Automated wire-bonder for packaging high temperature SIC integrated circuits

Ended Purchase Order Awarded Last action

Contract number
80GRC022P0004
Awardee
Awarding agency
Obligated
$254,591

Award facts

Opportunity
Contract value 100% obligated
$254,591.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Set-aside
No set-aside
Competition
Competed under SAP · 2 offers Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Cleveland, OH 44135, USA

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00001 $0
Original award $254,591

About this award

The U.S. National Aeronautics and Space Administration (NASA) Glenn Research Center awarded a $254,591 firm-fixed-price purchase order contract to Hesse Mechatronics, Inc., a for-profit manufacturer of wire-bonders and automation solutions. The contract is for an automated wire-bonder to package high-temperature silicon carbide (SiC) integrated circuits (ICs) for aerospace applications. This contract was not set-aside for any small business category. The contract stems from a sources sought notice NASA issued in October 2021 to determine competition and small business subcontracting goals for this requirement. NASA plans to update information about any future solicitation on SAM.gov, and interested parties are responsible for monitoring the website.

Quick answers

Who was awarded contract 80GRC022P0004?

80GRC022P0004 was awarded to Hesse Mechatronics, Inc. by Glenn Research Center (National Aeronautics and Space Administration) on December 29, 2021.

How much is contract 80GRC022P0004 worth?

The government has obligated $254,591 on 80GRC022P0004.

Was contract 80GRC022P0004 competed?

The extent of competition for 80GRC022P0004 was competed under sap. The government received 2 offers.

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