Photonic integrated circuit packaging service for 8 pics. Includes wore bonding to PCB, fiber alignment and bonding of faus and associated process development and engineering costs.
Ended Purchase Order Awarded Last action
- Contract number
- 80NSSC26P1297
- Awardee
-
Silitronics Solutions Inc. UEI PXA1DLAKG1F7
- Awarding agency
-
Shared Services Center
National Aeronautics and Space Administration
- Obligated
- $59,485
Award facts
- Opportunity
-
- Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. Special Notice · 80NSSC26939631Q · Posted Aug 10, 2026
- Contract value 100% obligated
- $59,484.58 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 813920 Professional Organizations
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- Santa Clara, CA 95051, USA
Award details come from SAM.gov/FPDS.
About this award
The Shared Services Center awarded a purchase order to Silitronics Solutions Inc. for photonic integrated circuit packaging services on August 14, 2026, with a ceiling value of $59,484.58. The order covers wire bonding to PCB, fiber alignment and bonding of fiber array units, and associated process development and engineering for eight PICs, to be completed by October 9, 2026. Performance occurs at the vendor's Santa Clara, California facility, with component pickup and final delivery to NASA Ames Research Center, Building N245, Moffett Field, California. The procurement originated from a NASA/NSSC Special Notice (posted August 10, 2026) conducted under FAR 12.102(a) for commercial items. The statement of work encompasses 17 line items combining recurring wire bonding assembly operations with 100% inspection and active photonic alignment, and non-recurring engineering tasks including process development, FAU fabrication, automated alignment programming, spacer development, and optical assembly reporting with coupling efficiency analysis, estimated at 16–18 weeks from award.
Quick answers
Who was awarded contract 80NSSC26P1297?
80NSSC26P1297 was awarded to Silitronics Solutions Inc. by Shared Services Center (National Aeronautics and Space Administration) on August 14, 2026.
How much is contract 80NSSC26P1297 worth?
The government has obligated $59,485 on 80NSSC26P1297.
Was contract 80NSSC26P1297 competed?
The extent of competition for 80NSSC26P1297 was not competed under sap. The government received 1 offer.
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