Purchase Order 80NSSC26P1297
- Not listed
- NASA's Shared Services Center awarded a purchase order to Applied Nanotools Inc. for $63,707.00 on June 13, 2026, for silicon-based photonics integrated circuits (PICs) for laboratory testing in support of the AstroPIC project, with a firm fixed price and no set-aside. Work is performed at Applied Nanotools' facility in Ottawa, Ontario, Canada. The order covers fabrication of 56 photonic integrated circuit devices using electron-beam write lithography, diced from NASA-provided silicon photonic...
- This is a firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Light Integration Technologies LLC, a minority-owned small disadvantaged business, for the fabrication of 1 run of silicon nitride photonic integrated circuits (PICs) wafers and 5-facet polishing. The total ceiling value of the contract is $25,940.00 with a completion date of June 15, 2024. The contract was awarded on a sole-source basis under the authority of...
- The Shared Services Center, a civilian component of NASA, awarded a purchase order to International Electronic Design Group, Inc., a small disadvantaged business, on September 25, 2025, to manufacture and assemble printed circuit boards for the Armstrong Flight Research Center Simulation Engineering Branch, with a ceiling value of $30,350 under a Total Small Business set-aside and firm fixed-price terms. The work involves fabrication of 8-layer PCBs measuring 9.1 by 5.5 inches with 1-ounce...
- NASA's Shared Services Center issued a purchase order to Sienna Technologies, Inc. for $60,000 on November 18, 2026 for multichip module packages for silicon carbide pressure sensors, with completion due the same date. Work is performed in Mukilteo, Washington. The effort requires fabrication of a specialized multi-chip module incorporating government-furnished silicon carbide sensors onto a custom aluminum nitride circuit board, with precision installation and gold attachment of Au-plated...
- NASA's Shared Services Center issued a purchase order to Avnet Inc. for $120,831.81 on June 5, 2026, for integrated circuits from Infineon required for the FALCON-Lidar Project PMT Detector System electronic builds. The order, a firm fixed-price procurement with no set-aside, calls for three units of Infineon Technology integrated circuit part number CYRS17B512-133UZMB as commercial-off-the-shelf products, with parts limited to 5 years or less in date code age. Work is performed in Phoenix,...
- The NASA Shared Services Center awarded a purchase order to Maple Leaf Photonics LLC, a woman-owned small business, for a Maple Leaf SD-100 Optical Probe Station valued at $99,250.00 on June 16, 2025. The order carries a total small business set-aside. Performance will take place in Bellingham, Washington, with delivery to NASA Langley Research Center in Hampton, Virginia. The probe station includes a motorized fiber optic positioning system, computer-controlled chip positioner with thermal...
- This is a $54,295.38 firm fixed price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Phix B.V., a for-profit vendor based in the Netherlands. The contract is for silicon photonic packaging services and has no set-aside designation. Phix B.V. has received multiple prime contract awards from NASA for packaging and integration services related to photonic integrated circuits and silicon photonic components. This award supports NASA's...
- NASA's Shared Services Center awarded a purchase order to Astral Materials, Inc., a woman-owned small business, for $178,003 on March 7, 2025 to conduct an investigation of microgravity influence on crystal formation and defect density for silicon crystal growth in enhanced semiconductor device manufacturing. Work is performed in Palo Alto, California. The investigation focuses on validating hardware and procedures for potential low-Earth orbit manufacturing through parabolic flight testing,...
- NASA's Shared Services Center issued a purchase order to Sienna Technologies, Inc. on August 26, 2024, for multi-chip module packaging of silicon carbide pressure sensors and electronics, with a ceiling value of $65,500 and completion by December 31, 2026. This is a sole-source firm fixed-price acquisition under FAR 13.106-1(b)(1)(i), with no set-aside designation. Work is performed at Sienna's Mukilteo, Washington facility. The requirement calls for packaging SiC integrated pressure/temperature...
- <p>The Shared Services Center awarded a purchase order to Avnet Inc. on June 8, 2026, for a Falcon-LIDAR PMT detector system and integrated circuits from Renesas Electronics, with a ceiling value of $99,310.40. Work is performed in Phoenix, Arizona, with an ultimate completion date of November 7, 2026. The order is firm fixed price with no set-aside applied.</p>
The Shared Services Center awarded a purchase order to Silitronics Solutions Inc. for photonic integrated circuit packaging services on August 14, 2026, with a ceiling value of $59,484.58. The order covers wire bonding to PCB, fiber alignment and bonding of fiber array units, and associated process development and engineering for eight PICs, to be completed by October 9, 2026. Performance occurs at the vendor's Santa Clara, California facility, with component pickup and final delivery to NASA Ames Research Center, Building N245, Moffett Field, California. The procurement originated from a NASA/NSSC Special Notice (posted August 10, 2026) conducted under FAR 12.102(a) for commercial items. The statement of work encompasses 17 line items combining recurring wire bonding assembly operations with 100% inspection and active photonic alignment, and non-recurring engineering tasks including process development, FAU fabrication, automated alignment programming, spacer development, and optical assembly reporting with coupling efficiency analysis, estimated at 16–18 weeks from award.
Name | Description | Solicitation Number | FederalAgency | Type | PostedDate |
|---|---|---|---|---|---|
Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. | 80NSSC26939631Q | National Aeronautics and Space Administration Shared Services Center | Special Notice 1/1 | 8/10/26, 11:53 AM |
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | Not listed | $59.5k | 8/12/26 |