML (646.10)
I. BACKGROUND INFORMATION
The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps the National Institute of Standards and Technology (NIST) will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing.
The CHIPS Metrology Program includes research in Grand Challenge 1, Metrology for Materials Purity, Properties and Provenance. To address this Grand Challenge, the project, Optical Impurities Analysis of Semiconductor Gases for Enhanced Quality Systems, conducted by the NIST Chemical Sciences Division of the Material Measurement Laboratory seeks to procure a Fast Near-Infrared Camera to perform broadband spectroscopy in support of spectral reference databases with tens of thousands of users, as well as to enable new laser diagnostics of complex semiconductor process and specialty semiconductor-grade gases.
II. PURPOSE
To improve and enable laser diagnostics in the semiconductor R&D space, spectral reference data is required to enable the quantitative detection of trace species in gases, plasmas and interfaces. The measurement of spectral reference data benefits from laser sources and spectrometers with broad spectral coverage, intrinsic frequency accuracy, and rapid acquisition rates. Therefore, we required a Fast Near-Infrared Camera to study specialty semiconductor-grade gases and reference materials for trace amounts of numerous molecular species, and to evaluate dispersive spectrometer performance to establish traceable gas calibration protocols.
III. MINIMUM REQUIREMENTS
The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.
Line Item 0001:
Description: Fast Near-Infrared Camera Quantity: One (1) A. Technical Specifications
a. InGaAs sensor type
b. Sensor size 640 pixels by 512 pixels
c. Sensor pixel pitch ≤20 microns
d. Minimum exposure time ≤1 μs
e. Maximum full frame rate ≥1000 Hz
f. Maximum sub-window frame rate ≥100 000 Hz
g. Dark current ≤1 megaelectrons per second (Me−/s)
h. Temperature calibration for use without imaging lens
i. Minimum 16 gigabytes of internal memory
j. Well depth ≥1 megaelectrons (Me−)
k. Trigger input
l. Trigger output
Line Item 0002:
Description: Short-Wave Infrared Lens Quantity: One (1) A. Technical Specifications
a. Lens focal length between 22 mm and 28 mm
b. Lens f-number of 1.4 ± 0.4
c. Lens removable for camera operation without manufacturer-supplied lens
Line Item 0003:
Description: Camera Link image acquisition card Quantity: One (1) A. Technical Specifications
a. Frame grabber compatible with Camera described in Line Item 0001
b. Camera Link acquisition card with PCIe interface
c. Camera Link cable to communicate with Camera described in Line Item 0001
i. Cable length ≥5 m
Line Item 0004:
Description: Camera Software Development Kit Quantity: One (1) A. Technical Specifications
a. Software development kit (SDK) for Camera described in Line Item 0001
i. SDK compatible with MATLAB 2024 or newer
ii. SDK enables computer operation of camera functions
IV. SCHEDULE OF DELIVERABLES
| Deliverable Number |
| Description |
| Quantity |
| Due Date |
Place of Delivery
| 1 |
| Fast Near-Infrared Camera |
| One (1) |
| No alter than twenty (20) weeks after receipt of order (ARO) |
| NIST (Gaithersburg |
| 2 |
| Short-Wave Infrared Lens |
| One (1) |
| No later than twenty (20) weeks ARO |
| NIST (Gaithersburg) |
| 3 |
| Camera Link acquisition card |
| One (1) |
| No later than twenty (20) weeks ARO |
| NIST (Gaithersburg) |
| 4 |
| Software Development Kit |
| One (1) |
| No later than twenty (20) weeks ARO |
| NIST (Gaithersburg) |
V. DELIVERY TERMS
Delivery shall be F.O.B Destination (or equivalent incoterms, such as DDP) and shall occur in accordance with the delivery due dates provided in the above table.
FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery.
The contractor shall deliver all Line Items to:
National Institute of Standards and Technology Shipping and Receiving 100 Bureau Drive, Building 301 Gaithersburg, MD 20899 C/O Adam J. Fleisher, Building 221, Room A117
VI. INSPECTION & ACCEPTANCE
In addition to the inspection and acceptance terms articulated in the specific FAR clause 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.
Performance Tests:
1. Imaging of laser transmission through a custom, home-built dispersive spectrometer.
NIST may choose at its discretion to forego this part of acceptance testing.
A visual inspection of the equipment will be performed by the NIST Technical Point of Contact (TPOC) to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.
Ownership of the equipment shall transfer to NIST upon acceptance by the Government.
The Government will test, inspect, and accept or reject the equipment within 30 days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.
VII. WARRANTY
The contractor shall warranty the entire system for a period of a minimum of one (1) year in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government.
VIII. PAYMENT SCHEDULE
Advance payment is not authorized. The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document accordingly:
1) 100% after installation and acceptance by the TPOC of fully installed system, AND
2) After the successful completion of the testing requirements set forth in this document, AND
3) After successful demonstration by the instrumentation that it performs IAW the technical requirements set forth in this document AND
4) After receiving an invoice submitted properly, IAW the purchase order terms and conditions.
NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.
IX. CYBERSECURITY PRIVACY REQUIREMENTS
NIST seeks a solution that provides security and privacy protection consistent with requirements defined by applicable federal laws, regulations, policies, and standards (e.g., the Federal Information Security Management Act (FISMA), OMB Circular A-130, and FIPS Publication 200). The solution provider (including subcontractors) may meet these requirements through various means, including but not limited to FedRAMP authorization, current third-party assessments (e.g., SSAE, PCI), and/or responses to NIST special publication control set SP 800-171.
Minimally Acceptable Controls
· System security plan describing physical, technical, and administrative controls implemented to protect systems and sensitive personally identifiable information (SPII).
· IT management processes to establish and manage secure configuration baselines including routine patching for all operating systems and applications.
· Access to SPII is restricted to those with a need to know. Personnel with access to SPII have background investigations performed (e.g. criminal, financial etc.), and are trained on secure handling of SPII.
· Access Controls for SPII meet or exceed industry best practices for access and identification control including, but not limited to, connectivity to servers and databases, multi-factor authentication for remote accesses for administration, secure configurations for any devices accessing the system, and strong physical security for any place where the data is accessed.
· The solution supports multifactor authentication for users and/or supports integration with customer federation services for Single-Sign capability.
· Processes for scanning on a continual basis for vulnerabilities and proper configurations for all aspects of the system, as well as processes for timely mitigation of findings.
· Auditing and Incident Response processes including customer notification of suspected or actual incidents and logging with sufficient information to perform forensics on any incident. Processes for notifying and providing appropriate mitigations, including but not limited to credit monitoring services, for subsidy applicants in the event of suspected or actual incidents.
· SPII is encrypted in transit using TLS 1.2 or better and encrypted at rest in all places the SPII is stored. All encryption algorithms and modules are FIPS 140-2/140-3 validated.
If unable to meet any of the requirements listed above, the solution provider may provide details of mitigations or alternative protections in place to ensure the appropriate handling and protection of SPII.
If the solution provider provides services to other Federal agencies, provide a general description of the security risk management approach and client point of contact.
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