SATPC0035164 Tab 04 4 Statement of Work Bruker DektakXT.pdf
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- Solicitation number
- 80NSSC24871294Q
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The document provided is a Statement of Work (SOW) for the acquisition of a Bruker DektakXT Stylus Profiler instrument. The SOW outlines the objective and requirements for the instrument, which is to be used to characterize thin-film structures and validate the deposition of functional material inks and electronic designs for NASA's On Demand Manufacturing of Electronics (ODME) project. The instrument must be capable of measuring thin film stress, surface geometries, and active material layer thickness, as well as providing comparative analysis between the manufactured part and the computer-aided design (CAD) model. The place of performance is the Marshall Space Flight Center in Huntsville, AL, and the delivery of the instrument is needed by 9/1/2024.
The related federal contract opportunity is a Special Notice for the acquisition of the Bruker Dektak XT-A Stylus Profiler, which NASA/NSSC intends to procure through a sole source contract with Bruker Nano Inc. under the authority of FAR 13.106-1(b)(1)(i). The procurement will be for commercial items and services using FAR Part 12 and FAR Part 13 procedures. Interested organizations may submit their capabilities and qualifications to the identified points of contact by 9:00 a.m. Central Standard Time on 6/5/2024, which will be evaluated to determine if a competitive procurement is warranted.
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STATEMENT OF WORK (Bruker DektakXT Stylus Profiler)
1. Objective/Requirements The NASA On Demand Manufacturing of Electronics (ODME) project produces an array of thin-film devices of complex geometries for applications in gas sensing, structural health monitoring, and semiconductors. The requirement is for acquisition of an instrument capable of characterizing these thin-film structures to validate the deposition of functional material inks and validate the electronic design.
2. Characteristics, Scope, and Specs
The instrument shall be used to perform the following duties:
• Characterize thin films on wafers and flexible substrates.
• Measure thin film stress including calculation of tensile and compressive stresses.
• Measure surface geometries to analyze micron and submicron features.
• Measure the active material layer thickness in trenches using the high-resolution tip.
• Provide comparative analysis of the additively manufactured part and the computer-aided design (CAD) model.
3. Place of Performance Marshall Space Flight Center in Huntsville, AL.
4. Period of Performance The delivery of the instrument is need by 9/1/2024.
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