Sbir phase I -software development for deposition of thick SIC epilayers services to design, fabricate, assemble, build, test, evaluate, verify, validate, and/or procure microelectronics and operate…
Ended Purchase Order Awarded Last action
- Contract number
- HQ072725PE003
- Awardee
-
Tignis, Inc. UEI C41GHC9EWMJ8
- Awarding agency
-
Defense Microelectronics Activity
Department of Defense
- Obligated
- $99,994
Award facts
- Contract value 100% obligated
- $99,993.51 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Contracting staff
- NAICS code
- 541511 Custom Computer Programming Services
- Set-aside
- Total Small Business
- Competition
- Full and Open Competition after exclusion of sources · 17 offers Negotiated Proposal / Quote
- Pricing
- Firm Fixed Price
- Place of performance
- Seattle, WA 98103, USA
- Legislative mandates
-
- Service Contract Act FAR subpart 22.10
Award details come from SAM.gov/FPDS.
About this award
The Defense Microelectronics Activity (DMA), operating under the Department of Defense, has awarded a Small Business Innovation Research (SBIR) Phase I contract to Tignis, Inc. (UEI: C41GHC9EWMJ8) with a ceiling value of $99,993.51. This firm fixed-price purchase order, designated as a Total Small Business set-aside, was awarded on February 7, 2025, with an ultimate completion date of May 7, 2025. The work will be performed in Seattle, Washington.
Under this contract, Tignis will conduct software development focused on the deposition of thick silicon carbide (SiC) epilayers. The scope encompasses services related to the design, fabrication, assembly, construction, testing, evaluation, verification, and validation of microelectronics, as well as procurement activities and facility operations. This SBIR Phase I award supports the early-stage exploration of advanced materials and semiconductor processing technologies critical to defense microelectronics applications, with the potential for follow-on development phases based on Phase I results.
Description
Sbir phase I -software development for deposition of thick SIC epilayers services to design, fabricate, assemble, build, test, evaluate, verify, validate, and/or procure microelectronics and operate such a facility.
Quick answers
Who was awarded contract HQ072725PE003?
HQ072725PE003 was awarded to Tignis, Inc. by Defense Microelectronics Activity (Department of Defense) on February 7, 2025.
How much is contract HQ072725PE003 worth?
The government has obligated $99,994 on HQ072725PE003.
Was contract HQ072725PE003 competed?
The extent of competition for HQ072725PE003 was full and open competition after exclusion of sources. The government received 17 offers. It was set aside: Total Small Business.
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