3DDIC JOFOC-CO_Redacted.pdf

JUSTIFICATION FOR OTHER THAN FULL AND OPEN COMPETITION

Purchase Request No. NB305000-26-01460

1. Identification of the agency and the contracting activity:

U.S. Department of Commerce, National Institute of Standards and Technology (NIST), Office of Acquisition and Agreements Management, Acquisition Management Division (AMD).

2. Nature and/or description of the action being approved:

Noncompetitive procurement of a high-performance 3D digital image correlation (DIC) system to support the CHIPS Metrology program. The action will be a firm-fixed-price contract awarded on a sole-source basis.

3. A description of the supplies or services required to meet the agency's needs:

The NIST Infrastructure and Materials Group within the Engineering Lab, representing the CHIPS R&D Grand Challenge 3, has a requirement at its Gaithersburg, Maryland campus for a high-performance 3D DIC system. This system will precisely measure in-situ, full-field displacement and strain of polymeric packaging compounds (e.g., underfills redistribution layers, and thermal interface materials) under various thermal conditions. This will meet the mission of enabling the characterization of advanced packaging integration and providing new open-source reliability tools.

The estimated value of this requirement is to include delivery of the system, installation, training, and minimum one-year warranty. The period of performance is seven months from date of award.

4. An identification of the statutory authority permitting other than full and open competition:

This justification is based on Revolutionary FAR Overhaul (RFO) 12.102, Restricting Competition, and the applicable procedures in RFO 12.201-1 Simplified Procedures, as implemented by Department of Commerce Class Deviation to FAR Parts 12 and 13 and the authority of 41 U.S.C.

1901.

5. A demonstration that the proposed contractor's unique qualifications or the nature of the acquisition requires the use of the authority cited:

Only Park Seungbae has been identified as a source/manufacturer that produces a commercial product that meets all NIST’s minimum requirements for a high-performance 3D DIC system. Specifically, it is the only system providing integrated environmental chambers and a projector system necessary for in-situ 3D measurements required to study warpage and strain during long-term aging. These capabilities are critical for the CHIPS Metrology program’s "Grand Challenge 3".

6. A description of efforts made to ensure that offers are solicited from as many potential sources as is practicable, including whether a notice was or will be publicized as required by Subpart 5 and, if not, which exception under 5 applies: