SATPC0042011 Tab 04 4 SOW.pdf
PDF 154 KB Posted
- Solicitation number
- 80NSSC26939631Q
About this file
This is a Statement of Work for packaging services on NASA-provided photonic integrated circuits (PICs). The contracted vendor shall perform wire bonding to printed circuit boards (PCBs), fiber alignment and bonding of fiber array units (FAUs), and associated process development and engineering activities. The work encompasses eight photonic integrated circuits requiring continuous engineering alignment throughout all process steps.
The scope includes 17 distinct line items combining recurring and non-recurring engineering efforts. Recurring work involves wire bonding of PIC/PCB assemblies (including cleaning, epoxy dispensing, die attachment, plasma cleaning, automated wire bonding, and 100% inspection) and execution of active alignment and photonic assembly (including cleaning, automated active alignment, UV and thermal curing, and post-curing loss measurements). Non-recurring engineering tasks include setup for standard wire bonding and FAU fabrication, development of work holders and grippers for both die attachment and active alignment assembly, incoming inspection procedures, epoxy dispensement process development, automated wire bonding program verification, FAU design and procurement of 12 units (with 4 extra for development), active alignment process development, UV index matching process development, quality testing and analysis, spacer development fabrication (alumina ceramic or silicon), and final optical assembly reporting with coupling efficiency data analysis. Work will be performed off-site at the vendor's facility in Santa Clara, California, with in-person pickup of components and delivery of completed assemblies to NASA Ames Research Center, Building N245, Moffett Field, California 94035. The estimated period of performance is 16-18 weeks from contract award, with final deliverables required in electrostatic discharge safe packaging.
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STATEMENT OF WORK
1. Objective/Requirements To perform packaging services on NASA-provided photonic integrated circuits (PICs).
This includes wire bonding to PCB, fiber alignment and bonding of fiber array units (FAUs), and associated process development and engineering costs. The wire bonding process uses thin wires to make electrical connections between the PIC and the printed circuit board (PCB), while the fiber bonding process involves precisely aligning and epoxy bonding the FAU to the PIC, to allow laser light from an optical fiber to be precisely input onto the PIC.
2. Characteristics, Scope, and Specs
The contracted vendor shall perform the following three studies:
• Work to be performed for a total of Qty: 8 PICs.
• Continous engineering alignment at all steps in the process (line item #1)
• Non-recurring engineering (NRE): Setup for standard wire bonding and FAU fabrication (line item #2 – Qty: 2 for two setups).
• NRE: Development and fabrication of a work holder for die attach and wire bonding (line item #3)
• NRE: Incoming inspection for PIC, waveguide, and sides (line item #4)
• NRE: Exopy dispensement and placement of PIC, including height measurement and X-ray void measurement (line item #5)
• NRE: Automatic wire bonding program verification and optimization (line item
#6)
• NRE for fiber array unit (FAU) (line item #7):
o Design and review FAU, with SMC-28, FC/APC connector o Procure Qty: 12 FAUs (4 extra for process development) o Review options for spacers made from Si, ceramic, or glass.
• Wire bonding of the PIC/PCB assembly (line item #8), including the following substeps:
o Clean the PCB o Epoxy dispensing o Die attachment o Plasma cleaning o Automated wire bonding program o 100% inspection
• Setup for active FAU alignment assembly (line item #9)
• NRE: Design and fabrication of a work holder for active alignment assembly (line item #10)
• NRE: Gripper for FAU design and fabrication (line item #11)
• NRE: Active alignment process development for FAU to PIC (line item #12)
• NRE: Process Development for Automated UV index matching (line item #13)
• NRE: Quality tests, X-ray for voic, die shear and FAU shear (line item #14)
• NRE: Spacer development and fabrication, to be made of alumina ceramic or silicon, to be used for FAU alignment and support (line item #15)
• Execution of the active alignment and photonic assembly, including the following substeps (line item #16):
o Isopropyl alcohol (IPA) or plasma clean o Automated active alignment o UV epoxy dispensing o Wet alignment o UV curing o Thermal curing o Post-curing loss measurements o 100% inspection
• NRE: Final optical assembly report and analysis on results, optical charaterization report, optical performance metrics, coupling efficiency data and recommendation if needed (line item #17).
• Delivery in an electrostatic discharge safe bag/tray.
3. Place of Performance
Work to be performed off-site at vendor’s facility, which for the recommended sole source vendor (Silitronics Solutions, Inc.) is Santa Clara, CA.
In-person pickup of components (FAUs and PICs) and delivery of completed assemblies to NASA Ames Research Center, Builing N245, Moffett Field, CA 94035.
4. Period of Performance Estimated as a 16-18 week leadtime from award of contract.
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