Laser thermal analysis, INC. Aims to build a hybrid atomic force microscopy-thermoreflectance (AFM-TR) instrument to generate maps of the thermal resistance, thermal boundary interface resistance, and…

The National Institute of Standards and Technology (NIST) awarded a $289,830.98 Cooperative Agreement under the CHIPS Research and Development (CFDA 11.042) program to Laser Thermal Analysis, Inc. The purpose of this award is for the company to build a hybrid atomic force microscopy-thermoreflectance (AFM-TR) instrument capable of generating high-resolution thermal resistance, thermal boundary interface resistance, and temperature profile maps of microprocessors and wide bandgap semiconductor materials and devices. The instrument will have sub-100 nm spatial resolution, sub-0.5°C temperature resolution, and less than 10% measurement uncertainty, without the need for an applied transducer coating. The project aims to create an automated, user-friendly, and low-cost thermal metrology tool to benefit researchers and the U.S. semiconductor industry. Laser Thermal Analysis, Inc. plans to subaward funds for activities such as tip development, coating, data management, and data processing.

Activities

The researcher will demonstrate the ability of the instrument to conduct thermophysical property measurements and then will construct and deliver an automated and user-friendly system.

Expected outcomes

The instrument will streamline system functionality for ease of operation and lower operational cost, while maximizing measurement throughput.

Intended beneficiaries

Researchers and the U.S. Semiconductor industry who make devices with thermal management issues and materials development needs on length scales smaller than 100 nanometers.

Subrecipient activities

The recipient plans to subaward funds for activities such as tip development and coating, data management and data processing.