UNSPSC 23211103: Wafer wire bonder

A machine that is connected to the chip pad and the lead frame to link the chip attached on the paddle of the lead frame and the lead frame electrically as the die bonding process in semiconductor assembly process.

UNSPSC 23211103 Wafer wire bonder, a Commodity code, shows minimal alignment with actual state and local procurement activity. The two recent opportunities posted under this code—a Texas Tech University RFP for research and development laboratory equipment (May 2026) and a Santa Clara County RFI for a public health lab information management system (April 2026)—involve testing, measuring, and lab-information software solutions rather than semiconductor assembly equipment such as wafer wire bonders. The TTU procurement explicitly seeks microscope equipment, centrifuges, chromatography systems, and fume hoods; the Santa Clara RFI targets lab information management software (LIMS). Neither opportunity contemplates wire bonding machinery or semiconductor packaging equipment, which is the nominal scope of the code.

The issuing bodies are higher-education institutions and county health agencies rather than manufacturers or semiconductor fabricators. Geographic activity spans Texas (TTU) and California (Santa Clara County), but the limited recent opportunities and categorical mismatch suggest this code receives little relevant state and local procurement traffic. Vendors in wire bonding or semiconductor assembly equipment should not expect regular opportunities under this Commodity code in the state and local market.