Cooperative Agreement 2304975
Award Date
12/1/23
Completion Date
11/30/25
Dollars Obligated
$1M
Federal Agency
National Science Foundation
Federal Grant Program
47.084
Assistance Type
Cooperative Agreement
Place of Performance
Plano, TX 75074, USA
Similar Awards
Apogee Semiconductor, Inc. received a $255,991 National Science Foundation Project Grant under the Engineering (47.041) program. The grant funded research to develop a low-cost packaging solution for space-grade and high-reliability integrated circuits. The NSF Directorate for Engineering seeks to improve quality of life and economic strength by fostering innovation and excellence in engineering research. This award supports that mission by advancing packaging technologies for space applications...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Project Grant award of $275,000 to United Semiconductors, LLC supports the development of two critical hardware components for in-space manufacturing of advanced semiconductor materials: A Universal Crystal Growth Capsule designed to leverage microgravity conditions during crystal growth, enabling high-throughput production of high-purity semiconductor crystals. A novel Wafer Dicing Tool to achieve...
This $300,000 National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) grant, awarded on October 1, 2024, will fund "CHIPS IN SPACE: AN ALLIANCE FOR PIONEERING SPACE-BASED SEMICONDUCTOR MANUFACTURING TO ADVANCE SCIENCE AND ESTABLISH US PREEMINENCE IN SEMICONDUCTORS." The project, led by The Texas A&M University System, aims to develop innovative technologies and capabilities for semiconductor manufacturing in microgravity conditions. Key objectives...
The National Science Foundation (NSF) awarded a $1,000,000 Cooperative Agreement under the Technology, Innovation, and Partnerships (CFDA 47.084) program to Soctera, Inc., a for-profit semiconductor technology company. The funding supports the scaling and commercialization of Soctera's innovative thermally-optimized power amplifier technology based on gallium nitride (GaN) semiconductors with aluminum nitride (AlN) layers. This technology is designed to address key challenges in 5G...
The National Science Foundation (NSF) has awarded a $732,897 Cooperative Agreement to the University of California, Berkeley (UC Berkeley) under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program. The project, titled "Workforce Innovation and Inclusion in Semiconductors and Emerging Research Areas (WIISER)", aims to engage undergraduate students from diverse backgrounds in industry internships and experiential learning opportunities in the semiconductor and emerging...
This $275,000 National Science Foundation (NSF) Project Grant, awarded under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program, funds the development and validation of materials and processes for advanced semiconductor manufacturing at Geminatio, a for-profit organization. The goal is to enable the progression of Moore's Law and strengthen domestic semiconductor manufacturing capacity and capability, which has been impacted by recent supply chain issues. The project seeks to...
This $1,250,000 Cooperative Agreement award from the National Science Foundation (NSF) under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program supports the development of a chip technology for cheaper and easier photonic device manufacturing. The awardee, Photonect Interconnect Solutions Inc., is a small business focused on advanced photonic interconnect technologies. The key objectives of this 2-year project are to: (1) create a laser control system for attaching optical...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Cooperative Agreement award of $1,184,000 to Sangtera Inc. in Lexington, MA, focuses on designing, fabricating, and characterizing a small form-factor precision stage prototype to support high accuracy and high throughput chiplet-to-wafer hybrid bonding. The project aims to develop a miniature precision stage to enable high-volume manufacturing of next-generation high-performance computing devices...
Photonect Interconnect Solutions Inc. received a $275,000 Project Grant award from the National Science Foundation under the NSF Technology, Innovation, and Partnerships federal grant program (CFDA 47.084) to develop a chip technology for cheaper and easier photonic device manufacturing. The company will focus on a new fusion splicing machine and novel silicon dioxide mode converter that enables faster, more accurate, and lower cost fiber placement on chips compared to existing technologies....
The National Science Foundation awarded Arieca Inc. $858,714 under the Technology, Innovation, and Partnerships program (CFDA 47.084) to develop liquid metal embedded elastomer thermal interface materials for microelectronics. Arieca will synthesize and evaluate these composite materials, which combine the superior thermal resistance of metal-based solid thermal interface materials with the mechanical reliability of polymer-based alternatives and manufacturing compatibility of thermal greases....