Cooperative Agreement 2528393
- This SBIR Phase I award from the National Science Foundation's (NSF) Technology, Innovation, and Partnerships (TIP) program, with a total funding amount of $274,985, is focused on developing an artificial intelligence (AI) system to accelerate semiconductor production using physics-embedded lithographic foundation models. The project aims to alleviate design and manufacturing complexities associated with the shift to extreme ultraviolet (EUV) lithography in semiconductor manufacturing, which has...
- The U.S. National Institute of Standards and Technology (NIST) awarded a $289,965 Cooperative Agreement under the CHIPS Research and Development (CFDA 11.042) program to Exigent Solutions, Inc. The purpose of the award is for Exigent Solutions to create AI-powered software that automates chip design optimization for manufacturability through accelerated lithography simulation. The awardee will design and develop a software suite that leverages multi-modal AI modules to optimize chip designs...
- This Project Grant award for $1,587,440.00 from the National Science Foundation's (NSF) Mathematical and Physical Sciences program supports a collaborative research effort to develop new photoresist materials for high-volume extreme ultraviolet (EUV) lithography to enable advanced manufacturing of next-generation computer chips. The interdisciplinary project combines expertise in polymer chemistry, materials characterization, computational modeling, and artificial intelligence to understand...
- This $150,000 Project Grant award from the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) Federal Grant Program (CFDA 47.070) funds the development of an innovative computational electromagnetics (CEM) framework that leverages physics-informed artificial intelligence (AI) models. The project aims to enhance the analysis and design of on-chip optical interconnects, which are crucial for achieving ultra-high bandwidth and speeds in modern computing...
- This $260,000 Project Grant awarded by the National Science Foundation (NSF) under the Mathematical and Physical Sciences (CFDA 47.049) program supports a collaborative effort by researchers at the University of Texas at Dallas, Johns Hopkins University, and the University of Texas at Austin to develop new materials for advanced computer chips. The key objectives are to: (1) design novel indium-based extreme ultraviolet (EUV) resists using computational and machine learning tools; (2) synthesize...
- This National Science Foundation (NSF) Cooperative Agreement award under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program provides $1,000,000 in funding to Gravel Capital LLC to develop an artificial intelligence-powered printed circuit board assembly (PCBA) prototyping service. The project aims to create a rapid, cost-competitive PCBA manufacturing service that leverages computer vision and AI techniques to automate the design process, reduce innovation timelines, and...
- The National Science Foundation (NSF) awarded a $50,000 Project Grant under the Engineering program (CFDA 47.041) to The Trustees of Princeton University. The grant, titled "ECLIPSE-CHIPS: HIGH-FLUENCE COHERENT EUV LIGHT FROM ULTRAINTENSE LASER-PLASMA INTERACTIONS FOR ADVANCED NANOLITHOGRAPHY AND METROLOGY," will be used to explore advanced methods of generating extreme ultraviolet (EUV) light. This research aims to develop brighter and more coherent EUV beams, which can enable the...
- This Project Grant award from the National Science Foundation (NSF) under the Mathematical and Physical Sciences program (CFDA 47.049) provides $300,000 in funding to the University of Washington to advance the field of semiconductor manufacturing through the development of new photoresist materials for extreme ultraviolet (EUV) photolithography. The two-year project aims to uncover the mechanisms behind the crosslinking and chemical etching of ultrathin photoresist films grown using molecular...
- The National Science Foundation (NSF) awarded a $1,250,000 Cooperative Agreement under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program to Photonect Interconnect Solutions Inc., a small business in Rochester, New York. The award aims to develop a chip technology for cheaper and easier photonic device manufacturing, with a focus on improving data communications through advanced photonic components. Key objectives include creating a laser control system for optical fiber...
- The National Science Foundation Division of Industrial Innovation awarded $250,000 under the Engineering (47.041) federal grant program to Colorado State University to enhance the mass production of advanced integrated circuits. The project aims to develop new technology to improve the efficiency of extreme ultraviolet lithography machines used in the semiconductor manufacturing process. Extreme ultraviolet lithography entered high-volume manufacturing in 2019 and relies on laser heating of...
This $1,168,940 Cooperative Agreement awarded by the National Science Foundation (NSF) under its Technology, Innovation, and Partnerships (CFDA 47.084) program aims to develop a physics-guided AI platform for accelerating the design of extreme ultraviolet (EUV) masks for semiconductor manufacturing. The project, awarded to Exigent Solutions, Inc., a small business in Aubrey, Texas, seeks to shorten design-to-manufacturing cycles, reduce production costs, and help maintain cutting-edge semiconductor fabrication capabilities in the United States. The platform will integrate high-fidelity EUV lithography simulation, process adaptation, and multi-objective layout optimization to deliver manufacturable mask layouts in hours rather than weeks. This research aligns with national initiatives to expand domestic chipmaking and create high-skill jobs, while also promoting technological sovereignty and increased access to computation resources.
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | $1.2m | 8/20/25 |