Silicon on insulator (SOI) wafers, with 450 NM thick silicon device layers, as substrates for ultrasensitive bolometric detectors.
Ended Purchase Order Awarded Last action
- Contract number
- NNX17GD40P
- Awardee
-
Shin-Etsu Handotai America, Inc. UEI JTDFM8D98JK1
- Awarding agency
-
Shared Services Center
National Aeronautics and Space Administration
- Obligated
- $27,040
Award facts
- Opportunity
-
- NNX17615906 Solicitation number
- Contract value 100% obligated
- $27,040.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- Vancouver, WA 98682, USA
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Funding Only Action | $40 | |
| Original award | $27,000 |
Quick answers
Who was awarded contract NNX17GD40P?
NNX17GD40P was awarded to Shin-Etsu Handotai America, Inc. by Shared Services Center (National Aeronautics and Space Administration) on April 12, 2017.
How much is contract NNX17GD40P worth?
The government has obligated $27,040 on NNX17GD40P.
Was contract NNX17GD40P competed?
The extent of competition for NNX17GD40P was not competed under sap. The government received 1 offer.
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