Cooperative Agreement 2507371

Award Date 6/15/25
Completion Date 5/31/27
Dollars Obligated $1.3M
Federal Grant Program
47.084
Assistance Type
Cooperative Agreement
Place of Performance
LOEHMANNS PLZ, NY 14618, USA
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This $1,250,000 Cooperative Agreement award from the National Science Foundation (NSF) under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program supports the development of a chip technology for cheaper and easier photonic device manufacturing. The awardee, Photonect Interconnect Solutions Inc., is a small business focused on advanced photonic interconnect technologies.

The key objectives of this 2-year project are to: (1) create a laser control system for attaching optical fibers, (2) incorporate fiber alignment stages and enable communication with the laser control system, (3) develop a housing unit for the packaging technology, (4) create a process design kit for mode converter manufacturing, and (5) pilot the developed technology. The broader impact of this work is expected to significantly decrease the cost, time, and complexity of manufacturing high-performance, low-loss integrated photonic devices, which have applications across telecommunications, data communications, sensors, and defense. The award was made on June 15, 2025 and is set to be completed by May 31, 2027.

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