Attachment 1 - Statement of Work.docx

STATEMENT OF WORK

Title: Data Acquisition System

I. BACKGROUND INFORMATION

The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within the Engineering Laboratory is seeking a Data Acquisition System to collect in-situ resistance-based measurements throughout the structure of advanced test vehicles during accelerated aging experiments as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.

The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research-development-programs/metrology-program.

II. PURPOSE

The Infrastructure and Materials Group requires the acquisition of a Data Acquisition (DAQ) system. This DAQ system is essential to our CHIPS project focused on reliability of advanced packaging in heterogeneously integrated semiconductor devices. This capability directly supports the CHIPS R&D Metrology Program’s Grand Challenge to enable metrology for long-term aging studies of integrating components in advanced packaging. By providing the semiconductor industry with an accurate material property database of polymeric packaging components throughout long-term aging and a new, more accurate reliability model, long-term reliability design efficiency (both time and cost savings) will be greatly improved.

This DAQ system will allow for in-situ temperature and resistance measurements throughout the interposer structure of advanced test vehicles during accelerated aging at variable temperature, humidity, and pressure. These data will be used to assess material property and performance changes in polymeric components (e.g., underfills, redistribution layers, and thermal interface materials) used in advanced packaging of heterogeneously integrated semiconductors. This is a critical requirement to study the impact of different long-term aging environment (e.g. the impact of different thermal history) experienced by real-world semiconductor devices. This type of information is critical for accurate reliability model development, and no such database is currently available to stakeholders, limiting the ability to produce accurate advanced packaging reliability models. The data collected using the DAQ system will be provided as part of an open-source database and will also be used as inputs for developing a new reliability model, both of which will be provided to industry stakeholders to address this critical need.

III. MINIMUM REQUIREMENTS

The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Line Item 0001:

Description: DAQ System Quantity: 1 A. Technical Specifications

a. Samples

i. DAQ system will primarily be used to measure resistance and resistance-based temperature changes throughout an interposer structure (e.g., underfill, redistribution layer, thermal interface layers) during accelerated aging.

ii. 300-400 wires will be measured for each sample.

iii. Low current/voltage measurements required, as the expected resistance measurement will not exceed 5V.

b. Channels

i. Minimum of 125 4-wire channels (to accommodate a minimum of 500 wires).

ii. Channels must be compatible with 2-wire and 4-wire resistance-based measurements.

c. Desired DAQ system specifications. Other specifications will be considered so long as they can accommodate the low current/voltage resistance measurements required to monitor the specified samples.

i. Max volts +/- 300 V. Lower max voltages will be considered.

ii. Minimum scan rate of 100 channels/second.

iii. Max current 1 A.

iv. Resistance range 100 Ohms to 1 GOhm.

v. Target basic resistance accuracy of 0.004 % and basic DC voltage accuracy of 0.003 %.

d. Must accommodate screw connections for input wires.

e. Data logging software must be included.

i. Data analysis and export capability

ii. Must be compatible with Windows 10/11

f. Environment

i. Measurements will be conducted on samples while under variable environmental conditions (e.g., temperature, humidity) using an environmental chamber.

IV. SCHEDULE OF DELIVERABLES

Place of Delivery

V. DELIVERY TERMS

Delivery shall be F.O.B Destination (or equivalent incoterms, such as DDP) and shall occur in accordance with the delivery due dates provided in the above table.

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery.

The contractor shall deliver all Line Items to:

National Institute of Standards and Technology Shipping and Receiving 100 Bureau Drive, Building 301 Gaithersburg, MD 20899

VI. INSPECTION & ACCEPTANCE

In addition to the inspection and acceptance terms articulated in the specific FAR clause that allows the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Performance Tests:

1. Plug in equipment and ensure it turns on and runs as expected.

NIST may choose at its discretion to forego this part of acceptance testing.

A visual inspection of the equipment will be performed by the NIST POC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.

Ownership of the equipment shall transfer to NIST upon acceptance by the Government.

The Government will test, inspect, and accept or reject the equipment within 14 days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.

VII. WARRANTY

The contractor shall warranty the entire system for a period of a minimum of 12 months after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government and at a minimum shall include the following:

Major defects in materials or workmanship including structural, operational, or functional issues that compromise product performance under normal use.

VIII. PAYMENT SCHEDULE

Define how the contractor will be paid if more information besides what is included in the payment clause is needed. If firm-fixed-price construction, for example, it may warrant further definition.

The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document, upon receipt of a proper invoice.

1. 100% after installation and acceptance by the POC of fully installed system

NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.

IX. CYBERSECURITY PRIVACY REQUIREMENTS

NIST seeks a solution that provides security and privacy protection consistent with requirements defined by applicable federal laws, regulations, policies, and standards (e.g., the Federal Information Security Management Act (FISMA), OMB Circular A-130, and FIPS Publication 200). The solution provider (including subcontractors) may meet these requirements through various means, including but not limited to FedRAMP authorization, current third-party assessments (e.g., SSAE, PCI), and/or responses to NIST special publication control set SP 800-171.

Minimally Acceptable Controls

· System security plan describing physical, technical, and administrative controls implemented to protect systems and sensitive personally identifiable information (SPII).

· IT management processes to establish and manage secure configuration baselines including routine patching for all operating systems and applications.

· Access to SPII is restricted to those with a need to know. Personnel with access to SPII have background investigations performed (e.g. criminal, financial etc.), and are trained on secure handling of SPII.

· Access Controls for SPII meet or exceed industry best practices for access and identification control including, but not limited to, connectivity to servers and databases, multi-factor authentication for remote accesses for administration, secure configurations for any devices accessing the system, and strong physical security for any place where the data is accessed.

· The solution supports multifactor authentication for users and/or supports integration with customer federation services for Single-Sign capability.

· Processes for scanning on a continual basis for vulnerabilities and proper configurations for all aspects of the system, as well as processes for timely mitigation of findings.

· Auditing and Incident Response processes including customer notification of suspected or actual incidents and logging with sufficient information to perform forensics on any incident. Processes for notifying and providing appropriate mitigations, including but not limited to credit monitoring services, for subsidy applicants in the event of suspected or actual incidents.

· SPII is encrypted in transit using TLS 1.2 or better and encrypted at rest in all places the SPII is stored. All encryption algorithms and modules are FIPS 140-2/140-3 validated.

If unable to meet any of the requirements listed above, the solution provider may provide details of mitigations or alternative protections in place to ensure the appropriate handling and protection of SPII.

If the solution provider provides services to other Federal agencies, provide a general description of the security risk management approach and client point of contact.

image1.jpeg