Printed circuit BOA

Ended Awarded

Contract number
SPE7M425F1439
Awardee
Awarding agency
Obligated
$13,564

Award facts

Contract value 100% obligated
$13,564.46 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
334412 Bare Printed Circuit Board Manufacturing
PSC
5998 Electrical And Electronic Assemblies, Boards, Cards, And Associated Hardware
Set-aside
No set-aside
Competition
Competed under SAP Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Chatsworth, CA 91311, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

About this award

This federal contract award is for the delivery of printed circuit boards by Hydraulics International, Inc., a small business manufacturer of hydraulic components, systems, and equipment based in Chatsworth, California. The $13,564.46 firm fixed price delivery order was awarded on May 8, 2025 by the Defense Logistics Agency (DLA) Land and Maritime, with an ultimate completion date of October 6, 2025. The contract is not a set-aside. Hydraulics International has established itself as a key supplier of critical hydraulic components for the U.S. Department of Defense, serving as both a prime contractor and subcontractor. The company holds multiple Indefinite Delivery Contracts (IDVs) with DLA Land and Maritime, typically valued at $250,000 each, to provide a range of hydraulic parts and related items in support of military logistics and maintenance requirements.

Quick answers

Who was awarded contract SPE7M425F1439?

SPE7M425F1439 was awarded to Hydraulics International, Inc. by Land and Maritime (Defense Logistics Agency) on May 8, 2025.

How much is contract SPE7M425F1439 worth?

The government has obligated $13,564 on SPE7M425F1439.

Is contract SPE7M425F1439 an order under another contract?

Yes. SPE7M425F1439 is a delivery order under SPE7M524D60HG, an indefinite delivery contract.

Was contract SPE7M425F1439 competed?

The extent of competition for SPE7M425F1439 was competed under sap.

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