UNSPSC 32101664: Ultrasonic integrated circuit

UNSPSC 32101664 Ultrasonic integrated circuit is a Commodity code, but the recent state and local opportunities tagged to it show minimal alignment with ultrasonic integrated circuits specifically. Instead, the posting activity spans electronic equipment procurement broadly — including circuit breakers, custom printed circuit boards, law enforcement equipment, and general electronic parts and repairs — suggesting the code classification does not reliably surface work matching the nominal product line. State and local buyers using this code appear to be seeking complete electronic systems and components across a range of applications rather than ultrasonic integrated circuits as a discrete product category.

The issuing bodies span school districts, municipal utilities, higher education institutions, and cooperative purchasing vehicles serving multiple jurisdictions. Northside Independent School District (San Antonio, Texas) posted IFB 2026118 for electronic equipment, parts, repairs, rentals, and services with bids due September 24, 2026, replacing an expiring contract and requiring all current vendors to recompete or lose future opportunity. Lubbock Power & Light issued RFP #7137-26-ELD for three outdoor vacuum circuit breakers rated 15kV, 2000A, and 25kA capacity, with proposals due September 24, 2026 and expected award October 20, 2026. The University of Wisconsin-Madison solicited bids for APxF Rev K3 Custom Printed Circuit Boards (RFB 2027-UWMSN-01396) due July 20, 2026. Sourcewell, a Minnesota cooperative purchasing vehicle, issued RFP #061626 for law enforcement equipment serving participating entities across multiple states including Washington, with a June 16, 2026 deadline. Activity concentrates in Texas and the upper Midwest, though the Sourcewell cooperative reaches across the United States and Canada. The code shows recent posting activity, but the divergence between the code name and actual procurement content suggests limited relevance to vendors specifically positioned in ultrasonic integrated circuits.