APECs_sources_sought_posted_27_Mar_2014.pdf
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- Advanced Processing of Electronic Components for Space (APECS) Federal contract opportunity
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Sources Sought for Advanced Processing of Electronic Components for Space (APECS)
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| BAA_FINAL.pdf | ||
| FBO_Attachment_B_Reps_and_Certs_APECS__FINAL.pdf | ||
| FBO_Attachment_A_Model_Contract.pdf | ||
| FBO_Attachment_C_Cost_Proposal_Instructions_(Non-APC)__Tailored_26Oct_2015_FINALv1.pdf |
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Research and Development Sources Sought Air Force Research Laboratory Space Vehicles Directorate
Advanced Processing of Electronic Components for Space (APECS)
27 March 2014
1. CONTRACTING OFFICE ADDRESS AND POINTS OF CONTACT (POC)
Address Department of the Air Force, Air Force Research Laboratory (AFRL), Space Vehicles Directorate Contracting Office, AFRL Det 8 /RVKVE, 3550 Aberdeen Ave. SE, Kirtland AFB NM, 87117-5776
Contracting POC Contract Specialist, Adrian J. Martinez; adrian.martinez.3@us.af.mil Contracting Officer, Rita A. Varley; rita.varley@us.af.mil
Technical POC Program Manager, Clay Mayberry; clay.mayberry@us.af.mil Program Manager, Jesse Mee PhD; jesse.mee@us.af.mil
Note: See paragraph 4 on how to request clarifications.
2. GENERAL INFORMATION
a. Background
Satellite based missions, from bus to payload, depend on various types of electronic systems that must perform their function efficiently and persist in the harsh environment of space. These two requirements, along with the risk adverse culture of satellite system designers, have slowed technology progression of advanced satellite systems. Conversely, the volume of data generated from telecommunication systems has not slowed and threatens to outstrip the capacity of electronics systems. The Air Force Research Laboratory, Space Electronics Branch, is taking a bottom up approach to improve electronic circuits recognizing that opportunities exist to couple new material systems and geometries that could have inherent long device lifetimes and tolerance to radiation damage in terms of both ionizing radiation and high energy particles while dramatically improving performance. The Space Electronics Branch is interested in investigating technology development from ideas to working prototypes using new semiconductor material systems if necessary to develop monolithic circuits that will enhance the performance, longevity, efficiency, and environmental tolerance advanced space based missions.
Companies with the necessary fabrication characterization tools are sought to develop and test materials, prototypes and devices, to enable new types of processors, memories non-volatile and cache memories, optical interconnects, opto-electronic based circuits and processors, and integrated smart sensors.
b. Intent
The Government is seeking to identify sources capable of performing research and development (R&D) activities to explore the implementation of new monolithic devices to coalesce functionalities into a single chip or to enable to circuits and optoelectronic devices and interconnects based on the antimonides based material systems.
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c. Objective
The Government is seeking innovative techniques towards advancing the state-of-the-art technologies for investigating new semiconductor material systems grown essentially defect free using standard semiconductor growth techniques. These standard techniques consist of both molecular organic chemical vapor deposition and molecular beam epitaxy. Both material growth techniques are required in order to compare the effect of growth quality as a function of growth parameters such as temperatures, activation energies of the species, doping profiles, and to explore selective growth techniques. Additionally, the ability to completely characterize material systems is necessary using focused ion beam, transmission and scanning electron microscopy, optical and electrical characterization as necessary. Access to complete material growth, device fabrication and monolithic circuit fabrication facilities are required to complete structure and device processing including circuit prototype fabrication. The ability to perform electron beam lithography is a benefit however any competing technology that can print at the nanoscale is acceptable. Recognizing that an advance in chip manufacturing technology would represent an investment of billions of dollars, the devices and circuits generated from this effort are required to be fabricated in state-of-the-art facilities using standard lithography. Access to relevant environmental testing of materials and devices such as high energy x-ray radiation producing machines and exposure to high energy particles to investigate single event effects should be available.
Companies should consider trusted foundries for fabrication that involve technologies subject to U.S.
Export Control Laws and International Traffic in Arms Regulation (ITAR).
3. REQUIRED RESPONSE, FORMAT, AND SUBMISSION
a. Format and Page Limitation
Submitted responses should be provided on standard letter size 8-1/2 by 11 inch paper, limited to a maximum of twenty pages, single-sided, double-spaced pages excluding proposing the company’s profile.
The company may use oversized pages (including “foldouts”) where appropriate to contain graphic presentations. Oversized pages do not count as extra pages within the page limitations. Existing commercial documentation and product literature can also be submitted and is not subject to a page limitation.
b. Statement of Capabilities (SOC)
All companies capable of performing this work are invited to submit a SOC, to include sufficient written information to indicate capacity and any other specific and pertinent information that would enhance our evaluation. Any responses received not addressing items 1-8 may be considered as incapable of meeting the Government objective. NOTE: The Government is not required to provide feedback.
(1) Plan or strategy to meet the Government objective;
(2) Time phased development plan (schedule) that would mature technology development to a
DoD Technology Readiness Level (TRL) 5.
(http://www.acq.osd.mil/chieftechnologist/publications/docs/TRA2011.pdf)
(3) Rough order of magnitude cost estimate correlated to schedule;
(4) Premises and assumptions;
(5) Risk assessment;
(6) Alternate options;
(7) Feedback/Comments; and
(8) Proposing Company profile
(a) Company Name and Mailing Address
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(b) CAGE Code and DUNS Number
(c) Point(s) of Contact
(d) POC Telephone Number and e-mail Address
(e) Business Size Status (i.e., 8(a), HUBZone, Woman-Owned, Service Disabled Veteran-
Owned, Small Business, Large Business, Historically Black College/University) under NAICS 541712; the associated size standard is 1000 employees
(f) DCAA approved accounting system in place to adequately track and accumulate expenditures
(g) Relevant experience in the past five years in the technical areas of interest
(h) Availability of an adequate number of qualified personnel to support the effort
(i) Data Assertions (DFARS 252.227-7017)
Based on review of SOCs received, the Government reserves the right to set-aside all or portions of this requirement for small business concerns.
If a solicitation is released, it will be synopsized on the Federal Business Opportunities (FedBizOpps) website (www.fbo.gov). It is the responsibility of potential offerors to monitor that website for additional information pertaining to this notice or a requirement that may relate to this notice.
a. Submission of Documentation
Submittals should consist of an original plus 3 copies. In addition to the paper submittals, the Government desires an electronic version (CD-ROM) in searchable .pdf or Microsoft Word compatible by MAIL ONLY and received by 29 April 2014, 3:00 PM local time to the Contracting Office at the following address:
AFRL Det 8/RVKVE ATTN: Adrian Martinez 3550 Aberdeen Ave. SE Kirtland AFB, NM 87117-5776
Responses must be unclassified and any proprietary information provided must be portion marked accordingly. To protect such data, each line or paragraph on the pages containing such data must be specifically identified and marked with a legend similar to the following:
“The following contains proprietary information that (name of responder) requests not be released to persons outside of the Government, except for the purposes of review and evaluation.”
4. REQUESTS FOR CLARIFICATION
For technical clarifications, submit a request for clarification(s) in writing to the Contracting Office for any requirement that is unclear by sending an e-mail to the Contract Specialist as identified above.
Any requests for clarification must be received no later than 15 April 2014 COB. Clarifications may be posted as amendments to this notice at www.fbo.gov to benefit all interested parties. Interested parties are encouraged to periodically check the website during the response period for clarifications.
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