compliance_matrix.pdf

Section Requirement Technical

Merit Criteria Full Compliance (FC)/Non-Compliance

(NC).

Comment

2.0 Applicable Documents

3.1 Compute Three-Dimensional PVT

3.2a Attachable Hat-Couplers TM

3.2b Attachable Hat-Couplers TV chamber compatible TM

4.1a Meet performance requirements while in Orbit

4.1b GPS Flight System Operating Frequency range TM

4.1c GPS Flight System S-band signal immunity TM

4.1d GPS Flight System Ka-band signal immunity TM

4.1e GPS Flight System Arbitrary signal immunity TM

4.1.1.1 GPS Receiver Navigation Solution TM

4.1.1.2 GPS Receiver Time Tag Accuracy TM

4.1.1.3 GPS Receiver Position Tag Accuracy TM

4.1.1.4 GPS Receiver Velocity Accuracy TM

4.1.1.5 GPS Receiver 1 PPS Accuracy TM

4.1.1.6 GPS Receiver Time at the tone Message TM

4.1.1.7 GPS Receiver Raw Data TM

4.1.1.8 GPS Receiver Time to First Solution and Solution Availability TM

4.1.1.9 GPS Receiver Initialization TM

4.1.1.10 GPS Receiver Tracking Channels

4.1.1.11 GPS Receiver Tracking

4.1.1.12 GPS Receiver Navigation Solution Availability TM

4.1.1.13 GPS Receiver Measurement Noise

4.1.2.1 GPS Antenna Operating Frequency

4.1.2.2 GPS Antenna Polarization

4.1.2.3 GPS Antenna Gain

4.1.2.4 GPS Antenna Back Radiation

4.1.2.5 GPS Antenna Axial Radio

4.1.2.6 GPS Antenna VSWR and Impedance TM

4.1.2.7 GPS Antenna Resistive Losses

4.2.1 Mass Allocation TM

4.2.2 Nominal Power Allocation TM

4.2.3 Peak Power Allocation TM

4.2.4 Telemetry

4.3.1.1 Operating Voltage Range TM

4.3.1.2 Abnormal Voltages

4.3.1.3 Voltage Ripple

4.3.1.4 Voltage Transients

4.3.1.5 Sudden Removal of Power

4.3.1.7 Over-Current Protection

4.3.1.8 Primary Power Return Ground

4.3.2.1 Turn-on Current Transients TM

4.3.2.1.1 Turn-on Current Transients (< 100 microseconds) TM

4.3.2.2a Op. Current Transients

4.3.2.2b Current Rate Change

4.3.2.3 Repetitive Transients

4.4.1 Primary Power DC Isolation

4.4.2 Secondary Returns

4.4.3 Secondary to Primary DC Isolation

4.4.4 Mechanical Contact Resistance

4.4.6 Ground Strap, Non-Conductive Surface

4.4.6.1 Ground Lug Contract Area

4.4.8 Connector DC Resistance

4.5.1.1 Active Analog Tlm. Short Circuit Protected

4.5.1.2 Active Analog Tlm. Source and Load Resistance

4.5.1.3 Separation of Active and Passive Analog Returns

4.5.2.1 Passive Analog Tlm. Interface

4.5.3.2 Digital Tlm. Voltage Range

4.5.3.3 Digital Tlm. Short Circuit Protected

4.5.3.4 Digital Tlm. Source and Load Resistance

4.5.4.1 Command and Telemetry Interface TM

4.5.4.2 1PPS Clock Signal Interface TM

4.5.4.3 RS-422 Interface TM

4.5.4.4 1553 Bus Interface TM

4.7.1 Commands TM

4.7.1a Command - Reset

4.7.1b Command - Ground Test Mode

4.7.1c Command - Self Test

4.7.1d Command - Start Acquisition

4.7.1e Command - Set Mask Angle

4.7.1f Command - Parameter Update

4.7.2 Data TM

4.7.2a Data - Position

4.7.2b Data - Velocity

4.7.2c Data - Time

4.7.2d Data - Data Validity Flag

4.7.2e Data - Dilution of Precision

4.7.2f Data - Number and Identification of GPS tracked

4.7.2g Data - Pseudo-Range and Carrier Phase

4.7.2h Data - Sensor Status

4.8 Flight Software TM

4.8a FSW - Housekeeping Status

4.8b FSW - Version Control

4.8c FSW - SW Updates

4.8d FSW - SW Table Updates

4.8e FSW - Downloadable Memory

4.8f FSW - Non-Volatile Storage

4.8g FSW - Boot Code

5.1 Interface Documentation

5.1.1 Mechanical Interface

5.1.2 Electrical Interface

5.2.1a Comp. Mass - Receiver NTE

5.2.1b Comp. Mass - Antenna NTE

5.2.2 Center of Mass Location

5.2.3 Center of Mass Accuracy

5.2.4 Moments and Prod. Inertia

5.3a Physical Envelope - Receiver TM

5.3b Physical Envelope - Antenna TM

5.4a Mounting - Proper Fit/Alignment

5.4b Mounting - MICD

5.4c Mounting - Flatness

5.5a FOV - 90 degrees TM

5.5b FOV - MICD

5.6.1 Antenna Offsets Knowledge

6.0 Environmental Requirements

6.1a Margins of Safety TM

6.1b Proof Test

6.2 Quasi Static Limit Loads TM

6.3.1 Fundamental Launch Freq.

6.4.1 Sinusoidal Vibration

6.4.2a Random Vibration - Env. TM

6.4.2b Random Vibration - Analysis

6.4.2c Random Vibration - Notching

6.5a Shock - Design TM

6.5b Shock - Assessment

6.5c Shock - Assessment Provide

6.5d Shock - Test

6.7 Transportation

6.7.1 Transportation Cleanliness

6.8.1 Operating Pressure Range

6.8.2 Maximum Depressurization Rate

6.8.3 LV Env. Control Impinge Velocity

6.9 On-Orbit Dynamic Env.

6.9.1 Dynamic Linear Acceleration

6.9.2 Dynamic Angular Acceleration

6.10a Ground Environments - Performance

6.10b Ground Environments - Survival

6.11.1a Receiver Temp. Limits - OFF TM

6.11.1b Receiver Temp. Limits - ON TM

6.11.1c Receiver Temp. Limits - Protoflight/Qual limits

6.11.1d Antenna Temp. Limits - OFF TM

6.11.1e Antenna Temp. Limits - ON TM

6.11.1f Antenna Temp. Limits - Protoflight/Qual limits

6.12.2.1 Min. TID Tolerance TM

6.12.2.2 ELDR Evaluation

6.12.3 Displacement Damage Dose

6.12.4a SEE - Tolerate Errors TM

6.12.4b SEE - Prediction

6.12.4c SEE - Background Env

6.12.4d SEE - Peak Proton Flux

6.12.4.1a SELs - Threshold TM

6.12.4.1b SELs - Eval

6.12.4.1c SELs - No Latent Damage

6.12.4.2a SEBs - Power MOSFETs TM

6.12.4.2b SEBs - Survival Voltage

6.12.4.2c SEBs - Testing

6.12.4.2d SEBs - parts

6.12.4.2e Establish Survival Voltage

6.12.4.3 Non-Destructive Events

6.12.5 Charging Environment

6.13 Atomic Oxygen Fluence

6.13.1 Atomic Oxygen Analysis

6.13.2 Atomic Oxygen Testing

7.1.1.1 Particulate Contamination

7.1.1.2 Molecular Contam. – Exposed Surfaces

7.1.1.3a Molecular Contam. – Covered Surfaces

7.1.1.3b Molecular Contam. – Free Covered Surfaces

7.1.2.1 Particulate Generation

7.1.2.2.1 Material Selection TM

7.1.2.2.2 Material Selection - Silicones

7.1.2.2.3a Assembly Outgassing - Measure

7.1.2.2.3b Assembly Outgassing - NTE

7.1.2.2.3c Assembly Outgassing - External components

7.1.2.2.3d Assembly Outgassing - Cold Finger

7.1.2.4 Intentional and Unint. Vents – Filters

7.1.2.5a Pressure Buildup Prevent. - Ascent

7.1.2.5b Pressure Buildup Prevent. - High Vacuum

7.1.3.1 Cleanability – Sensitive Surfaces

7.1.3.2 Cleanability – Cleaning Methods

7.2.1 Conductive Surface Ground Path

7.2.2 Conductive Surface Resistivity

7.2.3 Closeout of Gaps and Apertures

7.2.3.1 Conductive Tape Surface Resistivity

7.2.3.2 Conductive Tape, Grounding

8.1.2.1 Material Conductivity

8.1.2.2a Material Limit for DCA - Limit

8.1.2.2b Material Limit for DCA - Mass

8.1.2.2c Material Limit for DCA - Assemblies

8.2.1a Test Sensors - Designed for Flight

8.2.1b Test Sensors - Not Removed

8.2.2.1.1a Connector Specifications - INST-0002 TM

8.2.2.1.1b Connector Specifications - Env. Seals

8.2.2.1.3 Contact Derating

8.2.2.1.4 Redundant Contact Derating

8.2.2.2a Signal Segregation - power, digital

8.2.2.2b Signal Segregation - pin assignments

8.2.2.3 Test and Flight Signal Isolation

8.2.2.4.2 Facility-Induced ESD GSE Malfunction

8.2.2.4.3 Facility-Induced GSE Malfunction

8.2.3.1a Mitigat. for Internal Charging - Impl.

8.2.3.1b Mitigat. for Internal Charging - Analyze

8.2.3.2 Floating Conductors

8.2.3.3.1 Bulk Resistivity

8.2.3.3.2 Charge Bleed-Off

8.3 Safety

8.4.1.2 CE101

8.4.1.3 CE102

8.4.1.4 CMCE

8.4.2.2 CS101

8.4.2.3 CS114 - Power Leads

8.4.2.4 CS106

8.4.2.5 CS114 - Power and Signal Cables

8.4.3.1 RE102

8.4.4.1 RS103

8.4.5.1 CE106 - Antenna Port Emissions

8.4.5.2 CS103 - Antenna Port Intermodulation

8.4.5.3 CS104 - Antenna Port Rejection of Undesired Signals

8.5a Identification and Marking - Part number/Serial number

8.5b Identification and Marking - Marking type

8.6.2.1 GSE Cable Connectors

8.6.2.2.1 Connector Uniqueness

8.6.2.2.2 Connector Facing

8.6.2.2.3 Connector Keying

8.6.2.2.4 Accessibility

8.6.2.2.5 Connector Gender

8.6.2.3 Test Connectors

8.6.2.4 Connector Identification

8.6.2.5 Protection of Unused Test Connectors

8.6.2.6 Connector Savers

8.7.1 Mission Life TM

8.7.2.1 Total Time

8.7.2.2a Failure Free Time - Vacuum

8.7.2.2b Failure Free Time - Last Hours

8.8.1 GSE Design

8.8.7 GSE Cleanliness

8.8.8 GSE Bakeout

8.8.9 Test Harness

9.1a Structural Req. - Worst Case Loads

9.1b Structural Req. - Margins

9.1c Structural Req. - NASA-STD-6016

9.1d Structural Req. - NASA-STD-5001

9.1.1 Component Fatigue

9.1.2a Fracture Control Req. - MUA

9.1.2b Fracture Control Req. - Application

9.1.2c Fracture Control Req. - Analysis

9.2.1.1 Factors of Safety

9.2.1.2 Supplemental Factor

9.2.1.3 Ultimate Design Loads

9.2.1.4 Yield Design Loads

9.2.1.5 Design Separation Load

9.2.2.1.1 Locking Feature Minimum

9.2.2.1.2 Locking Feature Verification

9.2.2.1.3 Locking Feature Installation

9.2.2.1.4 Snap Ring & Cotter Pin Use Limitation

9.2.2.1.5 Snap Ring & Cotter Pin Use

9.2.2.2.1 Torque Measurement

9.2.2.2.2 Witness Coupons

9.2.2.2.3 Cure Samples

9.2.2.3.1 Locking Features - Spec.

9.2.2.3.2 Locking Features - Validation

9.2.2.4.1 Installation Torque Range

9.2.2.4.2 Running Torque Identification

9.2.3.1 Minimum and Maximum Preload

9.2.3.2 Analysis Addressing Potential Rupture

9.2.3.3 Ultimate Strength Analysis

9.2.3.4 Applied Shear Loading

9.2.3.5 Shear Loading

9.2.3.6 Simult. Applied Tensile and Shear Loads

9.2.3.7 Allowable Yield Tensile Load

9.2.3.8 Separation Analysis

9.2.3.9 Seal Analysis

10.2a Non-Contaminating GSE EDS Covers

10.2b Vacuum Compatible GSE

10.2c Bake out Capable GSE

10.2d Clean Room Compatible GSE

10.2e Outgassing

10.2f Surface Cleanliness

10.2g Vacuum Compatible Material

11.0 Verification Requirements

11.2 Inspection Requirements

11.2.1 Visual Inspection

11.2.2 Physical Measurement

11.2.3 Documentation Search

11.4a Test Requirements - Trends

11.4b Test Requirements - Previous Qual

11.4.2 Test Factors

11.4.4.1a Failure During Tests - Stop Test

11.4.4.1b Failure During Tests - Continue

11.4.4.1c Failure During Tests - Changes

11.4.4.2 Modification of Hardware

11.4.4.3 External Adjustment

11.4.4.4 Re-Test Requirements

11.5.3a Static Loads/Strength Test - Application

11.5.3b Static Loads/Strength Test - Performance

11.5.3c Static Loads/Strength Test - Functional

11.5.4a Sine Sweep Survey - Test

11.5.4b Sine Sweep Survey - Notify

11.5.4c Sine Sweep Survey - Frequencies

11.5.4d Sine Sweep Survey - Cross-orthogonality checks

11.5.4e Sine Sweep Survey - Frequencies Match Within 5%

11.5.5a Sine Vibration - Test

11.5.5b Sine Vibration - Functional

11.5.6a Random Vibration - Test TM

11.5.6b Random Vibration - Functional

11.5.9 Shock

11.5.10a Thermal Vacuum Bake-out - Prior to Delivery

11.5.10b Thermal Vacuum Bake-out - QCM

11.5.11.1 Thermal Vacuum Test Parameters

11.5.11.2a Thermal Vacuum Test - Flight Config

11.5.11.2b Thermal Vacuum Test - Profile TM

11.5.14.1 Continuity/Hi-Pot Tests

11.5.14.2 Harness Bake-Out

11.5.15a EMI/EMC Tests - Compliance TM

11.5.15b EMI/EMC Tests - RF Unique Test

11.5.15.1 Conducted Emissions Tests

11.5.15.2 Conducted Susceptibility Tests