Radiation hardened integrated circuit fabrication process design kit for advanced cryogenic imagers

Ended Purchase Order Awarded Last action

Contract number
FA864923P0449
Awardee
Awarding agency
Obligated
$1,249,926

Award facts

Contract value 100% obligated
$1,249,926.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
Set-aside
Total Small Business
Competition
Full and Open Competition after exclusion of sources · 728 offers Negotiated Proposal / Quote
Pricing
Firm Fixed Price
Place of performance
Plano, TX 75074, USA
Research
SBIR Program Phase II Action

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Supplemental Agreement for work within scope P00004 $0
Supplemental Agreement for work within scope P00003 $0
Supplemental Agreement for work within scope P00002 · Sbir direct to phase II proposal F2D-7324 - radiation hardened integrated circuit fabrication process design kit for advanced cryogenic imagers $0
Supplemental Agreement for work within scope P00001 $0
Original award $1,249,926

About this award

The Air Force Research Laboratory (AFRL) awarded a Small Business Innovation Research (SBIR) Phase II contract to Apogee Semiconductor, Inc., a small business specializing in radiation-hardened integrated circuits for harsh environments. This $1.25M firm fixed-price purchase order, issued on February 10, 2023, supports the development of a radiation-hardened integrated circuit fabrication process design kit tailored for advanced cryogenic imagers. The work will be performed in Plano, Texas, with completion targeted for September 10, 2025. As a Total Small Business set-aside, the contract prioritizes the small business sector while advancing critical capabilities for space and defense applications where electronic components must operate reliably under extreme radiation exposure and cryogenic temperatures.

Apogee Semiconductor's SBIR Phase II award builds upon the company's established expertise in developing radiation-hardened semiconductor solutions for the defense and aerospace sectors. The fabrication process design kit represents a critical enabling technology for next-generation cryogenic imaging systems, which require specialized integrated circuits capable of maintaining functionality in demanding operational environments. This contract demonstrates AFRL's investment in small business innovation to develop specialized semiconductor design tools that enhance the U.S. military's technological capabilities in advanced sensor systems and related applications requiring robust electronics.

Quick answers

Who was awarded contract FA864923P0449?

FA864923P0449 was awarded to Apogee Semiconductor, Inc. by Air Force Research Laboratory (Air Force Materiel Command) on February 10, 2023.

How much is contract FA864923P0449 worth?

The government has obligated $1,249,926 on FA864923P0449.

Was contract FA864923P0449 competed?

The extent of competition for FA864923P0449 was full and open competition after exclusion of sources. The government received 728 offers. It was set aside: Total Small Business.

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