80TECH24Q0010 _SOW 030724 MD Final.pdf

STATEMENT OF WORK

ADVANCED SPUTTER DEPOSITION FABRICATION TOOL

PVD500

1.0 Introduction/Background: The goal of this procurement is to obtain a thin-film deposition system that will augment and enhance current capability with a newer, more robust deposition capability that will allow production of much larger components. The current system, a Kurt J. Lesker, Co. PVD75, allows for the fabrication of parts up to 5” x 5” having the physical and electrical characteristics desired currently. An advanced radio frequency (RF)/direct current (DC) sputter deposition tool is required to continue and advance current research and development in the Revolutionary Aviation Technologies Branch (RATB) in D331. Equipment currently on hand has size limitations (i.e., the products produced in this system) that preclude the development and production of larger products needed based on the demands presented by modernizing technology and technical requirements dictating performance of said products. An appropriately designed PVD500 will enable the production of much larger samples – up to 12” x 12” – and ensure needed characteristics – previously established with the smaller PVD75 system – are obtainable.

2.0 Scope of Work: This requirement is for the purchase of a Kurt J. Lesker Co. PVD500 RF/DC sputter deposition tool. The tool will provide enhanced capability to that currently in place. The new tool must be compatible – from both a hardware and software standpoint – with the PVD75 presently in use. Further details regarding the applications and use of the current and newly proposed systems are not included in this document due to the proprietary nature of the work conducted in RATB.

3.0 Objectives: The proposed new PVD500 system will allow for the production of much larger articles that will meet the requirements for advanced research and development.

4.0 Description of the Work/Contractor Tasks:

QTY PART # DESCRIPTION

1 FR6 OPEN SYSTEM FRAMEWORK (standard)

• Fully enclosed system base cabinet

• Open access to the chamber

• Leveling pads and caster wheels

• Removable enclosure panels NOTE: Some options selected below may require this option NOTE: Not compatible with load lock assembly

1 CH1 Viewport shutter, manually operated

NOTE: When selecting 350°C heat or greater, viewport shutter is required

1 CH19 Removable 304L Stainless Steel Chamber Liners (2 sets)

1 HP7 3000 L/S CRYO Pump with 3-position gate valve

• This package replaces the High Vacuum Pump in the base system

• Model 9600 compressor, water-cooled compressor

• 3-position gate valve

• Automatic regeneration capability is included through touch screen controller or PC control package

• Cryo compressor is located remotely from system frame, 20 foot helium lines are standard NOTE: This option may extend the quoted delivery and options available. Please contact a KJLC engineer for more information.

1 RP3 Dry Pump EDWARDS XDS35i

• 25 cfm dry scroll roughing pump

• This replaces the oil-sealed pump in the base system NOTE: Roughing pump is located remotely from system frame

3 MSSPL3 TORUS® 6, Source Assembly

• Sources are installed on chamber top-plate in sputter down orientation

• Manually variable source to substrate distance of +/- 4".

• Tilt angle of source is manually adjustable

• Includes ISO flange mounting with off-set for adjustment of source bolt-circle for optimizing source geometry

1 MSSPL4 High Strength Magnet Option For Above Source (each)

2 PS6 TruPlasma 2kW Pulsed DC power supply

1 PS2 KJLC 600W RF power supply with automatic matching network and controller NOTE: Running different size sputtering guns or different strength magnet packs using the same RF tuner should be avoided

1 SFSPL1 Custom Fixture Rotation, 150°C Heating, and bias for

• Variable speed, motor driven rotating platen (up to 20 rpm)

• Accommodates up to 12" x 12" substrate

• O2 compatible, backside 150°C substrate heating via resistive wire

• PID control of temperature

• Provides isolation of the substrate fixture to allow bias up to 300W RF NOTE: Power supply must be selected to utilize substrate bias NOTE: Not compatible with transfer or cooling

1 SOSPL1 300W RF power supply with automatic tuning for substrate bias

• Substrate shutter is recommended with RF bias NOTE: RF bias requires upstream pressure control

1 SMSPL1 KRI eH1000 Ion Source

• End-Hall permanent magnet ion source

- Gridless design for low energy processing

- Modular anode assembly w/ stainless steel, double contour anode

- Single filament for ionization & neutralization

- Stainless steel & Graphite gas reflectors

• High Frequency power supply controller with readout

- Modular architecture

- Filament, Discharge, Auto controller modules

- Switch mode, CE technology

- Local front panel or remote control interfaces

- Digital displays & LED indicators

• 1000 L/sec of high vacuum pumping speed or greater is recommended for optimal ion source operation

1 PC4 Pressure Control (used with Magnetron Sputtering)

• One (1) process gas channel; one (1) Fujikin FCST1000F flow controller (0-100 sccm), all cables, and PID upstream pressure control electronics

• One (1) Inficon CDG025D Capacitance Manometer 100 mTorr (0.13 mbar) pressure transducer

• Orbitally welded gas lines provide maximum vacuum integrity

• All MFC's will be calibrated for N2.

Correction factors are used in eKLipse™ software to adjust to individual gases NOTE: This option is required with magnetron sputtering NOTE: This option is required with RF Bias NOTE: This option is not required with PC3

2 PC5 One additional process gas channel

• Fujikin FCST1000F Mass flow controllers

• MFC's will be calibrated for (0-20 sccm)

• All MFC's will be calibrated for N2.

Correction factors are used in eKLipse™ software to adjust to individual gases

1 FT1 Film Thickness Monitor

• Provides film thickness estimation

• Does not provide the ability to control rates NOTE: No crystal sensors are included with this option

3 CO1 Single crystal sensor

There is a critical need for compatibility between the two systems (PVD75 and PVD500) from both a software and hardware standpoint. In particular, we need to take a library of files (called “recipes”) from the PVD-75 and use them in the PVD-500.

5.0 Deliverables: Items to be delivered include:

• PVD500 main system (to include roughing pump, cryogenic compressor and associated helium cooling lines)

• KJLC eKLipse ADVANCED software package including thickness monitor software

• Associated manuals for power supplies, sputter guns, load/tune hardware, cabinet manual, gate valve, computer, all gauges, temperature monitor, and mass flow controllers

Period of Performance:

44-48 weeks ARO