UNSPSC 32101672: Lead frame

A common type of chip package that uses metal leads that extend outside the housing.

UNSPSC 32101672 Lead frame is a Commodity code that state and local governments source primarily as components within broader electronic equipment procurements rather than as standalone items. Recent solicitations show lead frames being acquired as part of custom printed circuit boards and electronic equipment assemblies supporting infrastructure, educational, and public-safety operations. Northside Independent School District (San Antonio) issued IFB 2026118 in September 2026 for electronic equipment parts and services, a category-level procurement that would encompass lead frame components as subassemblies. The University of Wisconsin-Madison posted RFB 2027-UWMSN-01396 in July 2026 for APxF Rev K3 custom printed circuit boards, which explicitly integrate lead frames as a foundational component. Issuing bodies under this code span school districts, higher-education institutions, and utility districts; the recent opportunities show no standout repeat buyers but rather single-jurisdiction or cooperative purchasing initiatives.

Geographic activity centers on Texas (Northside ISD in San Antonio, Lubbock Power & Light in Lubbock) and Wisconsin (University of Wisconsin-Madison), with a broader multistate cooperative purchasing footprint through Sourcewell's law-enforcement equipment RFP spanning Washington and other states. The most concrete recent opportunity tied directly to lead-frame procurement is the University of Wisconsin-Madison's RFB 2027-UWMSN-01396 for custom printed circuit boards with a July 20, 2026 response date; this solicitation explicitly names APxF Rev K3 PCBs as the deliverable, with lead frames embedded as core substrate components. Northside ISD's IFB 2026118 (due September 24, 2026) represents a broader electronics procurement where lead frames may appear as repair or replacement components but is not singularly focused on lead-frame acquisition. The code shows limited recent standalone lead-frame procurement activity; most sourcing appears embedded within larger circuit-board or electronic-assembly contracts.