This $274,999 Project Grant award from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) supports the development of strain-relief interconnection and encapsulation technologies for perovskite/silicon tandem photovoltaics. The key objectives are to increase the efficiency, reliability, and manufacturability of these high-performance solar cell devices, which could drive down the cost of photovoltaic energy and accelerate the deployment of solar power as a sustainable energy source. The awardee, Beyond Silicon Inc., will conduct research to understand the thermal and mechanical stresses of tandem devices and implement strategies to minimize these stresses during module fabrication. This award aligns with NSF's mission to advance scientific discoveries and support the commercialization of innovative technologies that address national challenges and have potential for broad economic and societal impact. The project period runs from September 1, 2024, to August 31, 2025.
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