Photonect Interconnect Solutions Inc. received a $275,000 Project Grant award from the National Science Foundation under the NSF Technology, Innovation, and Partnerships federal grant program (CFDA 47.084) to develop a chip technology for cheaper and easier photonic device manufacturing. The company will focus on a new fusion splicing machine and novel silicon dioxide mode converter that enables faster, more accurate, and lower cost fiber placement on chips compared to existing technologies. This is expected to significantly improve packaging speed from 10 minutes to 2 minutes, increase power efficiency by 4 times, and reduce costs by 50%. Completion of research objectives to further reduce coupling losses and demonstrate splicing compatibility with foundry chips could result in extremely low loss photonic packaging applicable for high-volume production across telecommunications, data communications, sensor, and defense industries served by the company. The award period is from June 15, 2023 through May 31, 2024.
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