Other Transaction Agreement HR00111090011

This SBIR Phase I contract, awarded by NASA to small business Voxtel, LLC, is for the development of inkjet-printed additive manufacturing materials and deposition technologies to enable reliable, low-resistance 3D electrical interconnections between integrated circuits, detectors, and other components. The $124,994 award aims to demonstrate the ability to produce high-density conductive nanometal pillars for sub-3 micron pitch 3D interconnects, compatible with wafer-level, chip-level, and...

The U.S. Department of Defense awarded an Other Transaction Agreement to Globalfoundries U.S. 2 LLC on September 30, 2022, with a ceiling value of $412.7 million to support the Trusted Access Programs Office's (TAPO) development of prototype 200-millimeter production capability for gallium nitride on silicon (GaN on Si) technology. GaN on Si represents advanced semiconductor technology with significant potential for defense applications, offering improved power efficiency and thermal performance...

Teledyne Scientific & Imaging, LLC, a subsidiary of Teledyne Technologies Incorporated, was awarded a definitive cost-plus-fixed-fee contract by the Defense Advanced Research Projects Agency (DARPA) on November 9, 2023, with a ceiling value of $17.5 million and an ultimate completion date of July 28, 2028. The MINITHERMS3D program seeks to significantly reduce thermal resistances within three-dimensional heterogeneous integration (3DHI) stacks and external to these systems while...

The Department of the Air Force Materiel Command Aeronautical Systems Center awarded a $2,750,000 cost-plus-fixed-fee Definitive Contract to Global Circuit Innovations Inc., a for-profit semiconductor manufacturing and services company, for DIE EXTRACTION REASSEMBLY services. This contract, awarded on July 5, 2017, is not associated with a set-aside program and has a completion date of September 3, 2019. Global Circuit Innovations has previously provided goods and services such as circuit card...

This federal contract was awarded to Honeywell International Inc. by the Department of Defense (DoD) Missile Defense Agency. The purpose is to review 3D Integrated Circuit (IC) system requirements, perform preliminary and final design tasks to create a new 3D IC device with three or more third-party dies in a new custom package, build test fixtures, and conduct initial device fabrication. The contract has a potential value of $8,718,694.00 and is a Cost Plus Fixed Fee delivery order under the...

This federal contract award to Teledyne Scientific and Imaging LLC, a subsidiary of Teledyne Technologies Incorporated, was issued by the National Institute of Standards and Technology (NIST) for the design and fabrication of integrated circuit kits. The $75,000.00 firm-fixed-price purchase order is for the development of integrated circuits capable of power amplification from 25 GHz up to 650 GHz, as well as other millimeter-wave components like mixers, phase-locked loops, and oscillators. This...

This is a $238,458 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Ozark Integrated Circuits Inc., a small business specializing in custom analog and mixed-signal integrated circuits and microelectronics for extreme environments. The contract is for the packaging and testing of lateral SiC integrated circuits capable of operating at 800°C, which has applications in areas such as space exploration, hypersonic systems, directed energy weapons, and...

This is a firm-fixed price contract awarded by the Department of the Air Force Materiel Command Research Laboratory to Global Circuit Innovations Inc., a small business, under the SBIR Program Phase II. The contract, with a potential value of $749,997.00, is for integrated circuit die extraction and reassembly services. Global Circuit Innovations Inc. is a semiconductor manufacturing and services company that has previously provided goods and services such as circuit card assemblies, power...

This is a $3,784,800.88 definitive federal contract awarded by the Defense Advanced Research Projects Agency (DARPA) to the University of Southern California (USC) to develop tools to revolutionize the design and fabrication of custom integrated circuits for high-performance electronic solutions. The contract, titled "Circuit Realization at Faster Timescales (CRAFT) Program," has an ultimate completion date of February 5, 2020 and was awarded on March 6, 2016 without a set-aside...

NASA's Goddard Space Flight Center awarded EV Group Inc. a $748,800 firm fixed-price contract for a mask aligner system with align-for-bond capabilities for use in the Detector Development Lab (DDL). The system is essential for device fabrication projects, enabling precision alignment, UV light exposure, and substrate bonding critical for advanced detector and sensor fabrication. This contract is not associated with a larger vehicle and has no set-aside designation. EV Group Inc., a for-profit...