Purchase Order NNX14CG18P
Award Date 6/20/14
Potential Completion Date 12/19/14
Potential Value $125K
Federal Agency
Ultimate Awardee
Not listed NAICS Category
PSC Category
Federal Contract Vehicle
- Not listed
Set-Aside Type
Total Small Business
Extent Competed
Full and Open Competition after exclusion of sources
Major Defense Program
Not listed Pricing Type
Firm Fixed Price
Place of Performance
Granger, IN 46530, USA
Solicitation Procedures
Negotiated Proposal / Quote
Number Of Offers Received
500
Legislative Mandate
Not listed National Interest Action
Not listed Research Type
SBIR Program Phase I Action
Primary Consortia Member
Not listed Similar Awards
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INDIANA INTEGRATED CIRCUITS, LLC (IIC) PROPOSES TO DEVELOP THE CUSTOMIZABLE, HIGH-PERFORMANCE MICROCHIP INTERCONNECT TECHNOLOGY CALLED QUILT PACKAGING (QP) TO ADDRESS NASA'S REQUIREMENT FOR HIGH PERFORMANCE INTEGRATION OF HETEROGENEOUS MICROWAVE SYSTEMS. QP IS AN AFFORDABLE, SCALABLE, PATENTED EDGE-INTERCONNECT TECHNOLOGY FOR JOINING MICROCHIPS OF DISPARATE MATERIALS AND/OR PROCESS TECHNOLOGIES INTO MONOLITHIC-LIKE SYSTEMS THAT PERFORM ELECTRICALLY AS IF THEY WERE ONE CHIP. QP ENABLES SUB-MICRON CHIP-TO-CHIP ALIGNMENT, EXTREMELY SMALL (
Posted 6/10/14
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | Not listed | $124.9k | 6/10/14 |