Tech-x corporation will develop a signoff tool for photonic integrated circuits (pics) that accounts for manufacturing variations and imperfections; such as non-vertical side walls or line edge…

The National Institute of Standards and Technology (NIST) awarded a $289,992 Cooperative Agreement under the CHIPS Research and Development (CFDA 11.042) program to Tech-X Corporation. The purpose is for Tech-X to develop a simulation tool that accounts for manufacturing variations and imperfections to enable faster and more cost-effective development of photonic integrated circuits (PICs). Key activities include modifying Tech-X's XSIM simulation tool to model the effects of fabrication defects on PICs. The expected outcomes are better understanding and prediction of manufacturing defects, leading to reduced PIC development costs and timelines. Tech-X plans to subaward funds to Dream Photonics Inc. to support the simulation, design, and characterization of PIC components. This award aims to benefit PIC designers and U.S. semiconductor manufacturers by improving their competitiveness through advanced simulation capabilities.

Activities

The tech-x simulation tool xsim will be modified to account for manufacturing variations and imperfections arising from manufactured photonic devices and their metrology data.

Expected outcomes

The tool will better understand and predict the effects of manufacturing defects on photonics integrated circuits, allowing for reduced cost and faster development times.

Intended beneficiaries

The designers of photonic integrated circuits, who will have faster development times as well as U.S. Semiconductor manufacturers and fabrication facilities that will become more competitive by better servicing their customers.

Subrecipient activities

The recipient plans to subaward funds for workflow management for IP, knowledge of foundry practices, and aid in managing the metrology data.