SATPC0037405 Tab 04 4 SOW.pdf
PDF 91 KB Posted
- Attached to
- PCM Oxygen Laser Flight Federal contract opportunity
- Solicitation number
- 80NSSC25893332Q
About this file
This Statement of Work (SOW) outlines requirements for procuring 65 Distributed Feedback Laser Diodes (P/N DFB-076083) for the Primary Constituents Monitor (PCM) Oxygen Laser program, with a performance period of January 20, 2025 through April 20, 2025. The lasers will be procured as Class I flight hardware with specific technical requirements including 760.70nm wavelength, 8mW output power, TO 5 housing with TEC and NTC, black antireflection coated cap and window, operating temperature of 30° to 40°C (with 30% operating between 35-40°C), and operating current of 25-45 mA.
The SOW mandates strict production requirements including sourcing all lasers from the same wafer lot, using components from the same lot purchases (laser can, mount, TEC, thermistor, bonding wire, and agents), and consistent processing procedures. Deliverables include the hardware, a comprehensive data package with material specifications and manufacturing records, and test procedures for SME review prior to execution. Key quality control elements include wafer lot acceptance criteria, bond wire pull testing, pre-seal bake out details, and pre-seal internal visual inspection that must comply with MIL-STD-883 Method 2017. The contract will be managed by NASA Shared Services Center.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0037405 Tab 07 Capability Statement FBO Posting.pdf |
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Text version
Project Title: Primary Constituents Monitor (PCM) Oxygen Laser Procurement
Period of Performance: January 20, 2025 through April 20, 2025 (3 months)
Project Description:
The objective of this task is to procure lasers for the Primary Constituents Monitor (PCM) design. Lasers will be procured as Class I flight.
The following is being requested:
Part Number Description QTY
DFB-076083 O2
Distributed Feedback Laser Diode, 760.70 wavelength (nm).
Output power: 8 mW. Mounting in TO 5 housing with TEC and NTC with black cap (cap antireflection coated with black colour) and antireflection coated window. Operating temperature 30° to 40° C with at least 30% of the devices operating between 35° to 40° C. Operating current 25 to 45 mA
In addition to the requirements in the description the following additional requirements are applied to this procurement:
• All lasers of the same target wavelength sourced from the same wafer.
• Components sourced from the same lot purchases o Laser Can o Laser Mount o TEC o Thermistor o Bonding wire o Bonding agents (i.e. epoxy, solder)
• Process lasers at the same wavelength as a "lot" o Chips undergo the same processes o Chips processed on same equipment/line o No significant gaps in production between chips
• Details of the Wafer Lot Acceptance o Inspection Criteria o Inspection Points and results
• Bond wire pull Test o Details of planned testing for SME review prior to executing o Test Data
• Pre-Seal Bake Out Details (per your process) o Details of planned testing for SME review prior to executing o Bake-out Temperature o Bake-out Pressure (if other than ambient) o Bake-out Duration o Air composition (if other than ambient, i.e. Dry Nitrogen/Air)
• Pre-Seal Internal Visual o High Resolution photographs provided o -or- Inspect to MIL-STD-883 Method 2017
Deliverables:
The contractor shall deliver the following:
Item Description Delivery
1. Hardware QTY 65 P/N DFB-076083
Distributed Feedback Laser Diode, 760.70 wavelength
(nm).
Per Quote
2. Data Package Data package including material specification of piece parts, records of manufacturing including details of wafer lot acceptance, bond wire pull tests, pre-seal bake out, and pre-seal internal visual inspection.
With Item 1
3. Procedures Bond Wire Pull Test and Pre-Seal Bake out procedures for SME review
Prior to executing activities
Quality Requirements:
See attached JF2422 for quality requirements.
File details come from the government source that posted it. Updated .