Cooperative Agreement DEEE0009635

This Project Grant award from the National Science Foundation's (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) program provides $305,000 to Elektrum Technologies, Inc. to develop an additive manufacturing process for producing low-cost, flexible, and transparent conductive electrodes. The goal is to create a more cost-effective alternative to indium tin oxide, which is a brittle material currently used in many optoelectronic applications. The Phase I project will focus on two key...

This $379,054 project grant awarded by the National Science Foundation's Engineering program (CFDA 47.041) to Texas A&M Engineering Experiment Station (Tees) will establish new via metrology and inspection technology for advanced wafer-level packaging in the semiconductor industry. The research aims to develop rapid modeling methodologies and experimental/computational calibration methods to characterize via geometry, optical properties, and defectivity. Key innovations include a via-edge...

This $3,000,000 Project Grant awarded by the National Science Foundation (NSF) Engineering Program (CFDA 47.041) supports research to develop a novel lamination approach for halide perovskite semiconductors that enables new device architectures and material combinations for applications like solar cells, LEDs, and other optoelectronic devices. The research aims to understand, model, and control the process-structure-property relationships during halide perovskite semiconductor manufacturing...

The National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems awarded a $105,194 EAGER (EArly-concept Grants for Exploratory Research) grant to the University of Pittsburgh to develop a novel semiconductor-metal-semiconductor (S-M-S) multilayer film as an interconnect for perovskite-silicon tandem solar cells. The project aims to design an interconnect with high electrical conductivity and optical transparency to enhance the performance of these tandem solar...

Photonect Interconnect Solutions Inc. received a $275,000 Project Grant award from the National Science Foundation under the NSF Technology, Innovation, and Partnerships federal grant program (CFDA 47.084) to develop a chip technology for cheaper and easier photonic device manufacturing. The company will focus on a new fusion splicing machine and novel silicon dioxide mode converter that enables faster, more accurate, and lower cost fiber placement on chips compared to existing technologies....

This National Science Foundation (NSF) Engineering program (CFDA 47.041) Project Grant award of $425,000 to the University of Washington is focused on developing high-speed perovskite light-emitting diodes (LEDs) for optical interconnects and data transmission. The key objectives are to: Engineer perovskite semiconductor materials and device designs to minimize resistance and increase LED modulation bandwidth. Optimize modulation formats using data-driven learning for high-bandwidth operation....

This Cooperative Agreement award from the National Science Foundation's (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) provides $1,000,000 to Iris Light Technologies Inc., a small business in Chicago, Illinois, to develop foundry-scale production of on-chip silicon photonic light emitters enabled by printed photonic ink. The project aims to create black phosphorus-based inks that can be integrated directly onto silicon photonic chips to produce on-chip lasers. This...

Florida International University was awarded a two-year, $266,000 project grant from the National Science Foundation under the NSF Technology, Innovation, and Partnerships program. The grant funds development of a non-contact, real-time defect detection system for electronics manufacturing using millimeter-wave antenna sensors. The university aims to integrate the mm-wave sensing technology into 3D printing systems to enable in-line process control and defect-free production. Key goals include...

Iris Light Technologies Inc. received a $256,000 Small Business Technology Transfer (STTR) Phase I Project Grant from the National Science Foundation on December 1, 2021 to support research and development efforts concluding on November 30, 2022. Funded through the NSF's Engineering program (CFDA #47.041), the award aims to advance electro-luminescence and doping of black phosphorus for printed lasers on silicon photonic chips. The Engineering program seeks to improve quality of life and...

Federal Cooperative Agreement Summary Photonect Interconnect Solutions Inc. received a $1.5M cooperative agreement from the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships program (CFDA 47.084), awarded June 15, 2025, with completion targeted for November 30, 2027. This Small Business Innovation Research (SBIR) Phase II award supports the development of advanced photonic device manufacturing technology designed to reduce packaging costs, minimize power...