Ualbany's college of nanotechnology, science, and engineering (cnse) has implemented a CO-location model where faculty and students collaborate with industry using industry compliant equipment and…

The National Institute of Standards and Technology awarded The Research Foundation For The State University of New York $1.521 million on September 1, 2026, under the Congressionally-Identified Projects program (CFDA 11.617) to upgrade equipment and infrastructure at the University at Albany's College of Nanotechnology, Science, and Engineering Innovation Lab.

CNSE will acquire nine categories of equipment to modernize its 200-millimeter wafer cleanroom and metrology facility. Purchases include a nanometer-scale pattern generator system for SEM-based e-beam lithography, a physical vapor deposition chamber, a flexible packaging and assembly tool with die bonder system, a lithography microscope for wafer and substrate inspection, a router and CNC milling machine for advanced packaging, laser welding and laser cutting capability for package assembly, large-format saws and cutters for material processing, a microelectronics probe station with parameter analyzer, and a parylene polymer coating and deposition system. These upgrades will support semiconductor and microelectronics processing, advanced packaging, inspection and metrology, and electrical characterization.

The equipment enhancements will expand CNSE's capacity to conduct research, translate discoveries into application demonstrations, and deliver hands-on workforce development and training in the shared cleanroom environment. The college operates under a co-location model where faculty, students, and industry partners collaborate using industry-compliant equipment and facilities.

Period of performance runs September 1, 2026, through August 31, 2028. Work is performed in Albany, New York.

Activities

Cnse will upgrade the 200MM wafer cleanroom equipment, the innovation lab, to significantly advance its capabilities in semiconductor and microelectronics processing and supporting adjacent fields requiring wafer processing, advanced packaging, inspection/ metrology, and electrical characterization. To modernize and improve the capabilities of this laboratory, cnse has identified multiple equipment acquisitions that will support ongoing and future activities:1. Nanometer-scale pattern generator system for SEM-based e-beam LITHOGRAPHY2. Physical vapor deposition chamber to augment the kurt j. Lesker octos 10 SYSTEM3. Flexible packaging and assembly tool / DIE bonder SYSTEM4. Lithography microscope for wafer and substrate INSPECTION5. Router / CNC milling machine for advanced packaging APPLICATIONS6. Laser welding / laser cutting capability for package assembly and CUTTING7. Large-format saws / cutters for coarse material PROCESSING8. Microelectronics / semiconductor probe station and parameter ANALYZER9. Parylene polymer coating/deposition systemexpected outcomes:the proposed equipment upgrades will have immediate and sustained impacts on cnse?s ability to execute leading-edge research, translate discoveries toward application demonstrations, and expand hands-on education and workforce training in a shared 200MM-scale cleanroom environment. By modernizing and expanding core fabrication, inspection/metrology, advanced packaging, and electrical characterization capabilities, the cnse innovation lab will strengthen its role as a campuswide and regional user facility that supports interdisciplinary semiconductor and microelectronics research and provides a practical training ground aligned with industry workflows.

Intended beneficiaries

First, the project will significantly improve the ability of cnse researchers to perform materials and device exploration and experimental work within the innovation lab. New nanoscale patterning capability will enable rapid iteration of custom device layouts and test structures, allowing researchers and students to prototype nanoscale features without dependence on external e-beam tool access. Second, the project will enable researchers to move beyond isolated device fabrication toward application demonstration by establishing more complete advanced packaging and end to-end characterization pathways within the same facility. Third, upgraded characterization capability will strengthen the innovation lab as a place where users can fabricate, package, and evaluate devices with minimal handoff between facilities.beyond research impacts, the investment will significantly improve the ability of the innovation lab to be used for educational and training purposes, including workforce development programs that require modern, industry-relevant tools and workflows. Because the innovation lab operates as a shared user facility with industry compliant practices, new capabilities will allow instructional staff to offer training modules that reflect current semiconductor and microelectronics process flows.

Subrecipient activities

The recipient does not intend to subaward funds.