UNSPSC 23211103: Wafer wire bonder

A machine that is connected to the chip pad and the lead frame to link the chip attached on the paddle of the lead frame and the lead frame electrically as the die bonding process in semiconductor assembly process.

UNSPSC 23211103 Wafer wire bonder is a Commodity code that covers specialized semiconductor and microelectronics assembly equipment, though recent state and local procurement activity under this code shows little demand specifically for wafer wire bonding systems. The single recent solicitation tagged to this code—Texas Tech University's RFP 2026-1190 for Research and Development Goods and Services—targets laboratory and microscope equipment, centrifuges, chromatography systems, fume hoods, and related specialty R&D goods, with no explicit mention of wafer bonding or semiconductor manufacturing equipment. The solicitation instead reflects a broader institutional need for general-purpose testing, measuring, and analytical instrumentation to support university research initiatives. Evaluation criteria emphasize demonstrated ability to fulfill TTU's needs (50 percent), compliance with federal and state requirements (15 percent), proposer qualifications (15 percent), financial value (10 percent), and value-added options including local representation, discounts, e-commerce capabilities, and warranties (10 percent). Proposers must provide three professional client references, demonstrate necessary licenses, and comply with Texas HUB program requirements, though an HUB Subcontracting Plan is required only if the resulting contract is anticipated to exceed $100,000 over the term.

The geographic footprint for this code centers on Texas, represented by Texas Tech University's procurement. The RFP issued May 4, 2026, with a proposal deadline of April 30, 2026, at 12:00 PM Central, a solicitation conference on April 22, 2026, and written questions due April 24, 2026. Contract pricing remains firm for twenty-four months following execution, with potential annual increases not to exceed three percent thereafter, and an initial term of four years with automatic renewal options for up to four additional one-year terms. The mismatch between the code's nominal scope—specialized wafer bonding equipment for semiconductor assembly—and the actual procurement activity suggests limited state and local institutional demand for this category under the code. Business development teams should verify whether opportunities in this space are more likely tagged to broader equipment or research services codes at the state and local level.