ALD SPECIFICATIONS FOR N00173-21-R-TL12 - FINAL.pdf

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Atomic Layer Deposition System Federal contract opportunity
Solicitation number
N00173-21-R-TL12
Issued by
Department of the Navy Secretary of the Navy Office of Naval Research

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This document outlines specifications for a solicitation seeking proposals for an atomic layer deposition system. Key requirements include delivery and installation of an ALD reactor with multiple precursor ports and an integrated in-situ ellipsometer, as well as a load lock transfer system and associated operational control, safety, and documentation components. Proposals are due by a specified date and must demonstrate how offerors intend to meet extensive technical and performance specifications provided in an attachment. The solicitation also includes standard terms for payment, acceptance, and flow down of FAR and DFARS clauses to any subcontractors. The Naval Research Laboratory seeks to procure this system to support its research activities.

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ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 1 OF 11

SPECIFICATIONS FOR ATOMIC LAYER DEPOSITION (ALD) REACTOR

WITH MULTIPLE PRECURSOR DELIVERY PORTS, INTEGRATED IN-SITU

ELLIPSOMETER, AND SINGLE WAFER TRANSFER SYSTEM

I. GENERAL SPECIFICATIONS

A. The required system is a configurable atomic layer deposition (ALD) reactor for the uniform and conformal depositions of oxide, nitride, and metal films with atomic-layer precision onto substrates of high aspect ratio surface topographies.

B. The reactor shall consist of a single hot-walled, viscous flow reaction chamber that is serviced by gas handling, vacuum, and AC heating systems, and is capable of operating in both traditional thermal atomic layer deposition (ALD) and plasma enhanced ALD (PEALD) modes.

C. The system shall be integrated with an automated load lock system for advanced process control, and particulates of ALD byproducts must be prevented from entering the user loading zone and sample loading area.

D. The reactor shall focus precursor at the sample surface and will not contain parts mechanically actuated during processing so as to prevent flaking of ALD particulates onto the substrate surface.

E. The reactor shall accommodate at least 8 precursor ports (with the ability to upgrade to at least 12 precursors) and at least 4 gas lines (with the ability to upgrade to additional gases in the future as required).

F. Additionally, the reactor shall have an integrated in-situ ellipsometer that will provide real-time structural analysis of deposited films.

G. The reactor shall also include additional diagnostic ports for chemical analysis and leak testing leading to advanced process control.

H. The reactor shall be modular so that the system can be upgraded in the future for additional sources, chambers, gloveboxes, pumps, and diagnostic ports.

I. The ALD reactor and the ellipsometer shall be computer controlled.

J. The reactor shall have an integral safety system.

K. Size Constraints—Due to space constraints, the system, including the enclosure, load lock, and loading mechanism (but excluding the control computer console) shall fit within 100” length, 40” width, and 84” height.

II. ALD REACTOR SPECIFICATIONS

A. ALD REACTOR CHAMBER

1. The reactor chamber shall be constructed of stainless steel consistent with commercial high vacuum processes and must be copper-free. The design should allow for rapid heating of samples, efficient vapor and gas delivery, and straightforward in situ real-time analysis of deposition (via ellipsometry, QCM, ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 2 OF 11

RGA, etc.).

2. The use of shutters can disrupt gas flow and cause formation and shedding of particulates that degrade the uniformity and purity of the deposited film.

Therefore, the chamber shall not use mechanical isolation devices to shutter the plasma source nor to protect port windows from unwanted film deposition.

3. The chamber shall have at least two ports directed at the projected loaded sample surface with ideal take-off angles (65o – 75o) for in situ ellipsometry measurements and one dedicated valve port for easy helium mass spectrometer leak detection.

4. The reactor chamber shall be heated to achieve hot wall operation above 200oC. The reactor lid and precursor inputs shall be clad with aluminum blocks to maintain heating uniformity. The reactor chamber, lid, and exhaust shall be independently actively heated in order to create a thermal gradient, thereby avoiding cold spots within the system that could be a potential cause for condensation and contamination.

5. Reactor shall be equipped with a heated chuck that is able to accommodate sample sizes ranging from chips of a few mm extent to 150 mm diameter substrates and be heated to above 300oC.

6. Sample loading shall be consistent with automatic load lock operation. The sample entry port shall be gate-valved. The gate-valve shield shall incorporate an inert gas shroud or equivalent mechanism to block any deposition or particles from getting into the gate-valve and sample loading areas and provide a clean transfer.

7. The reactor design shall be completely modular to allow for system modifications and upgrades including ozone integration, replacement chamber, addition of in situ diagnostic ports, and/or addition of transfer systems to incorporate into a cluster tool.

B. GAS DELIVERY SYSTEM

1. The system shall separate the precursors and co-reactants before injection into the chamber through their respective reactor inputs (“Positions”) that feed into the reactor, after which the reactants are uniformly distributed across the substrate.

i. At least one Position shall be a single vapor delivery source for high vapor pressure liquids/solids. This source shall:

(a) be able to accommodate at least one ampule.

(b) be modular to accommodate future upgrades to the number of precursor sources

ii. At least one Position shall be flow-through vapor delivery sources for low vapor pressure liquids or solids.

(a) The flow through sources shall have the ability to charge

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 3 OF 11

the bubbler with inert gas or use a software controlled bypass valve allowing the cylinder to behave as a vapor draw system.

iii. At least one Position shall be a multi-source vapor delivery source for moderate to high vapor pressure liquids/solids. This source shall:

(a) Be able to accommodate at least five ampoules connected in parallel.

(b) Have an independent input line for a carrier gas.

(c) Have independently controlled heater zones (one at the input line, one at the valve, and one for each source ampoule) with temperature range up to 250oC.

2. The system shall contain at least 8 total precursor injection points for metalorganic and co- reactant precursors with the ability to upgrade to at least 12 precursor injection points.

i. Each of the precursor delivery lines (Positions) s h a l l be equipped for uniform heating, for example by cladding with fit for purpose thermal reservoir blocks and heating with resistive heating tapes and insulating jackets around this cladding/ thermal reservoir.

ii. Heated surfaces, including all parts of each gas delivery line from the precursor bubbler to the entry port into the reactor, shall be insulated for efficient and stable operation.

3. Each source shall include a fast actuating ALD valve capable of operation at 200oC with an actuation response time of 20 x 10-3 seconds or less. The valve control signal shall have a resolution of below 20 microseconds. Constant purging of ALD valves shall be enabled to ensure cleanliness and reasonable operating life, for example by using a 3- port design.

4. For the purpose of transporting metalorganic precursors and co-reactants to the reactor, each input line shall have independent carrier gas flow and will be regulated by a mass flow controller (0-180 standard cubic centimeters per minute or more) of the serial control interface and metal sealed variety. Each mass flow controller shall be compatible with argon or nitrogen gases and equipped with an isolation valve.

5. The system shall include a plasma source, preferably an Inductively Coupled Plasma (ICP) plasma source (See 3. Plasma Source) that can be used for plasma-enhanced ALD.

i. This source shall include at least four plasma gas lines and must be expandable to up to 6 or more plasma gas lines. Each line shall be constructed of materials and fittings compatible with the use of hydrogen, oxygen, argon, nitrogen, and ammonia.

ii. Each plasma gas source line flow shall be metered by mass flow controllers (control range: 0-180 standard cubic centimeters per minute

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 4 OF 11

or more) of the serial control interface and metal sealed variety with both upstream and downstream isolation valves with indicator switches.

iii. System shall include safety features to prevent mixing of incompatible gases, (such as hydrogen and oxygen), such as a gas compatibility programmable logic controller (PLC).

iv. Ability to include at a later time an ozone source that delivers ozone through the plasma source when enabled.

6. All precursor sources (metalorganic or gas) shall be housed in a vented gas cabinet integrated onto the system enclosure that permits the mounting of up to two additional gas sources and their attendant mass flow controllers.

7. All integral fittings of the precursor delivery system (required and optional) shall be of the metal-sealed type.

C. PLASMA SOURCE

1. System shall be equipped with a remote plasma source such as an inductively coupled high-density plasma (ICP) source mounted at the top of the reactor, above the sample chuck.

2. The plasma source shall be capable of pulsed operation with less than 1 sec on/off time.

3. The plasma source shall come complete with a differentially pumped remote plasma source, RF power supply, automated matching network, and suitable software interfacing to allow control through the system’s operational control system (see below).

4. Continuous operation (i.e. not pulsed) of the plasma can lead to undesired charge incorporation into the deposited films. For reasons already explained, mechanical shuttering must not be included in the chamber operation.

Therefore, the plasma source shall be operated WITHOUT the aid of a shutter during processing and pulsing of the plasma activated precursor species must be accomplished through pulse operation of the plasma source itself.

D. PUMPING SYSTEM

The system shall be a vacuum system with a base pressure of 20 mTorr or less. The vacuum system shall use only oil-free, dry pumps. The vacuum system shall include foreline purge/vent protection and optional foreline throttle valve.

E. REACTOR ENCLOSURE

1. The entire reactor shall be enclosed in a housing with removable panels for easy access and maintenance. The housing must act as a primary barrier to leaks where all doors are to be sealed and no external gas cabinets are required.

2. Due to space constraints, the system including the enclosure (but excluding

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 5 OF 11

the control computer console) shall fit within 100” length, 40” width, and 84” height.

3. The enclosure shall contain ports for connections to an existing NRL fan/duct system.

III. LOAD LOCK TRANSFER SYSTEM SPECIFICATIONS

The Load Lock transfer system shall, A. Contain a single wafer vacuum load lock system with a base pressure of 2x10-6 Torr or less.

B. Have a vacuum system containing a turbomolecular and/or molecular drag pump that is backed by an oil-free, dry scroll pump.

C. Have a high vacuum valve between the load lock and ALD chamber.

D. Have an isolation valve for the turbomolecular and/or molecular drag pump to allow fast pump down and venting of the chamber.

E. Have appropriate gauges to measure the pressure.

F. Be able to automatically transfer substrates from the load lock to the ALD chamber.

G. Have the ability to load 150 mm SEMI spec wafers into the ALD chamber.

H. Have the ability to load substrates from chips to 125 mm SEMI spec wafers with the use of adaptors.

I. Have a port for connection of vacuum diagnostic equipment.

J. Be a module design, allowing for easy install and removal from ALD module

K. Have the ability to land on wheels for easy transport and have the capability to level to the ALD module.

IV. INTEGRATED IN-SITU, DEEP-UV TO NEAR IR

ELLIPSOMETER SPECIFICATIONS

A. The system shall include a means of evaluating the thickness and composition of a stack of films, such as an integrated in-situ multi-wavelength ellipsometer ranging from the deep-UV to the near IR.

B. The ellipsometer shall be able to provide proof of thickness repeatability of ≤ 0.01 nm, for example measuring a calibrated SiO2 film at a fixed angle and ten second averaging with a fixed sample position.

C. The ellipsometer shall have the ability to perform true real-time measurements of the ellipsometric parameters psi, delta and %Depolarization with sub-monolayer sensitivity on the sample during the ALD process.

D. The ellipsometer shall be attached to the main ALD system chamber with a fixed takeoff angle between 65o and 75o.

E. The chamber ellipsometer ports shall not use mechanical isolation devices to protect port windows from unwanted film deposition. The use of shutters can lead to undesired

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 6 OF 11

flow disruptions, as well as the formation of particulates that can negatively impact the process. Therefore, a method of minimizing precursor interactions with the ellipsometer ports, such as gas shrouding or purging, shall be incorporated into the ALD chamber design, as discussed in the ALD reactor specifications.

V. OPERATIONAL CONTROL

A. The ALD reactor shall be computer controlled via an electronic control unit that is also interfaced to a computer system with the following properties:

1. PC-based current generation computer system with

i. A hard disk memory storage of at least 500 Gbytes,

ii. System memory of at least 8 Gbytes,

iii. One flat panel monitor of 21-inch or larger diagonal.

iv. Ethernet interface to ALD control electronics.

2. Running on the computer system will be a dedicated software package for control and monitoring the process,

i. The software shall provide a graphical user interface (GUI) for reactor control and monitoring.

iii. The software shall allow development of processes and come with example processes for growing films by thermal ALD and plasma enhanced ALD (PEALD), and be able to load and save user developed recipes.

iv. The software shall permit control of each aspect of the process in either manual or recipe (automatic) modes of operation.

v. The software shall provide precursor heating control in order to prevent thermal decomposition of the precursors.

vi. The software shall allow separate control of the full range of each variable of the growth process, including, substrate temperature, precursor temperature, gas mass flows, gas delivery selection through valve actuation, pulse time (0.010 to 2 seconds), plasma source conditions, etc.

viii. The software shall provide a real-time plotting of precursor pulses during growth with < 25 Hz resolution or better.

ix. The software shall provide real-time ellipsometer feedback during film processing to chart thickness and other signals and allow the ellipsometer output to trigger a stoppage in growth when a particular target parameter value is reached.

x. The software shall provide automatic data logging of login/logout events, recipes executed, process variables, ellipsometric feedback, system warnings, alarms, and status messages.

xi. The software shall be capable of dynamic process adjustment and

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 7 OF 11

emergency shutdown in the event of any process parameter moving out of a predefined window.

xii. The software shall have safety monitoring that will be capable of triggering a safety shutdown when there is a major system failure.

3. The software shall be flexible for new operations and upgrades as additional functionalities are added free of charge.

B. The control system shall include

1. appropriate interlocks to ensure that the tool is safely operated.

2. an ozone sensor and appropriate interlocks to the tool.

3. the ability to prevent the unwanted mixing of precursors. For example: limiting the explosive combination of H2 and O2 and limiting undesirable cross contamination of precursors.

C. The ellipsometer also shall be computer controlled via an electronic control unit that is interfaced to an independent computer system, separate from the ALD reactor computer.

i. The software shall provide a graphical user interface (GUI) for data acquisition, data analysis, optical simulations, and routine calibrations.

ii. The software shall allow for complete analysis of the thin films and provide a database of optical parameters and models associated with a variety of commonly known materials.

2. Furthermore, the ellipsometer shall be able to interface with the main ALD system’s operating software allowing for data acquisition and end-point control.

VI. SAFETY

The ALD reactor shall have a safety system that addresses each of the following requirements:

A. Continuous monitoring of electronic control unit and its onboard microprocessors. In case of failure or malfunction, system shall shut down all heaters and the RF power to the plasma, set all flows to zero and close all valves.

B. Continuous monitoring of control software communications. In case of failure or malfunction, system shall shut down all heaters and the RF power to the plasma source, set all flows to zero and close all valves.

C. An emergency main power off circuit shall be provided that can be manually or automatically activated.

D. Process control software and associated control electronics shall prevent operation that could damage the equipment or create a hazard as related to vacuum, heating, cooling, and other hardware interlocks including those for the plasma source.

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 8 OF 11

E. All heater sources shall operate with an adjustable power limit to prevent overheating of components.

F. All hot zones shall be insulated and labeled with safety warnings.

G. The following safety interlocks shall be included:

1. Process interlock for vacuum pressure, by which a process cannot start unless pressure is < 1Torr.

2. Process interlock with thermal monitor. If any temperature monitor is not producing a signal, process cannot be started.

3. Use of a gas compatibility programmable logic controller (PLC) to prevent mixing of incompatible gases, such as hydrogen and oxygen.

4. Additional interlocks available for future upgrades – load lock, turbomolecular pump, and other energetic sources (other than primary plasma source).

H. System shall provide up to two emergency main power off buttons.

I. Each alarm shall be announced by visual signal identifying the alarm on the process display monitor and logged into the data logging portion of the dedicated ALD system operating software.

VII. INSTALLATION

The installation of the system shall be performed by engineers supplied by the Contractor. NRL shall be responsible for providing the Contractor with access to the space where the tool will reside, all of the required facility utilities, which include power, ventilation, and cooling water supplies that will be prepared to the Contractor’s specification.

NRL will provide all of the required gas sources and these will be in-place as per any Contractor’s specifications.

A. In order to facilitate this, at the time of the contract award, the Contractor shall provide NRL with all the facility’s requirements that are necessary so that all of the required utilities will be in-place prior to the time of the installation.

B. The Contractor shall provide personnel who will install the tool into the NRL facility. The Contractor shall inform NRL at the time of award of material and personnel requirements for the installation process. The Contractor shall also oversee the unpacking of the tool, positioning, and subsequent installation. The Contractor shall be responsible for ensuring that safety procedures are followed during this process.

C. Upon completion of the physical installation, the Contractor supplied personnel shall ensure that all components of the system are properly operating. They will then proceed to ensure that all of the specifications are met as detailed under Performance Requirements within 15 days of completion of physical installation.

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 9 OF 11

VIII. TRAINING

A. The Contactor shall provide training for NRL personnel on the use, maintenance and basic repair procedures for the reactor and load lock.

Information will be provided regarding the various components of the reactor system and their function. As part of the training NRL personnel will be taught how to grow Al2O3, HfO2 and AlN thin films. This training shall include all of the procedures including wafer preparation, wafer insertion into the system, bringing the system up to operating temperatures, performing the growth and subsequent system cool down, venting and wafer removal. This training shall be performed under the supervision of Contractor supplied personnel. This training shall be done in a single stage and coordinated with installation at NRL and be for a period of at least three days.

B. The training shall include both the hardware and software aspects of the system. NRL personnel will be shown how to configure a growth run, shown which sensor readings are key to a good run, how to interpret the variations in sensor readings and when to stop a run.

C. The Contractor shall provide training for NRL personnel through a Sub-contractor on the use, maintenance and basic repair procedures for the in-situ ellipsometer separately from the installation of the ALD. Information shall be provided regarding the various components of the ellipsometer and their function. The on-site training should be done in a single stage and be for a period of at least one day.

D. The training program for both the ALD system and the in-situ ellipsometer shall be for a minimum of two (2) and as many as five (5) NRL personnel.

IX. DOCUMENTATION:

A. Upon delivery, the Contractor shall provide at least two complete document sets (one printed and one electronic) written in the English language containing, operating manual, service manual, sub-suppliers manuals of the various subsystems components, list of components, flowcharts, wiring diagrams, list of interlocks, factory settings, safety system overview, details on obtaining on-line or telephone assistance, and a spare parts list.

B. The Contractor shall supply a set of parameters and processes that will run on the dedicated software program for performing the deposition of aluminum oxide (Al2O3), hafnium oxide (HfO2), zinc oxide (ZnO), titanium dioxide (TiO2), titanium nitride (TiN), and aluminum nitride (AlN) thin films.

C. The Contractor shall provide factory testing and compliance results from the actual system to be installed at NRL and a Certificate of Compliance guaranteeing that all the requirements of this specification have been met.

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 10 OF 11

X. PERFORMANCE REQUIREMENTS

A. The Contractor shall perform testing at the factory on the actual equipment to be installed at NRL to demonstrate the following:

1. No leaks in the reactor tubing and seals as detected by a calibrated helium leak detector down to < 5x10-9 Torr-l/s;

2. Base pressure in the range of <5x10-2 Torr

3. Process gas flows stable within ± 5% at argon flow rates characteristic of process conditions (as specified from sample recipes in Documentation)., for a period of one hour

4. Substrate heater temperature elevated to above 350oC and stable within ± 5% for a period of two hours under argon flow rates characteristic of process conditions.

5. Delivery line temperatures and valve assemblies (All source lines, chamber lid, MFCs, and isolation valves) maintaining temperature uniformity ≤ ± 7% with an argon flow rate characteristic of process conditions for a period of one hour.

B. In addition, the Contractor shall demonstrate the performance of the actual reactor to be installed at NRL, by growing the following layers in it on 150 mm Si wafers:

1. Al2O3 film greater than 100 nm thick with thickness variation of ≤ ± 5% or better using both thermal and plasma enhanced ALD. The index of refraction of these films shall be ≥ 1.60 with uniformity ≤ ± 5.0% or better at a wavelength of 633nm.

2. HfO2 film greater than 100 nm thick with thickness variation of ≤ ± 5% or better using thermal ALD. The index of refraction of these films shall be ≥

2.00 with uniformity ≤ ± 5.0% at a wavelength of 633nm.

3. AlN greater than 100nm thick film with thickness variation of ≤ ± 5% or better uniformity using plasma enhanced ALD. The index of refraction of these films shall be ≥ 1.92 with uniformity ≤ ± 5.0% or better at a wavelength of 633nm. Films must contain oxygen content ≤ 2.5%, as measured by XPS.

C. NRL will provide acceptance testing of said films through a combination of ellipsometry, x-ray photoelectric spectroscopy (XPS) and atomic force microscopy or step- profilometry measurements.

D. The Contractor shall verify after installation on site at NRL that no significant damage has occurred in transport or installation by repeating the factory tests dictated in Performance Requirements B and C and demonstrating that the results remain within these specifications.

E. The ellipsometer shall be tested separately from the ALD-load lock system by a designated Sub-contractor provided by the original Contractor for compliance with specifications, Integrated In-situ, Deep-UV to Near IR Ellipsometer Specifications.

ALD SYSTEM SPECIFICATIONS N00173-21-R-TL12 PAGE 11 OF 11

XI. WARRANTY

A warranty customary to the Contractor’s standard commercial practices shall be included. The Contractor shall register all equipment requiring warranty by other manufacturers; such warranties shall be effective from the date of system acceptance, by NRL. The warranty terms shall be included in the system price.

SPECIFICATIONS FOR ATOMIC LAYER DEPOSITION (ALD) REACTOR WITH MULTIPLE PRECURSOR DELIVERY PORTS, INTEGRATED IN-SITU ELLIPSOMETER, AND SINGLE WAFER TRANSFER SYSTEM
I. GENERAL SPECIFICATIONS
II. ALD REACTOR SPECIFICATIONS
III. LOAD LOCK TRANSFER SYSTEM SPECIFICATIONS
IV. INTEGRATED IN-SITU, DEEP-UV TO NEAR IR ELLIPSOMETER SPECIFICATIONS
V. OPERATIONAL CONTROL
VII. INSTALLATION
VIII. TRAINING
IX. DOCUMENTATION:
X. PERFORMANCE REQUIREMENTS

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