Project Grant 60NANB12H016

This $300,000 Project Grant awarded by the National Science Foundation (NSF) under the Computer and Information Science and Engineering (CISE) program supports the development of a new testing methodology to enhance the detection of internal defects in state-of-the-art integrated circuits. The research project aims to generate compact and efficient tests that can comprehensively cover a wide range of resistive defects within individual circuit cells, as well as capture the timing impact of a...

This $430,234 National Science Foundation project grant supports the development of testing and design-for-test techniques for monolithic 3D integrated circuits at Arizona State University. Funded under the Computer and Information Science and Engineering program (CFDA 47.070), the award will advance research on built-in self-test solutions, test generation methods, and power distribution designs to enable reliable testing and defect isolation in multitiered 3D chip architectures. Outcomes...

The National Institute of Standards and Technology (NIST) awarded a $289,992 Cooperative Agreement under the CHIPS Research and Development (CFDA 11.042) program to Tech-X Corporation. The purpose is for Tech-X to develop a simulation tool that accounts for manufacturing variations and imperfections to enable faster and more cost-effective development of photonic integrated circuits (PICs). Key activities include modifying Tech-X's XSIM simulation tool to model the effects of fabrication defects...

This $348,061 project grant awarded by the National Science Foundation (NSF), under the Engineering program (CFDA 47.041), will fund research to understand the fundamental mechanics of thermomechanical fatigue in next-generation semiconductor devices. The research will focus on developing an energy dissipation criterion to evaluate thermomechanical fatigue damage in semiconductor/metal interfaces, which are prone to failure due to thermal expansion coefficient mismatches. The goal is to...

This Project Grant award from the National Science Foundation (NSF) Integrative Activities program (CFDA 47.083) provides $299,938 to the Regents of the University of Idaho, doing business as the University of Idaho, to support research on the integration and packaging of wide bandgap semiconductor chips and sensors for extreme high-temperature (up to 600°C) applications. The key objectives of this 2-year project are to investigate the integration of silicon carbide (SiC), gallium nitride (GaN),...

The National Science Foundation (NSF) awarded a $274,995 SBIR Phase I project grant under the NSF Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) to Tiptek, LLC, a small for-profit limited liability company. The project aims to improve a critical semiconductor manufacturing method called nanoprobing by enabling the technique to probe smaller and more complex electrical devices for longer periods. The improved nanoprobes developed through this research will support the...

The National Science Foundation (NSF) awarded a $999,561 Cooperative Agreement under its Technology, Innovation, and Partnerships (CFDA 47.084) program to Apogee Semiconductor, Inc. to develop a cost-effective and reduced-size packaging solution for space-grade and high-reliability integrated circuits. The project aims to redesign the redistribution layer within wafer-level chip-scale packaging (WLCSP) to improve reliability under the extreme temperature cycling experienced in space...

The National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems awarded a $105,194 EAGER (EArly-concept Grants for Exploratory Research) grant to the University of Pittsburgh to develop a novel semiconductor-metal-semiconductor (S-M-S) multilayer film as an interconnect for perovskite-silicon tandem solar cells. The project aims to design an interconnect with high electrical conductivity and optical transparency to enhance the performance of these tandem solar...

Federal Project Grant Award Summary Award Overview: Turbo Power Semiconductor Inc. received $305,000 in funding from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) to develop a silicon conductivity-controlled bipolar transistor (CCBT) technology. The 12-month project, initiated June 1, 2025, focuses on designing and commercializing a 4.5kV-class SI-CCBT semiconductor device intended to significantly reduce power losses in high-power...

This $107,965 Project Grant award from the National Science Foundation's STEM Education program (CFDA 47.076) will support the development and deployment of a foundational semiconductor research and education cyberinfrastructure (CI) tool at San Jose State University Research Foundation. The CI will integrate machine learning device models and semiconductor device data to empower semiconductor device research and education, lowering the entry barrier and facilitating broader participation in...