New competitive cooperative agreement with university of florida under FOA number DE-FOA-00002851 (coolerchips) and control number 2851-1533

Ended Cooperative Agreement Awarded Last action

Award ID
DEAR0001756
Recipient
Awarding agency
Obligated
$3,217,944

Award facts

Assistance listing
81.135 Advanced Research Projects Agency - Energy
Completion date
Funding
  • $2,456,667.00 Federal
  • $761,277.00 Non-federal
Place of performance
Gainesville, FL, USA

Award details come from USAspending.gov.

Description

Project title: "hyperefficient data centers for deep decarbonization of large-scale computing" we propose a transformative two-phase water-cooling approach using a recent invention at the university of florida (UF) [1] that allows for significant future growth in processor power and heat flux, attains the required chip temperatures uniformly in all servers in a rack, and rejects heat directly to the ambient air external to the data center (DC). We will confirm the system performance metrics through the development and DC-level testing of a 126KW rack utilizing nvidia's 1000 w chipsets.

Transactions

Action Federal Non-federal Date
Amendment $0 $761,277
Amendment $0 $0
Original award $2,456,667 $0

Subawards

Subrecipient Amount Awarded
Boyd Lancaster, Inc. In this project, Boyd will develop two major components of the cooling system as follows: 1. A new steam condensing CDU that works with the form factor of… $725,254
University Of Maryland, College Park This proposal addresses the development and data center (DC) level testing of a 126kW rack utilizing NVIDIA's next generation servers with 1000 W chipsets… $249,541

Quick answers

Who received award DEAR0001756?

DEAR0001756 was awarded to University Of Florida by Advanced Research Projects Agency (Department of Energy) on September 18, 2023.

How much is award DEAR0001756 worth?

$3,217,944 has been obligated on DEAR0001756: $2,456,667 in federal funding and $761,277 in non-federal funding.

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