SATPC0039095 TAB 04 4 SPECS.pdf

Specifications for peripherals for Automated Dicing Saw for Semiconductor processing

The Smart Sensing and Electronics System branch at NASA Glenn Research Center (GRC) at Lewis Field focuses on developing silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. NASA GRC needs the following peripherals compatible with the automated dicing saw from Advanced Dicing Technologies for dicing processed silicon carbide and silicon wafers.

The following are the desired capabilities/specifications of the peripherals:

1. All parts must be new

2. LED UV Curing System designed for post-dicing UV tape curing, to reduce adhesive strength and simplify workpiece removal; Capable of nitrogen flow onto the sample during UV curing;

Nitrogen flow control and pressure valve with gauge; UV intensity controllable from 0- 100%

3. Dicing tape/frame mounting station: Able to be used with UV and regular dicing tape;

Supports up to 8” Wafer Dicing Film Frames; Supports both 6” and 8” Wafer Dicing Film Frames; Programmable chuck temperature controller; Closed-loop temperature-controlled platen (up to 70 deg.C); Automatic reeling and removal system for UV tape backing; Internal vacuum pump to provide vacuum to hold the workpiece in place; Roller pressure is adjustable on system; Roller is anti-static; System includes static eliminator for both 6” and 8” frame options; Has alignment pins for orientating film frame; Has magnets to secure the frame during wafer mounting; System has engraved markings on chuck to assist with centering and alignment of wafers; 6-inch and 8-inch round groove chuck

4. Documented use in Govt./academic/semiconductor R&D facilities